F-209-1
MB1–120–01–L–S–02–SL
MB1–130–01–F–S–01–SL
1
mm
MINI CARD GUIDE
MB1 SERIES
Mates with:
(0,80mm) .031" PCB,
(1,60mm) .062" PCB
MB1
1
NO. OF
PINS
01
PLATING
OPTION
S
CARD
SLOT
SL
OTHER
OPTION
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MB1
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Sn or Au over 50µ" (1,27µm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(5,26mm)
.207" to (6,10mm) .240"
RoHS Compliant:
Yes
20, 30, 40, 50
(No. of Positions + 2)
x (1,00) .03937 + (4,06) .160
(3,81)
.150
–F
= Gold flash on contact,
Matte Tin on tail
–L
= 10µ" (0,25µm)
Gold on contact,
Matte Tin on tail
Specify
CARD
SLOT
from
chart
CARD
SLOT
–01
–02
–N
= No Card
Guides
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (20-30)
(0,15mm) .006" max (40-50)
Important Note:
Samtec recommends that
pads on the mating board be
Gold plated.
Note:
Other Gold plating
options available.
Contact Samtec.
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
MATES WITH
BOARD THICKNESS
(0,97)
(0,80)
.038
.031
(1,83)
(1,60)
.072
.062
A
(25,5)
1.004
(7,24)
.285
(7,24)
.285
01
(1,00)
.03937
50
(0,36)
.014
(No. of Positions + 2)
x (1,00) .03937
(1,52)
.060
(1,27)
.050
DIA
(5,44)
.214
(0,15)
.006
(0,69)
.027
(1,27)
.050
–N OPTION
(1,27)
.050
A
(2,36)
.093
ALSO AVAILABLE
Flex Card System
• 2mm (.0787") (FCT/EMT Series) and
.050" (1,27mm) (FCF/EMF Series) systems
• Vertical and horizontal
• Header with snap-on card guides for design flexibility
exibility
• Elevated design now available
• PCMCIA (PCMT/PCMS Series) Compact Flash
h
(CFT/CFS Series) compatible applications available
ilable
• Ideal for multiple add-on cards
• Solder locks for mechanical stability
• Any size from 40 to 100 contacts
™
WWW.SAMTEC.COM
嵌入式系统