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MAX5889EGK-TD

Digital to Analog Converters - DAC

器件类别:模拟混合信号IC    转换器   

厂商名称:Maxim(美信半导体)

厂商官网:https://www.maximintegrated.com/en.html

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Maxim(美信半导体)
零件包装代码
QFN
包装说明
10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68
针数
68
Reach Compliance Code
not_compliant
最大模拟输出电压
1.1 V
最小模拟输出电压
-1 V
转换器类型
D/A CONVERTER
输入位码
OFFSET BINARY
输入格式
PARALLEL, WORD
JESD-30 代码
S-XQCC-N68
JESD-609代码
e0
长度
10 mm
位数
12
功能数量
1
端子数量
68
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
UNSPECIFIED
封装代码
HVQCCN
封装等效代码
LCC68,.4SQ,20
封装形状
SQUARE
封装形式
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
1.8,3.3 V
认证状态
Not Qualified
座面最大高度
0.9 mm
最大稳定时间
0.011 µs
标称安定时间 (tstl)
0.011 µs
标称供电电压
1.8 V
表面贴装
YES
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
NO LEAD
端子节距
0.5 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
10 mm
文档预览
19-3620; Rev 1; 3/07
KIT
ATION
EVALU
E
BL
AVAILA
12-Bit, 600Msps, High-Dynamic-Performance
DAC with LVDS Inputs
General Description
The MAX5889 advanced 12-bit, 600Msps, digital-to-
analog converter (DAC) meets the demanding perfor-
mance requirements of signal synthesis applications
found in wireless base stations and other communica-
tions applications. Operating from 3.3V and 1.8V sup-
plies, the MAX5889 DAC supports update rates of
600Msps using high-speed LVDS inputs while consum-
ing only 292mW of power and offers exceptional
dynamic performance such as 79dBc spurious-free
dynamic range (SFDR) at f
OUT
= 30MHz.
The MAX5889 utilizes a current-steering architecture that
supports a 2mA to 20mA full-scale output current range,
and produces -2dBm to -22dBm full-scale output signal
levels with a double-terminated 50Ω load. The MAX5889
features an integrated 1.2V bandgap reference and con-
trol amplifier to ensure high-accuracy and low-noise per-
formance. A separate reference input (REFIO) allows for
the use of an external reference source for optimum flexi-
bility and improved gain accuracy.
The MAX5889 digital inputs accept LVDS voltage lev-
els, and the flexible clock input can be driven differen-
tially or single-ended, AC- or DC-coupled. The
MAX5889 is available in a 68-pin QFN package with an
exposed paddle (EP) and is specified for the extended
(-40°C to +85°C) temperature range.
Refer to the MAX5891 and MAX5890 data sheets for pin-
compatible 16-bit and 14-bit versions of the MAX5889.
600Msps Output Update Rate
Low-Noise Spectral Density: -157dBFS/Hz at
f
OUT
= 36MHz
Excellent SFDR and IMD Performance
SFDR = 79dBc at f
OUT
= 30MHz (to Nyquist)
SFDR = 67dBc at f
OUT
= 130MHz (to Nyquist)
IMD = -95dBc at f
OUT
= 30MHz
IMD = -70dBc at f
OUT
= 130MHz
ACLR = 72dB at f
OUT
= 122.88MHz
2mA to 20mA Full-Scale Output Current
LVDS-Compatible Digital Inputs
On-Chip 1.2V Bandgap Reference
Low 292mW Power Dissipation at 600Msps
Compact (10mm x 10mm) QFN-EP Package
Evaluation Kit Available (MAX5891EVKIT)
Features
MAX5889
Ordering Information
PART
MAX5889EGK-D
MAX5889EGK+D
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
PIN-
PACKAGE
68 QFN-EP*
68 QFN-EP*
PKG
CODE
G6800-4
G6800-4
Applications
Base Stations: Single-Carrier UMTS,
CDMA, GSM
Communications: Fixed Broadband Wireless
Access, Point-to-Point Microwave
Direct Digital Synthesis (DDS)
Cable Modem Termination Systems (CMTS)
Automated Test Equipment (ATE)
Instrumentation
*EP
= Exposed paddle.
