MBRD660
Technical Data
Data Sheet N1117, Rev. A
MBRD660 SCHOTTKY RECTIFIER
Features
150℃ T
J
operation
Center tap configuration
Low forward voltage drop
High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
High frequency operation
Guard ring for enhanced ruggedness and long term
reliability
“-A” is an AEC-Q101 qualified device
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
DPAK
Circuit Diagram
Applications
Disk drives
Switching power supply
Converters
Free-Wheeling diodes
Reverse battery protection
Battery charging
Maximum Ratings:
Characteristics
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
Peak One Cycle Non-Repetitive Surge
Current
Symbol
V
RRM
V
RWM
V
R
I
F (AV)
I
FSM
Condition
-
50% duty cycle @Tc=85°C,
rectangular wave form
8.3ms, Half Sine pulse
Max.
60
6
125
Units
V
A
A
Electrical Characteristics:
Characteristics
Forward Voltage Drop*
Reverse Current *
Junction Capacitance
* Pulse width < 300 µs, duty cycle < 2%
Symbol
V
F1
V
F2
I
R1
I
R2
C
T
Condition
@ 6A, Pulse, T
J
= 25
C
@ 6A, Pulse, T
J
= 125
C
@V
R
= rated V
R,
T
J
= 25
C
@V
R
= rated V
R ,
T
J
= 125
C
@V
R
= 5.0V, T
C
= 25
C
f
SIG
= 1MHz
Typ.
0.70
0.60
0.01
3
300
Max.
0.75
0.70
1
10
400
Units
V
V
mA
mA
pF
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MBRD660
Technical Data
Data Sheet N1117, Rev. A
Thermal-Mechanical Specifications:
Characteristics
Junction Temperature
Storage Temperature
Typical Thermal Resistance Junction to
Case
Approximate Weight
Case Style
Symbol
T
J
T
stg
R
JC
wt
Condition
-
-
-
-
DPAK
Specification
-55 to +150
-55 to +150
6
0.39
Units
C
C
C/W
g
Ratings and Characteristics Curves
TJ=125℃
TJ=25℃
TJ=25℃
Fig.1-Typical Junction Capacitance
Fig.2-Typical Reverse Characteristics
TJ=125℃
TJ=25℃
Fig.3-Typical Instantaneous Forward Voltage Characteristics
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MBRD660
Technical Data
Data Sheet N1117, Rev. A
Mechanical Dimensions DPAK
SYMBOL
A
A1
b
c
D
D1
D2
E
e
L
L1
L2
L3
L4
Φ
Θ
h
V
Millimeters
Min.
Max.
2.20
2.40
0.00
0.127
0.66
0.86
0.46
0.60
6.50
6.70
5.13
5.46
4.83 REF.
6.00
6.20
2.186
2.386
9.70
10.40
2.90 REF.
1.40
1.70
1.60 REF.
0.60
1.00
1.10
1.30
0°
8°
0.00
0.30
5.35 REF.
Inches
Min.
Max.
0.087
0.094
0.000
0.005
0.026
0.034
0.018
0.024
0.256
0.264
0.202
0.215
0.190 REF.
0.236
0.244
0.086
0.094
0.381
0.409
0.144 REF.
0.055
0.067
0.063 REF.
0.024
0.039
0.043
0.051
0°
8°
0.000
0.012
0.211 REF.
Ordering Information
Device
MBRD660
MBRD660TR
Marking Diagram
Shipping
2500pcs / reel
2500pcs / reel
Where XXXXX is YYWWL
MBRD660
SSG
YY
WW
L
= Part Name
= SSG
= Year
= Week
= Lot Number
Package
DPAK
(Pb-Free)
DPAK
(Pb-Free)
For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our tape and reel
packaging specification.
Cautions：Molding
resin
Epoxy resin UL:94V-0
Carrier Tape & Reel Specification DPAK
SYMBOL
A
B
C
d
E
F
P0
P
P1
W
6.80
10.40
2.60
Φ1.45
1.65
7.40
3.90
7.90
1.90
15.90
Millimeters
Min.
Max.
7.00
10.60
2.80
Φ1.65
1.85
7.60
4.10
8.10
2.10
16.30
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MBRD660
Technical Data
Data Sheet N1117, Rev. A
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC Diode Solutions sales department for the latest version of
the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall
SMC Diode Solutions
be liable for any damages that may result from an accident or any other cause during
operation of the user’s units according to the datasheet(s).
SMC Diode Solution
assumes no responsibility for any intellectual property
claims or any other problems that may result from applications of information, products or circuits described in the datasheets.
4- In no event shall
SMC Diode Solutions
be liable for any failure in a semiconductor device or any secondary damage resulting from use
at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or
SMC Diode Solutions.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of
SMC
Diode Solutions.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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