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MC100EL12DTR2G

100EL SERIES, 2-INPUT OR/NOR GATE, PDSO8

器件类别:逻辑    逻辑   

厂商名称:ON Semiconductor(安森美)

厂商官网:http://www.onsemi.cn

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器件参数
参数名称
属性值
Brand Name
ON Semiconduc
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
ON Semiconductor(安森美)
零件包装代码
SOIC
包装说明
TSSOP, TSSOP8,.19
针数
8
制造商包装代码
948R-02
Reach Compliance Code
compli
Factory Lead Time
16 weeks
其他特性
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
系列
100EL
JESD-30 代码
S-PDSO-G8
JESD-609代码
e3
长度
3 mm
逻辑集成电路类型
OR/NOR GATE
功能数量
1
输入次数
2
端子数量
8
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP8,.19
封装形状
SQUARE
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
260
电源
-4.5 V
传播延迟(tpd)
0.45 ns
认证状态
Not Qualified
座面最大高度
1.1 mm
最大供电电压 (Vsup)
5.7 V
最小供电电压 (Vsup)
4.2 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
ECL
温度等级
INDUSTRIAL
端子面层
Tin (Sn)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
宽度
3 mm
文档预览
MC10EL12, MC100EL12
5.0 V ECL Low Impedance
Driver
The MC10EL/100EL12 is a low impedance drive buffer. With two
pairs of OR/NOR outputs the device is ideally suited for high drive
applications such as memory addressing. The device is a function
equivalent to the E112 device with higher performance capabilities.
With propagation delays significantly faster than the E112, the EL12 is
ideally suited for those applications which require the ultimate in
AC performance.
The 100 Series contains temperature compensation.
Features
http://onsemi.com
MARKING
DIAGRAMS*
8
1
SOIC−8
D SUFFIX
CASE 751
8
HEL12
ALYW
G
1
1
8
KEL12
ALYW
G
290 ps Propagation Delay
Dual Outputs for 25
W
Drive Applications
ESD Protection: Human Body Model; > 1.0 kV
Machine Model; > 100 V
PECL Mode Operating Range: V
CC
= 4.2 V to 5.7 V with V
EE
= 0 V
NECL Mode Operating Range: V
CC
= 0 V with V
EE
=
−4.2
V to
−5.7
V
Internal Input Pulldown Resistors
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level 1
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen Index: 28 to 34
Transistor Count = 44 devices
Pb−Free Packages are Available
8
1
TSSOP−8
DT SUFFIX
CASE 948R
8
HL12
ALYWG
G
8
KL12
ALYWG
G
1
1
4R M
G
G
DFN8
MN SUFFIX
CASE 506AA
1
4
1
Q
a
1
8
V
CC
Q
b
2
7
D
0
H
K
4R
2F
A
MC10
MC100
MC10
MC100
= Assembly Location
L
Y
W
M
G
= Wafer Lot
= Year
= Work Week
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
Q
a
3
6
D
1
*For additional marking information, refer to
Application Note AND8002/D.
Q
b
4
5
V
EE
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Figure 1. Logic Diagram and Pinout Assignment
©
Semiconductor Components Industries, LLC, 2008
August, 2008
Rev. 7
1
Publication Order Number:
MC10EL12/D
2F M
G
G
4
MC10EL12, MC100EL12
Table 1. PIN DESCRIPTION
PIN
D0, D1
Qa,Qa; Qb, Qb
V
CC
V
EE
EP
FUNCTION
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
(DFN8 only) Thermal exposed pad must be connected
to a sufficient thermal conduit. Electrically connect to
the most negative supply (GND) or leave unconnected,
floating open.
Table 2. MAXIMUM RATINGS
Symbol
V
CC
V
EE
V
I
I
out
T
A
T
stg
q
JA
q
JC
q
JA
q
JC
q
JA
T
sol
q
JC
Parameter
PECL Mode Power Supply
NECL Mode Power Supply
PECL Mode Input Voltage
NECL Mode Input Voltage
Output Current
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Pb
Pb−Free
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
(Note 1)
DFN8
SOIC−8
SOIC−8
SOIC−8
TSSOP−8
TSSOP−8
TSSOP−8
DFN8
DFN8
Condition 1
V
EE
= 0 V
V
CC
= 0 V
V
EE
= 0 V
V
CC
= 0 V
Continuous
Surge
V
I