D = Dry pack.
+Denotes
lead-free package.
Functional Diagram
MAX5889
OUTP
D0–D11
LVDS DATA
INPUTS
LVDS
RECEIVER
LATCH
600MHz
12-BIT DAC
OUTN
Selector Guide
PART
MAX5889
MAX5890
MAX5891
RESOLUTION
(BITS)
12
14
16
UPDATE RATE
LOGIC INPUT
(Msps)
600
600
600
LVDS
LVDS
LVDS
CLKP
CLKN
CLK
INTERFACE
DACREF
1.2V
REFERENCE
REFIO
FSADJ
POWER
DOWN
PD
Pin Configuration appears at end of data sheet.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
12-Bit, 600Msps, High-Dynamic-Performance
DAC with LVDS Inputs
MAX5889
ABSOLUTE MAXIMUM RATINGS
AV
DD1.8
, DV
DD1.8
to AGND, DGND, DACREF,
and CGND.......................................................-0.3V to +2.16V
AV
DD3.3
, DV
DD3.3
, AV
CLK
to AGND, DGND,
DACREF, and CGND.........................................-0.3V to +3.9V
REFIO, FSADJ to AGND, DACREF,
DGND, and CGND ..........................-0.3V to (AV
DD3.3
+ 0.3V)
OUTP, OUTN to AGND, DGND, DACREF,
and CGND .......................................-1.2V to (AV
DD3.3
+ 0.3V)
CLKP, CLKN to AGND, DGND, DACREF,
and CGND..........................................-0.3V to (AV
CLK
+ 0.3V)
PD to AGND, DGND, DACREF,
and CGND.......................................-0.3V to (DV
DD3.3
+ 0.3V)
Digital Data Inputs (D0N–D11N, D0P–D11P) to AGND,
DGND, DACREF, and CGND ..........-0.3V to (DV
DD1.8
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C) (Note 1)
68-Pin QFN-EP (derate 28.6mW/°C above +70°C)....3333mW
Thermal Resistance
θ
JA
(Note 1) ....................................24°C/W
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................-60°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
Note 1:
Thermal resistance based on a multilayer board with 4 x 4 via array in exposed paddle area.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= 3.3V, AV
DD1.8
= DV
DD1.8
= 1.8V, external reference V
REFIO
= 1.2V, output load 50Ω double-terminat-
ed, transformer-coupled output, I
OUT
= 20mA, T
A
= -40°C to +85°C, unless otherwise noted. Specifications at T
A
+25°C are guar-
anteed by production testing. Specifications at T
A
< +25°C are guaranteed by design and characterization. Typical values are at T
A
= +25°C.)
PARAMETER
STATIC PERFORMANCE
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Full-Scale Gain Error
Gain-Drift Tempco
Full-Scale Output Current
Output Compliance
Output Resistance
Output Capacitance
Output Leakage Current
DYNAMIC PERFORMANCE
Maximum DAC Update Rate
Minimum DAC Update Rate
f
CLK
= 500MHz,
-12dBFS, 20MHz
offset from the
carrier
f
OUT
= 36MHz,
A
FULL-SCALE
= -3.5dBm
f
OUT
= 151MHz,
A
FULL-SCALE
= -6.4dBm
600
1
-157
dBFS/Hz
-152
Msps
Msps
R
OUT
C
OUT
PD = high, power-down mode
I
OUT
Single-ended
INL
DNL
OS
GE
FS
External reference
Internal reference
External reference
2
-1.0
1
5
±1
Measured differentially
Measured differentially
-0.02
-4
12
±0.25
±0.15
0.001
±1
±130
±100
20
+1.1
+0.02
+4
Bits
LSB
LSB
%FS
%FS
ppm/°C
mA
V
MΩ
pF
µA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Noise Spectral Density
N
2
_______________________________________________________________________________________
12-Bit, 600Msps, High-Dynamic-Performance
DAC with LVDS Inputs
ELECTRICAL CHARACTERISTICS (continued)
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= 3.3V, AV
DD1.8
= DV
DD1.8
= 1.8V, external reference V
REFIO
= 1.2V, output load 50Ω double-terminat-
ed, transformer-coupled output, I
OUT
= 20mA, T
A
= -40°C to +85°C, unless otherwise noted. Specifications at T
A
+25°C are guar-
anteed by production testing. Specifications at T
A
< +25°C are guaranteed by design and characterization. Typical values are at T
A
= +25°C.)
