Fast Page DRAM, 1MX4, 60ns, CMOS, PZIP20, PLASTIC, ZIP-20
厂商名称:FUJITSU(富士通)
厂商官网:http://edevice.fujitsu.com/fmd/en/index.html
下载文档型号 | MB814400A-60PZ | MB814400A-60PJN | MB814400A-70PJN | MB814400A-70PFTN | MB814400A-80PFTR |
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描述 | Fast Page DRAM, 1MX4, 60ns, CMOS, PZIP20, PLASTIC, ZIP-20 | Fast Page DRAM, 1MX4, 60ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20 | Fast Page DRAM, 1MX4, 70ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP2-26/20 | Fast Page DRAM, 1MX4, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, TSOP2-26/20 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) | FUJITSU(富士通) |
零件包装代码 | ZIP | LCC | LCC | SOIC | SOIC |
包装说明 | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.34 | SOJ, SOJ20/26,.34 | TSOP2, TSSOP20/26,.36 | TSOP2, TSSOP20/26,.36 |
针数 | 20 | 26/20 | 26/20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 60 ns | 60 ns | 70 ns | 70 ns | 80 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PZIP-T20 | R-PDSO-J20 | R-PDSO-J20 | R-PDSO-G20 | R-PDSO-G20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
长度 | 25.88 mm | 17.15 mm | 17.15 mm | 17.14 mm | 17.14 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX4 | 1MX4 | 1MX4 | 1MX4 | 1MX4 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | ZIP | SOJ | SOJ | TSOP2 | TSOP2 |
封装等效代码 | ZIP20,.1 | SOJ20/26,.34 | SOJ20/26,.34 | TSSOP20/26,.36 | TSSOP20/26,.36 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 |
座面最大高度 | 10.16 mm | 3.75 mm | 3.75 mm | 1.2 mm | 1.2 mm |
自我刷新 | NO | NO | NO | NO | NO |
最大待机电流 | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
最大压摆率 | 0.11 mA | 0.11 mA | 0.1 mA | 0.1 mA | 0.09 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | J BEND | J BEND | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | ZIG-ZAG | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 2.85 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |