MBRD2045CT
Technical Data
Data Sheet N0047, Rev. A
MBRD2045CT SCHOTTKY RECTIFIER
Features
150℃ T
J
operation
Center tap configuration
Low forward voltage drop
High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
High frequency operation
Guard ring for enhanced ruggedness and long term
reliability
“-A” is an AEC-Q101 qualified device
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
DPAK
Circuit Diagram
Applications
Switching power supply
Converters
Free-Wheeling diodes
Reverse battery protection
Battery charging
Maximum Ratings:
Characteristics
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
Peak One Cycle Non-Repetitive Surge
Current(peg leg)
Symbol
V
RRM
V
RWM
V
R
I
F (AV)
I
FSM
Condition
-
50% duty cycle @T
C
=135°C,
rectangular wave form
8.3 ms, half Sine pulse
Max.
45
10(Peg Leg)
20(Peg Device)
150
Units
V
A
A
Electrical Characteristics:
Characteristics
Forward Voltage Drop
(Peg Leg) *
Reverse Current (Peg Leg) *
Junction Capacitance(Peg Leg)
Voltage Rate of Change
* Pulse width < 300 µs, duty cycle < 2%
Symbol
V
F1
V
F2
I
R1
I
R2
C
T
dv/dt
Condition
@ 20A, Pulse, T
J
= 25
C
@ 20A, Pulse, T
J
= 125
C
@V
R
= rated V
R,
T
J
= 25
C
@V
R
= rated V
R,
T
J
= 125
C
@V
R
= 5V, T
C
= 25
C,
f
SIG
= 1MHz
-
Typ.
0.74
0.70
0.03
9
280
-
Max.
0.84
0.72
1
15.0
400
10,000
Units
V
V
mA
mA
pF
V/s
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MBRD2045CT
Technical Data
Data Sheet N0047, Rev. A
Thermal-Mechanical Specifications:
Characteristics
Junction Temperature
Storage Temperature
Typical Thermal Resistance Junction to
Case(Peg Leg)
Approximate Weight
Case Style
Symbol
T
J
T
stg
R
JC
wt
Condition
-
-
-
-
DPAK
Specification
-55 to +150
-55 to + 150
5
0.39
Units
C
C
C/W
g
Ratings and Characteristics Curves
10000
Reverse Current-IR(MA)
Junction Capacitance-CT(PF)
100
10
1
0.1
0.01
0.001
10
20
30
40
50
60
70
80
90
100
Reverse Voltage-VR(%)
TJ=125℃
1000
TJ=25℃
100
TJ=25℃
10
0
5
10
15
20
25
30
35
40
Reverse Voltage-VR(V)
Fig.1-Typical Junction Capacitance
Instantaneous Forward Current-IF(A)
Fig.2-Typical Reverse Characteristics
100
10
TJ=125℃
TJ=25℃
1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Forward Voltage Drop-VF(V)
Fig.3-Typical Instantaneous Forward Voltage Characteristics
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MBRD2045CT
Technical Data
Data Sheet N0047, Rev. A
Mechanical Dimensions DPAK
SYMBOL
A
A1
b
c
D
D1
D2
E
e
L
L1
L2
L3
L4
Φ
Θ
h
V
Millimeters
Min.
Max.
2.20
2.40
0.00
0.127
0.66
0.86
0.46
0.60
6.50
6.70
5.13
5.46
4.83 REF.
6.00
6.20
2.186
2.386
9.70
10.40
2.90 REF.
1.40
1.70
1.60 REF.
0.60
1.00
1.10
1.30
0°
8°
0.00
0.30
5.35 REF.
Inches
Min.
Max.
0.087
0.094
0.000
0.005
0.026
0.034
0.018
0.024
0.256
0.264
0.202
0.215
0.190 REF.
0.236
0.244
0.086
0.094
0.381
0.409
0.144 REF.
0.055
0.067
0.063 REF.
0.024
0.039
0.043
0.051
0°
8°
0.000
0.012
0.211 REF.
Ordering Information
Device
MBRD2045CT
Marking Diagram
Shipping
2500pcs / reel
Where XXXXX is YYWWL
MBR
D
20
45
CT
-A
SSG
YY
WW
L
= Device Type
= Package type
= Forward Current (20A)
= Reverse Voltage (45V)
= Configuration
= AEC-Q101
= SSG
= Year
= Week
= Lot Number
Package
DPAK
(Pb-Free)
For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our tape and reel
Packaging specification.
Cautions：Molding
resin
Epoxy resin UL:94V-0
Carrier Tape Specification DPAK
SYMBOL
A
B
C
d
E
F
P0
P
P1
W
6.80
10.40
2.60
Φ1.45
1.65
7.40
3.90
7.90
1.90
15.90
Min.
Millimeters
Max.
7.00
10.60
2.80
Φ1.65
1.85
7.60
4.10
8.10
2.10
16.30
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MBRD2045CT
Technical Data
Data Sheet N0047, Rev. A
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC Diode Solutions sales department for the latest version of
the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall
SMC Diode Solutions
be liable for any damages that may result from an accident or any other cause during
operation of the user’s units according to the datasheet(s).
SMC Diode Solution
assumes no responsibility for any intellectual property
claims or any other problems that may result from applications of information, products or circuits described in the datasheets.
4- In no event shall
SMC Diode Solutions
be liable for any failure in a semiconductor device or any secondary damage resulting from use
at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or
SMC Diode Solutions.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of
SMC
Diode Solutions.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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