Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1:
Signals exceeding GND are clamped by internal diodes. Limit forward-diode current to maximum current rating.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 2)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ............29°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...............2.0°C/W
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V
CC
= +3.0V to +3.6V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC
= +3.3V and T
A
= +25°C.) (Note 3)
PARAMETER
POWER SUPPLY
Supply Voltage
Quiescent Supply Current
ANALOG SWITCH
On-Resistance
On-Resistance Match
On-Resistance Match Between
Channels
Leakage Current COM_, D_ _0,
D_ _1
SWITCH AC PERFORMANCE (Note 4)
Crosstalk
Off-Isolation
Bandwidth -3dB
On-Capacitance
Off-Capacitance
Propagation Delay
Turn-On Time
V
DCT1
V
OFF
BW
C
ON
C
OFF
t
PD
t
ON
Any switch to non-paired switch at 500MHz
(Figure 3)
Any switch to non-paired switch at 240MHz
(Figure 3)
R
L
= 45Ω unbalanced (Figure 3)
f = 1MHz
Taken from S11 parameters at f = 240MHz
f = 1MHz, COM_
Taken from S11 parameters at f = 240MHz
R
L
= R
S
= 50Ω (Figure 2)
V
D_ _0
or V
D_ _1
= +1.5V, R
L
= 300Ω,
C
L
= 35pF, V
IH
= V
CC
, V
IL
= 0V (Figure 1)
-30
-27
1200
6
3.0
5
3.0
300
10
dB
dB
MHz
pF
pF
ps
µs
R
ON
ΔR
ONSC
ΔR
ONBC
I
L
I
COM_
= ±10mA
V
COM_
= 1V, T
A
= +25°C
V
COM_
= 1V, T
A
= +25°C
V
CC
= +3.6V
-1
6.5
12
0.8
1
+1
Ω
Ω
Ω
µA
V
CC
I
O
Charge pump on
Charge pump off
3.0
3.6
5
1
V
µA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
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Maxim Integrated | 2
MAX4999
USB 2.0 Hi-Speed Differential
8:1 Multiplexer
Electrical Characteristics (continued)
(V
CC
= +3.0V to +3.6V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC
= +3.3V and T
A
= +25°C.) (Note 3)
PARAMETER
Turn-Off Time
SYMBOL
t
OFF
CONDITIONS
V
D_ _0
or V
D_ _1
= +1.5V, R
L
= 300Ω, C
L
=
35pF, V
IH
= V
CC
, V
IL
= 0V (Figure 1)
Skew between any D_ _0, D_ _1 line, same
port 45Ω unbalanced I/O, f = 240MHz
(Figure 2)
MIN
TYP
10
MAX
UNITS
µs
Output Skew Same Port
SWITCH LOGIC
Input Logic Low
Input Logic High
Input Logic Hysteresis
Input Leakage Current
ESD PROTECTION
All Pins
t
PD
30
ps
V
IL
V
IH
V
HYST
I
LEAK
V
CC
= +3.0V
V
CC
= +3.6V
V
CC
= +3.6V, V
COM_
= 0V or V
CC
Human Body Model
1.7
200
-1
±2
0.6
V
V
mV
+1
µA
kV
Note 3:
All units are 100% production tested at T
A
= +85°C. Limits over the operating temperature range are guaranteed by design
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