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MAX9761EUI-T

Audio Amplifier, 3W, 2 Channel(s), 1 Func, BICMOS, PDSO28, 4.40 MM, MO-153AET, TSSOP-28

器件类别:模拟混合信号IC    消费电路   

厂商名称:Maxim(美信半导体)

厂商官网:https://www.maximintegrated.com/en.html

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Maxim(美信半导体)
零件包装代码
TSSOP
包装说明
HTSSOP,
针数
28
Reach Compliance Code
compliant
ECCN代码
EAR99
标称带宽
22 kHz
商用集成电路类型
AUDIO AMPLIFIER
JESD-30 代码
R-PDSO-G28
JESD-609代码
e0
长度
9.7 mm
湿度敏感等级
1
信道数量
2
功能数量
1
端子数量
28
最高工作温度
85 °C
最低工作温度
-40 °C
标称输出功率
3 W
封装主体材料
PLASTIC/EPOXY
封装代码
HTSSOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
245
认证状态
Not Qualified
座面最大高度
1.1 mm
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
表面贴装
YES
技术
BICMOS
温度等级
INDUSTRIAL
端子面层
TIN LEAD
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
4.4 mm
文档预览
19-2744; Rev 0; 1/03
Stereo 3W Audio Power Amplifiers with
Headphone Drive and Input Mux
General Description
The MAX9760–MAX9763 family combines a stereo or
mono 3W bridge-tied load (BTL) audio power amplifier,
stereo single-ended headphone amplifier, headphone
sensing, and a 2:1 input multiplexer all in a tiny 28-pin
thin QFN package. These devices operate from a sin-
gle 4.5V to 5.5V supply and feature an industry-leading
100dB PSRR, allowing these devices to operate from
noisy supplies without the addition of a linear regulator.
An ultra-low 0.002% THD+N ensures clean, low-distor-
tion amplification of the audio signal. Patented click-
and-pop suppression eliminates audible transients on
power and shutdown cycles. Power-saving features
include low 4mV V
OS
(minimizes DC current drain
through the speakers), low 13mA supply current, and a
10µA shutdown mode. A MUTE function allows the out-
puts to be quickly enabled or disabled.
A headphone sense input detects the presence of a
headphone jack and automatically configures the
amplifiers for either speaker or headphone mode. In
speaker mode, the amplifiers can deliver up to 3W of
continuous average power into a 3Ω load. In head-
phone mode, the amplifier can deliver up to 200mW of
continuous average power into a 16Ω load. The gain of
the amplifiers is externally set, allowing maximum flexi-
bility in optimizing output levels for a given load. The
amplifiers also feature a 2:1 input multiplexer, allowing
multiple audio sources to be selected. The multiplexer
can also be used to compensate for limitations in the
frequency response of the loud speakers by selecting
an external equalizer network. The various functions are
controlled by either an I
2
C-compatible or simple parallel
control interface.
The MAX9760–MAX9763 are available in either a ther-
mally efficient 28-pin thin QFN package (5mm
5mm
0.8mm) or a TSSOP-EP package. All devices have ther-
mal overload protection (OVP) and are specified over
the extended -40°C to +85°C temperature range.
o
PC99/01 Compliant
o
3W BTL Stereo Speaker Amplifier
o
200mW Stereo Headphone Amplifier
o
Low 0.002% THD+N
o
Patented Click-and-Pop Suppression
o
ESD-Protected Outputs
o
Low Quiescent Current: 13mA
o
Low-Power Shutdown Mode: 10µA
o
MUTE Function
o
Headphone Sense Input
o
Stereo 2:1 Input Multiplexer
o
Optional 2-Wire, I
2
C-Compatible or Parallel
Interface
o
Tiny 28-Pin Thin QFN (5mm
5mm
0.8mm) and
TSSOP-EP Packages
Features
o
Industry-Leading, Ultra-High 100dB PSRR
MAX9760–MAX9763
Ordering Information
PART
MAX9760ETI
MAX9760EUI
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
28 Thin QFN-EP*
28 TSSOP-EP*
*EP = Exposed paddle.