PARAMETER
SYMBOL
CONDITIONS
f
CLK
= 200MHz,
0dBFS
Spurious-Free
Dynamic Range to
Nyquist
f
CLK
= 200MHz,
-12dBFS
SFDR
f
CLK
= 500MHz,
0dBFS
f
OUT
= 16MHz
f
OUT
= 30MHz
f
OUT
= 16MHz
f
OUT
= 30MHz
f
OUT
= 16MHz
f
OUT
= 30MHz
f
OUT
= 130MHz
f
OUT
= 200MHz
f
CLK
= 500MHz
Two-Tone IMD
TTIMD
f
CLK
= 500MHz
f
OUT1
= 29MHz,
f
OUT2
= 30MHz,
-6.5dBFS per tone
f
OUT1
= 129MHz,
f
OUT2
= 130MHz,
-6.5dBFS per tone
f
CLK
= 491.52MHz,
f
OUT
= 30.72MHz
f
CLK
= 491.52MHz,
f
OUT
= 122.88MHz
f
CLK
= 491.52MHz,
f
OUT
= 30.72MHz
f
CLK
= 491.52MHz,
f
OUT
= 122.88MHz
Output Bandwidth
REFERENCE
Internal Reference Voltage Range
Reference Input Voltage Range
Reference Input Resistance
Reference Voltage Temperature
Drift
Output Fall Time
Output Rise Time
Output Propagation Delay
Output Settling Time
V
REFIO
V
REFIOCR
R
REFIO
TCO
REF
Using external reference
1.14
0.10
1.2
1.2
10
±30
1.26
1.32
V
V
kΩ
ppm/°C
BW
-1dB
(Note 2)
76
MIN
TYP
88
85
78
77
81
80
71
54
-95
dBc
-70
dBc
MAX
UNITS
MAX5889
80
72
dB
72
67
1000
MHz
WCDMA single
carrier
Adjacent Channel
Leakage Power Ratio
ACLR
WCDMA four carriers
ANALOG OUTPUT TIMING (Figure 3)
t
FALL
t
RISE
t
PD
90% to 10% (Note 3)
10% to 90% (Note 3)
Reference to data latency (Note 3)
To 0.025% of the final value (Note 3)
0.4
0.4
2.5
11
ns
ns
ns
ns
_______________________________________________________________________________________
3
12-Bit, 600Msps, High-Dynamic-Performance
DAC with LVDS Inputs
MAX5889
ELECTRICAL CHARACTERISTICS (continued)
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= 3.3V, AV
DD1.8
= DV
DD1.8
= 1.8V, external reference V
REFIO
= 1.2V, output load 50Ω double-terminat-
ed, transformer-coupled output, I
OUT
= 20mA, T
A
= -40°C to +85°C, unless otherwise noted. Specifications at T
A
+25°C are guar-
anteed by production testing. Specifications at T
A
< +25°C are guaranteed by design and characterization. Typical values are at T
A
= +25°C.)
PARAMETER
Glitch Impulse
Output Noise
TIMING CHARACTERISTICS
Input Data Rate
Data Latency
Data to Clock Setup Time
Data to Clock Hold Time
Clock Frequency
Minimum Clock Pulse-Width High
Minimum Clock Pulse-Width Low
Turn-On Time
CMOS LOGIC INPUT (PD)
Input Logic High
Input Logic Low
Input Current
Input Capacitance
LVDS INPUTS
Differential Input High
Differential Input Low
Internal Common-Mode Bias
Differential Input Resistance
Common-Mode Input Resistance
Input Capacitance
Clock Common-Mode Voltage
Minimum Differential Input
Voltage Swing
Minimum Common-Mode Voltage
Maximum Common-Mode
Voltage
V
IHLVDS
V
ILLVDS
V
ICMLVDS
R
IDLVDS
R
ICMLVDS
C
INLVDS
CLKP and CLKN are internally biased
(Notes 6, 7, 8)
(Notes 6, 7, 8)
+100
-1000
1.125
110
3.2
3
AV
CLK
/ 2
0.5
1
1.9
+1000
-100
1.375
mV
mV
V
kΩ
pF
V
V
P-P
V
V
V
IH
V
IL
I
IN
C
IN
-10
±1.8
3
0.7 x
DV
DD3.3
0.3 x
DV
DD3.3
+10
V
V
µA
pF
t
SETUP
t
HOLD
f
CLK
t
CH
t
CL
t
SHDN
Referenced to rising edge of clock (Note 4)
Referenced to rising edge of clock (Note 4)
CLKP, CLKN
CLKP, CLKN
CLKP, CLKN
External reference, PD falling edge to
output settle within 1%
0.6
0.6
350
-1.5
2.6
600
5.5
600
MWps
Clock
cycles
ns
ns
MHz
ns
ns
µs
N
OUT
SYMBOL
I
OUT
= 2mA
I
OUT
= 20mA
CONDITIONS
Measured differentially
MIN
TYP
1
30
30
MAX
UNITS
pV
s
pA/√Hz
DIFFERENTIAL CLOCK INPUTS (CLKP, CLKN)
4
_______________________________________________________________________________________
12-Bit, 600Msps, High-Dynamic-Performance
DAC with LVDS Inputs
ELECTRICAL CHARACTERISTICS (continued)
(AV
DD3.3
= DV
DD3.3
= AV
CLK
= 3.3V, AV
DD1.8
= DV
DD1.8
= 1.8V, external reference V
REFIO
= 1.2V, output load 50Ω double-terminat-
ed, transformer-coupled output, I
OUT
= 20mA, T
A
= -40°C to +85°C, unless otherwise noted. Specifications at T
A
+25°C are guar-
anteed by production testing. Specifications at T
A
< +25°C are guaranteed by design and characterization. Typical values are at T
A
= +25°C.)
PARAMETER
Input Resistance
Input Capacitance
POWER SUPPLIES
Analog Supply Voltage Range
Clock Supply Voltage Range
Digital Supply Voltage Range
AV
DD3.3
AV
DD1.8
AV
CLK
DV
DD3.3
DV
DD1.8
f
CLK
= 100MHz, f
OUT
= 16MHz
I
AVDD3.3
Analog Supply Current
I
AVDD1.8
f
CLK
= 500MHz, f
OUT
= 16MHz
f
CLK
= 600MHz, f
OUT
= 16MHz
f
CLK
= 100MHz, f
OUT
= 16MHz
f
CLK
= 500MHz, f
OUT
= 16MHz
f
CLK
= 600MHz, f
OUT
= 16MHz
f
CLK
= 100MHz, f
OUT
= 16MHz
Clock Supply Current
I
AVCLK
f
CLK
= 500MHz, f
OUT
= 16MHz
f
CLK
= 600MHz, f
OUT
= 16MHz
f
CLK
= 100MHz, f
OUT
= 16MHz
I
DVDD3.3
Digital Supply Current
I
DVDD1.8
f
CLK
= 500MHz, f
OUT
= 16MHz
f
CLK
= 600MHz, f
OUT
= 16MHz
f
CLK
= 100MHz, f
OUT
= 16MHz
f
CLK
= 500MHz, f
OUT
= 16MHz
f
CLK
= 600MHz, f
OUT
= 16MHz
f
CLK
= 100MHz, f
OUT
= 16MHz
f
CLK
= 500MHz, f
OUT
= 16MHz
Total Power Dissipation
P
DISS
f
CLK
= 600MHz, f
OUT
= 16MHz
Power-down, clock static low,
data input static
Power-Supply Rejection Ratio
PSRR
(Note 5)
3.135
1.710
3.135
3.135
1.710
3.3
1.8
3.3
3.3
1.8
26.5
26.5
26.5
11.3
50
60
2.8
2.8
2.8
0.2
0.2
0.2
10.2
42
48
137
263
292
13
±0.025
µW
%FS
297
mW
48
0.5
mA
3.6
mA
58
28.5
mA
3.465
1.890
3.465
3.465
1.890
V
V
V
SYMBOL
R
CLK
C
CLK
Single-ended
CONDITIONS
MIN
TYP
5
3
MAX
UNITS
kΩ
pF
MAX5889
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Note 7:
V
D_N
This parameter does not include update-rate-dependent effects of sin(x)/x filtering inherent in the MAX5889.
