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MB85RS256

Memory FRAM CMOS 256 K (32 K 】 8) Bit SPI

器件类别:存储    存储   

厂商名称:FUJITSU(富士通)

厂商官网:http://edevice.fujitsu.com/fmd/en/index.html

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器件参数
参数名称
属性值
包装说明
SOP, SOP8,.25
Reach Compliance Code
compli
JESD-30 代码
R-PDSO-G8
内存密度
262144 bi
内存集成电路类型
NON-VOLATILE SRAM
内存宽度
8
端子数量
8
字数
32768 words
字数代码
32000
最高工作温度
85 °C
最低工作温度
-20 °C
组织
32KX8
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP8,.25
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
电源
3.3 V
认证状态
Not Qualified
最大待机电流
0.00005 A
最大压摆率
0.01 mA
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
Base Number Matches
1
文档预览
FUJITSU MICROELECTRONICS
DATA SHEET
DS05-13105-3E
Memory FRAM
CMOS
256 K (32 K
×
8) Bit SPI
MB85RS256
DESCRIPTION
MB85RS256 is a FRAM (Ferroelectric Random Access Memory) chip in a configuration of 32,768 words
×
8 bits,
using the ferroelectric process and silicon gate CMOS process technologies for forming the nonvolatile memory
cells.
MB85RS256 adopts the Serial Peripheral Interface (SPI).
The MB85RS256 is able to retain data without using a back-up battery, as is needed for SRAM.
The memory cells used in the MB85RS256 can be used for 10
10
read/write operations, which is a significant
improvement over the number of read and write operations supported by Flash memory and E
2
PROM.
MB85RS256 does not take long time to write data unlike Flash memories nor E
2
PROM, and MB85RS256 takes
no wait time.
FEATURES
Bit configuration
Operating power supply voltage
Operating frequency
Serial Peripheral Interface
Operating temperature range
Data retention
High endurance
Package
:
:
:
:
:
:
:
:
32,768 words
×
8 bits
3.0 V to 3.6 V
15 MHz (Max)
SPI (Serial Peripheral Interface)
Correspondent to SPI mode 0 (0, 0) and mode 3 (1, 1)
−20 °C
to
+85 °C
10 years (+55
°C)
10 Billion Read/writes
8-pin plastic SOP (FPT-8P-M02)
Copyright©2005-2009 FUJITSU MICROELECTRONICS LIMITED All rights reserved
2009.8
MB85RS256
PIN ASSIGNMENT
(TOP VIEW)
CS
1
8
V
CC
SO
2
7
HOLD
WP
3
6
SCK
GND
4
5
SI
(FPT-8P-M02)
PIN FUNCTIONAL DESCRIPTIONS
Pin No. Pin Name
Functional description
Chip Select
This is an input pin to make chips select. When CS is “H”, device is in deselect (standby)
status as long as device is not write status internally, and SO becomes High-Z. Other inputs
from pins are ignored for this time. When CS is “L”, device is in select (active) status. CS has
to be “L” before inputting op-code.
Write Protect
This is a pin to control writing to a status register. When WP is “L”, writing to a status register
is not operated.
Hold
This pin is used to interrupt serial input/output without making chips deselect. When HOLD
is “L”, hold operation is activated, SO becomes High-Z, SCK and SI become don’t care.
While the hold operation, CS has to be retained “L”.
Serial Clock
This is a clock input pin to input/output serial data. SI is loaded synchronously to a rising
edge, SO is output synchronously to a falling edge.
Serial Data Input
This is an input pin of serial data. This inputs op-code, address, and writing data.
Serial Data Output
This is an output pin of serial data. Reading data of FRAM memory cell array and status
register data are output. This is High-Z during standby.
Supply Voltage
Ground
1
CS
3
WP
7
HOLD
6
SCK
5
SI
2
8
4
SO
V
CC
GND
2
DS05-13105-3E
MB85RS256
BLOCK DIAGRAM
Serial-Parallel Converter
Row-Decoder
SI
FRAM Cell Array
32,768
8
CS
Address Counter
SCK
Control Circuit
FRAM
Status Register
HOLD
Column Decoder/Sense Amp/
Write Amp
WP
Data Register
SO
Parallel-Serial Converter
DS05-13105-3E
3
MB85RS256
SPI MODE
MB85RS256 corresponds to the SPI mode 0 (CPOL
=
0, CPHA
=
0) , and SPI mode 3 (CPOL
=
1, CPHA
=
1) .
CS
SCK
SI
7
MSB
6
5
4
3
2
1
0
LSB
SPI Mode 0
CS
SCK
SI
7
MSB
6
5
4
3
2
1
0
LSB
SPI Mode 3
4
DS05-13105-3E
MB85RS256
SERIAL PERIPHERAL INTERFACE (SPI)
MB85RS256 works as a slave of SPI. More than 2 devices can be connected by using microcontroller equipped
with SPI port. By using a microcontroller not equipped with SPI port, SI and SO can be bus connected to use.
SCK
MOSI
MISO
SO
SI
SCK
SO
SI
SCK
SPI
Microcontroller
MB85RS256
CS
SS1
SS2
HOLD1
HOLD2
HOLD
MB85RS256
CS
HOLD
MOSI : Master Out Slave In
MISO : Master In Slave Out
SS
: Slave Select
System Configuration with SPI Port
Microcontroller
SO
SI
SCK
MB85RS256
CS
HOLD
System Configuration without SPI Port
DS05-13105-3E
5
查看更多>
参数对比
与MB85RS256相近的元器件有:MB85RS256PNF-G-JN-ERE1、MB85RS256PNF-G-JNE1、MB85RS256_09。描述及对比如下:
型号 MB85RS256 MB85RS256PNF-G-JN-ERE1 MB85RS256PNF-G-JNE1 MB85RS256_09
描述 Memory FRAM CMOS 256 K (32 K 】 8) Bit SPI Memory FRAM CMOS 256 K (32 K 】 8) Bit SPI Memory FRAM CMOS 256 K (32 K 】 8) Bit SPI Memory FRAM CMOS 256 K (32 K 】 8) Bit SPI
包装说明 SOP, SOP8,.25 SOP, SOP8,.25 SOP, SOP8,.25 -
Reach Compliance Code compli compli compli -
JESD-30 代码 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 -
内存密度 262144 bi 262144 bi 262144 bi -
内存集成电路类型 NON-VOLATILE SRAM MEMORY CIRCUIT MEMORY CIRCUIT -
内存宽度 8 8 8 -
端子数量 8 8 8 -
字数 32768 words 32768 words 32768 words -
字数代码 32000 32000 32000 -
最高工作温度 85 °C 85 °C 85 °C -
最低工作温度 -20 °C -20 °C -20 °C -
组织 32KX8 32KX8 32KX8 -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 SOP SOP SOP -
封装等效代码 SOP8,.25 SOP8,.25 SOP8,.25 -
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE -
电源 3.3 V 3.3 V 3.3 V -
认证状态 Not Qualified Not Qualified Not Qualified -
最大待机电流 0.00005 A 0.00005 A 0.00005 A -
最大压摆率 0.01 mA 0.01 mA 0.01 mA -
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V -
表面贴装 YES YES YES -
技术 CMOS CMOS CMOS -
温度等级 OTHER OTHER OTHER -
端子形式 GULL WING GULL WING GULL WING -
端子节距 1.27 mm 1.27 mm 1.27 mm -
端子位置 DUAL DUAL DUAL -
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