Ordering Information continued at end of data sheet.
Simplified Block Diagram
SINGLE SUPPLY
4.5V TO 5.5V
Applications
Notebooks
Portable DVD Players
Tablet PCs
PC Audio Peripherals
Camcorders
LEFT IN
1
LEFT IN
2
SE/
BTL
RIGHT IN
1
RIGHT IN
2
CONTROL
I
2
C-
COMPATIBLE
Pin Configurations and Functional Diagrams appear at end
of data sheet.
MAX9760
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Stereo 3W Audio Power Amplifiers with
Headphone Drive and Input Mux
MAX9760–MAX9763
ABSOLUTE MAXIMUM RATINGS
V
DD
to GND ...........................................................................+6V
SV
DD
to GND .........................................................................+6V
SV
DD
to V
DD
.........................................................................-0.3V
PV
DD
to V
DD
.......................................................................±0.3V
PGND to GND.....................................................................±0.3V
All Other Pins to GND.................................-0.3V to (V
DD
+ 0.3V)
Continuous Input Current (into any pin except power-supply
and output pins) ...............................................................±20mA
Continuous Power Dissipation
28-Pin Thin QFN (derate 20.8mW/°C above +70°C) ....1667mW
28-Pin TSSOP-EP (derate 23.8mW/°C above +70°C) ..1905mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
DD
= PV
DD
= 5.0V, GND = PGND = 0V,
SHDN
= 5V, C
BIAS
= 1µF, R
IN
= R
F
= 15kΩ, R
L
=
∞.
T
A
= T
MIN
to T
MAX
, unless otherwise
noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Supply Voltage Range
Quiescent Supply Current
(I
VDD
+ I
PVDD
)
Shutdown Current
Switching Time
Turn-On Time
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
OUTPUT AMPLIFIERS (SPEAKER MODE, HPS = GND)
Output Offset Voltage
V
OS
OUT_+ - OUT_-, A
V
= 1V/V
V
DD
= 4.5V to 5.5V
Power-Supply Rejection Ratio
PSRR
(Note 2)
f = 1kHz, V
RIPPLE
=
200mV
P-P
f = 20kHz, V
RIPPLE
=
200mV
P-P
Output Power
Total Harmonic Distortion Plus
Noise
Signal-to-Noise Ratio
Slew Rate
Maximum Capacitive Load Drive
Crosstalk
P
OUT
f
IN
= 1kHz,
THD+N < 1%,
T
A
= +25°C
f
IN
= 1kHz, BW =
22Hz to 22kHz
R
L
= 8Ω
R
L
= 4Ω
R
L
= 3Ω
P
OUT
= 1W, R
L
= 8Ω
P
OUT
= 2W, R
L
= 4Ω
1
75
±4
100
82
70
1.4
2.6
3
0.005
0.01
95
1.6
No sustained oscillations
f
IN
= 10kHz
1
73
%
dB
V/µs
nF
dB
W
dB
±32
mV
SYMBOL
V
DD
/PV
DD
I
DD
I
SHDN
t
SW
t
ON
BTL mode,
HPS = 0V
SHDN
= GND
Gain or input switching
C
BIAS
= 1µF
C
BIAS
= 0.1µF
CONDITIONS
Inferred from PSRR test
MAX9760/MAX9761
MAX9762/MAX9763
MIN
4.5
13
7
7
10
10
300
30
160
15
TYP
MAX
5.5
32
18
18
50
µA
µs
ms
o
o
UNITS
V
mA
Single-ended mode, HPS = V
DD
C
C
THD+N
SNR
SR
C
L
R
L
= 8Ω, P
OUT
= 1W, BW = 22Hz to 22kHz
2
_______________________________________________________________________________________
Stereo 3W Audio Power Amplifiers with
Headphone Drive and Input Mux
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= PV
DD
= 5.0V, GND = PGND = 0V,
SHDN
= 5V, C
BIAS
= 1µF, R
IN
= R
F
= 15kΩ, R
L
=
∞.