Parameter measured single-ended with 50Ω double-terminated outputs.
Not production tested. Guaranteed by design.
Parameter defined as the change in midscale output caused by a
±5%
variation in the nominal supply voltages.
Not production tested. Guaranteed by design.
Differential input voltage defined as V
D_P
- V
D_N
.
V
IHLVDS
V
D_P
V
ILLVDS
Note 8:
Combination of logic-high/-low and common-mode voltages must not exceed absolute maximum rating for D_P/D_N inputs.
_______________________________________________________________________________________
5
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参数对比
与MAX5889EGK-TD相近的元器件有:MAX5889EGK-D、MAX5889EVKIT#。描述及对比如下:
型号 MAX5889EGK-TD MAX5889EGK-D MAX5889EVKIT#
描述 Digital to Analog Converters - DAC Digital to Analog Converters - DAC KIT EVALUATION FOR MAX5889
位数 12 12 12
是否Rohs认证 不符合 不符合 -
厂商名称 Maxim(美信半导体) Maxim(美信半导体) -
零件包装代码 QFN QFN -
包装说明 10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68 10 X 10 MM, 0.90 MM HEIGHT, MO-220, QFN-68 -
针数 68 68 -
Reach Compliance Code not_compliant not_compliant -
最大模拟输出电压 1.1 V 1.1 V -
最小模拟输出电压 -1 V -1 V -
转换器类型 D/A CONVERTER D/A CONVERTER -
输入位码 OFFSET BINARY OFFSET BINARY -
输入格式 PARALLEL, WORD PARALLEL, WORD -
JESD-30 代码 S-XQCC-N68 S-XQCC-N68 -
JESD-609代码 e0 e0 -
长度 10 mm 10 mm -
功能数量 1 1 -
端子数量 68 68 -
最高工作温度 85 °C 85 °C -
最低工作温度 -40 °C -40 °C -
封装主体材料 UNSPECIFIED UNSPECIFIED -
封装代码 HVQCCN HVQCCN -
封装等效代码 LCC68,.4SQ,20 LCC68,.4SQ,20 -
封装形状 SQUARE SQUARE -
封装形式 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE -
峰值回流温度(摄氏度) NOT SPECIFIED 245 -
电源 1.8,3.3 V 1.8,3.3 V -
认证状态 Not Qualified Not Qualified -
座面最大高度 0.9 mm 0.9 mm -
最大稳定时间 0.011 µs 0.011 µs -
标称安定时间 (tstl) 0.011 µs 0.011 µs -
标称供电电压 1.8 V 1.8 V -
表面贴装 YES YES -
温度等级 INDUSTRIAL INDUSTRIAL -
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
端子形式 NO LEAD NO LEAD -
端子节距 0.5 mm 0.5 mm -
端子位置 QUAD QUAD -
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED -
宽度 10 mm 10 mm -
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00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
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