T
A
= T
MIN
to T
MAX
, unless otherwise
noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
V
DD
= 4.5V to 5.5V
Power-Supply Rejection Ratio
PSRR
(Note 2)
f = 1kHz, V
RIPPLE
=
200mV
P-P
f = 20kHz, V
RIPPLE
=
200mV
P-P
Output Power
P
OUT
f
IN
= 1kHz, THD+N < R
L
= 32Ω
1%, T
A
= +25°C
R
L
= 16Ω
f
IN
= 1kHz, BW =
22Hz to 22kHz
P
OUT
= 60mW,
R
L
= 32Ω
P
OUT
= 125mW,
R
L
= 16Ω
120
MIN
75
TYP
106
88
76
88
200
0.002
%
0.002
92
1.8
No sustained oscillations
f
IN
= 10kHz
V
BIAS
= 1.25V, V
DD
= 0V
V
BIAS
= 2.5V, V
DD
= 5V
2.35
2.5
50
2
0.8
±1
0.9 x
V
DD
0.7 x
V
DD
±1
2
78
425
750
15
2.65
dB
V/µs
nF
dB
mW
dB
MAX
UNITS
MAX9760–MAX9763
OUTPUT AMPLIFIERS (HEADPHONE MODE, HPS = V
DD
)
Total Harmonic Distortion Plus
Noise
THD+N
Signal-to-Noise Ratio
Slew Rate
Maximum Capacitive Load Drive
Crosstalk
STANDBY SUPPLY (SV
DD
)
(Note 3)
SV
DD
Current
BIAS VOLTAGE (BIAS)
BIAS Voltage
Output Resistance
Input Voltage High
Input Voltage Low
Input Leakage Current
HEADPHONE SENSE INPUT (HPS)
Input Voltage High
Input Voltage Low
Input Leakage Current
SNR
SR
C
L
R
L
= 32Ω, BW = 22Hz to 22kHz,
V
OUT
= 1V
RMS
I
SVDD
µA
V
BIAS
R
BIAS
V
IH
V
IL
I
IN
V
kΩ
V
V
µA
1
DIGITAL INPUTS (MUTE,
SHDN,
HPS_EN, GAINA/B, IN1/2)
V
IH
V
IL
I
IN
V
V
µA
_______________________________________________________________________________________
3
Stereo 3W Audio Power Amplifiers with
Headphone Drive and Input Mux
MAX9760–MAX9763
ELECTRICAL CHARACTERISTICS (continued)
(V
DD
= PV
DD
= 5.0V, GND = PGND = 0V,
SHDN
= 5V, C
BIAS
= 1µF, R
IN
= R
F
= 15kΩ, R
L
=
∞.
T
A
= T
MIN
to T
MAX
, unless otherwise
noted. Typical values are at T
A
= +25°C.) (Note 1)
PARAMETER
Input Voltage High
Input Voltage Low
Input Hysteresis
Input High Leakage Current
Input Low Leakage Current
Input Capacitance
Output Voltage Low
Output Current High
Serial Clock Frequency
Bus Free Time Between STOP
and START Conditions
START Condition Hold Time
START Condition Setup Time
Clock Period Low
Clock Period High
Data Setup Time
Data Hold Time
Receive SCL/SDA Rise Time
Receive SCL/SDA Fall Time
Transmit SDA Fall Time
Pulse Width of Suppressed
Spike
I
IH
I
IL
C
IN
V
OL
I
OH
f
SCL
t
BUF
t
HD:STA
t
SU:STA
t
LOW
t
HIGH
t
SU:DAT
t
HD:DAT
t
r
t
f
t
f
t
SP
(Note 4)
(Note 5)
(Note 5)
(Note 5)
(Note 6)
1.3
0.6
0.6
1.3
0.6
100
0
20 +
0.1C
B
20 +
0.1C
B
20 +
0.1C
B
50
0.9
300
300
250
I
OL
= 3mA
V
OH
= 5V
V
IN
= 5V
V
IN
= 0V
10
0.4
1
400
SYMBOL
V
IH
V
IL
0.2
±1
±1
CONDITIONS
MIN
2.6
0.8
TYP
MAX
UNITS
V
V
V
µA
µA
pF
V
µA
kHz
µs
µs
µs
µs
µs
ns
µs
ns
ns
ns
ns
2-WIRE SERIAL INTERFACE (SCL, SDA, ADD,
INT)
(MAX9760/MAX9762)
TIMING CHARACTERISTICS (MAX9760/MAX9762)
Note 1:
Note 2:
Note 3:
Note 4:
All devices are 100% production tested at +25°C. All temperature limits are guaranteed by design.
PSRR is specified with the amplifier inputs connected to GND through R
IN
and C
IN
.
Refer to the SV
DD
section.
A master device must provide a hold time of at least 300ns for the SDA signal to bridge the undefined region of SCL’s falling
edge.
Note 5:
C
B
= total capacitance of one of the bus lines in picofarads. Device tested with C
B
= 400pF. 1kΩ pullup resistors connected
from SDA/SCL to V
DD
.
Note 6:
Input filters on SDA, SCL, and ADD suppress noise spikes of less than 50ns.
4
_______________________________________________________________________________________
Stereo 3W Audio Power Amplifiers with
Headphone Drive and Input Mux
Typical Operating Characteristics
(V
DD
= PV
DD
= 5V, T
A
= +25°C, unless otherwise noted.)
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY (SPEAKER MODE)
MAX9760 toc01
MAX9760–MAX9763
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY (SPEAKER MODE)
MAX9760 toc02
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY (SPEAKER MODE)
R
L
= 4Ω
A
V
= 2V/V
MAX9760 toc03
1
R
L
= 3Ω
A
V
= 2V/V
0.1
THD+N (%)
1
R
L
= 3Ω
A
V
= 4V/V
1
0.1
THD+N (%)
P
OUT
= 500mW
P
OUT
= 1W
P
OUT
= 500mW P
OUT
= 1W
THD+N (%)
0.1
P
OUT
= 250mW P
OUT
= 500mW
0.01
P
OUT
= 2W
P
OUT
= 2.5W
P
OUT
= 1W
0.001
10
100
1k
FREQUENCY (Hz)
10k
100k
10
100
1k
FREQUENCY (Hz)
10k
100k
P
OUT
= 2W
0.01
P
OUT
= 2W
P
OUT
= 2.5W
0.01
0.001
10
100
1k
FREQUENCY (Hz)
10k
100k
0.001
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY (SPEAKER MODE)
MAX9760 toc04
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY (SPEAKER MODE)
MAX9760 toc05
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY (SPEAKER MODE)
R
L
= 8Ω
A
V
= 4V/V
MAX9760 toc06
1
R
L
= 4Ω
A
V
= 4V/V
1
R
L
= 8Ω
A
V
= 2V/V
1
0.1
THD+N (%)
THD+N (%)
P
OUT
= 250mW P
OUT
= 500mW
0.1
THD+N (%)
0.1
P
OUT
= 250mW
0.01
P
OUT
= 1.2W
P
OUT
= 500mW
P
OUT
= 250mW P
OUT
= 500mW
0.01
0.01
P
OUT
= 1W
0.001
10
100
1k
FREQUENCY (Hz)
10k
100k
P
OUT
= 2W
P
OUT
= 1W P
OUT
= 1.2W
0.001
10
100
1k
FREQUENCY (Hz)
10k
100k
0.001
10
P
OUT
= 1W
100
1k
FREQUENCY (Hz)
10k
100k
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. OUTPUT POWER (SPEAKER MODE)
MAX9760 toc07
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. OUTPUT POWER (SPEAKER MODE)
MAX9760 toc08
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. OUTPUT POWER (SPEAKER MODE)
A
V
= 2V/V
R
L
= 4Ω
10
MAX9760 toc09
100
A
V
= 2V/V
R
L
= 3Ω
10
100
A
V
= 4V/V
R
L
= 3Ω
10
100
THD+N (%)
THD+N (%)
1
f = 10kHz
f = 20Hz
1
f = 1kHz
0.1
THD+N (%)
f = 10kHz
1
0.1
0.1
f = 1kHz
f = 10kHz
0.01
f = 1kHz
0.01
f = 20Hz
0.001
0.01
f = 20Hz
0.001
0
1
2
OUTPUT POWER (W)
3
4
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
OUTPUT POWER (W)
0.001
0
1
2
OUTPUT POWER (W)
3
4
_______________________________________________________________________________________
5
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参数对比
与MAX9761EUI-T相近的元器件有:MAX9761EUI、MAX9760EUI-T、MAX9762EUI、MAX9762EUI-T、MAX9763EUI-T。描述及对比如下:
型号 MAX9761EUI-T MAX9761EUI MAX9760EUI-T MAX9762EUI MAX9762EUI-T MAX9763EUI-T
描述 Audio Amplifier, 3W, 2 Channel(s), 1 Func, BICMOS, PDSO28, 4.40 MM, MO-153AET, TSSOP-28 Audio Amplifier, 3W, 2 Channel(s), 1 Func, BICMOS, PDSO28, 4.40 MM, MO-153AET, TSSOP-28 Audio Amplifier, 3W, 2 Channel(s), 1 Func, BICMOS, PDSO28, 4.40 MM, MO-153AET, TSSOP-28 Audio Amplifier, 3W, 2 Channel(s), 1 Func, BICMOS, PDSO28, 4.40 MM, MO-153AET, TSSOP-28 Audio Amplifier, 3W, 2 Channel(s), 1 Func, BICMOS, PDSO28, 4.40 MM, MO-153AET, TSSOP-28 Audio Amplifier, 3W, 2 Channel(s), 1 Func, BICMOS, PDSO28, 4.40 MM, MO-153AET, TSSOP-28
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP
包装说明 HTSSOP, 4.40 MM, MO-153AET, TSSOP-28 TSSOP, TSSOP, TSSOP28,.25 TSSOP, TSSOP,
针数 28 28 28 28 28 28
Reach Compliance Code compliant not_compliant compliant not_compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
厂商名称 Maxim(美信半导体) Maxim(美信半导体) - Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
标称带宽 22 kHz 22 kHz 22 kHz - 22 kHz 22 kHz
商用集成电路类型 AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER - AUDIO AMPLIFIER AUDIO AMPLIFIER
JESD-30 代码 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 - R-PDSO-G28 R-PDSO-G28
JESD-609代码 e0 e0 e0 - e0 e0
长度 9.7 mm 9.7 mm 9.7 mm - 9.7 mm 9.7 mm
湿度敏感等级 1 1 1 - 1 1
信道数量 2 2 2 - 2 2
功能数量 1 1 1 - 1 1
端子数量 28 28 28 - 28 28
最高工作温度 85 °C 85 °C 85 °C - 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C - -40 °C -40 °C
标称输出功率 3 W 3 W 3 W - 3 W 3 W
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HTSSOP TSSOP TSSOP - TSSOP TSSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 245 245 245 - 240 245
认证状态 Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
座面最大高度 1.1 mm 1.1 mm 1.1 mm - 1.1 mm 1.1 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V - 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V - 4.5 V 4.5 V
表面贴装 YES YES YES - YES YES
技术 BICMOS BICMOS BICMOS - BICMOS BICMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL
端子面层 TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD - TIN LEAD TIN LEAD
端子形式 GULL WING GULL WING GULL WING - GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm - 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL - DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
宽度 4.4 mm 4.4 mm 4.4 mm - 4.4 mm 4.4 mm
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