V
CC
V
I

V
EE
Condition 2
Rating
8
−8
6
−6
50
100
−40
to +85
−65
to +150
190
130
41 to 44
185
140
41 to 44
±
5%
129
84
265
265
35 to 40
Unit
V
V
V
V
mA
mA
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
°C/W
Thermal Resistance (Junction−to−Case)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. JEDEC standard multilayer board
2S2P (2 signal, 2 power)
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2
MC10EL12, MC100EL12
Table 3. 10EL SERIES PECL DC CHARACTERISTICS
V
CC
= 5.0 V; V
EE
= 0.0 V (Note 2)
−40°C
Symbol
I
EE
V
OH
V
OL
V
IH
V
IL
I
IH
I
IL
Characteristic
Power Supply Current
Output HIGH Voltage (Note 5)
Output LOW Voltage (Note 3)
Input HIGH Voltage
Input LOW Voltage
Input HIGH Current
Input LOW Current
0.5
3920
3050
3770
3050
Min
Typ
14
4010
3200
Max
17
4110
3350
4110
3500
150
0.5
4020
3050
3870
3050
Min
25°C
Typ
14
4105
3210
Max
17
4190
3370
4190
3520
150
0.3
4090
3050
3940
3050
Min
85°C
Typ
14
4185
3227
Max
17
4280
3405
4280
3555
150
Unit
mA
mV
mV
mV
mV
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary +0.06 V /
−0.5
V.
3. Outputs are terminated through a 50
W
resistor to V
CC
2 volts.
Table 4. 10EL SERIES NECL DC CHARACTERISTICS
V
CC
= 0.0 V; V
EE
=
−5.0
V (Note 4)
−40°C
Symbol
I
EE
V
OH
V
OL
V
IH
V
IL
I
IH
I
IL
Characteristic
Power Supply Current
Output HIGH Voltage (Note 5)
Output LOW Voltage (Note 5)
Input HIGH Voltage
Input LOW Voltage
Input HIGH Current
Input LOW Current
0.5
−1080
−1950
−1230
−1950
Min
Typ
14
−990
−1800
Max
17
−890
−1650
−890
−1500
150
0.5
−980
−1950
−1130
−1950
Min
25°C
Typ
14
−895
−1790
Max
17
−810
−1630
−810
−1480
150
0.3
−910
−1950
−1060
−1950
Min
85°C
Typ
14
−815
−1773
Max
17
−720
−1595
−720
−1445
150
Unit
mA
mV
mV
mV
mV
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary +0.06 V /
−0.5
V.
5. Outputs are terminated through a 50
W
resistor to V
CC
2 volts.
Table 5. 100EL SERIES PECL DC CHARACTERISTICS
V
CC
= 5.0 V; V
EE
= 0.0 V (Note 6)
−40°C
Symbol
I
EE
V
OH
V
OL
V
IH
V
IL
I
IH
I
IL
Characteristic
Power Supply Current
Output HIGH Voltage (Note 7)
Output LOW Voltage (Note 7)
Input HIGH Voltage
Input LOW Voltage
Input HIGH Current
Input LOW Current
0.5
3915
3170
3835
3190
Min
Typ
14
3995
3305
Max
17
4120
3445
4120
3525
150
0.5
3975
3190
3835
3190
Min
25°C
Typ
14
4045
3295
Max
17
4120
3380
4120
3525
150
0.5
3975
3190
3835
3190
Min
85°C
Typ
16
4050
3295
Max
20
4120
3380
4120
3525
150
Unit
mA
mV
mV
mV
mV
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
6. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary +0.8 V /
−0.5
V.
7. Outputs are terminated through a 50
W
resistor to V
CC
2 volts.
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3
MC10EL12, MC100EL12
Table 6. 100EL SERIES NECL DC CHARACTERISTICS
V
CC
= 0.0 V; V
EE
=
−5.0
V (Note 8)
−40°C
Symbol
I
EE
V
OH
V
OL
V
IH
V
IL
I
IH
I
IL
Characteristic
Power Supply Current
Output HIGH Voltage (Note 9)
Output LOW Voltage (Note 9)
Input HIGH Voltage
Input LOW Voltage
Input HIGH Current
Input LOW Current
0.5
−1085
−1830
−1165
−1810
Min
Typ
14
−1005
−1695
Max
17
−880
−1555
−880
−1475
150
0.5
−1025
−1810
−1165
−1810
Min
25°C
Typ
14
−955
−1705
Max
17
−880
−1620
−880
−1475
150
0.5
−1025
−1810
−1165
−1810
Min
85°C
Typ
16
−955
−1705
Max
20
−880
−1620
−880
−1475
150
Unit
mA
mV
mV
mV
mV
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
8. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary +0.8 V /
−0.5
V.
9. Outputs are terminated through a 50
W
resistor to V
CC
2 volts.
Table 7. AC CHARACTERISTICS
V
CC
= 5.0 V; V
EE
= 0.0 V or V
CC
= 0.0 V; V
EE
=
−5.0
V (Note 9)
−40°C
Symbol
f
max
t
PLH
t
PHL
t
JITTER
t
r
t
f
Characteristic
Maximum Toggle Frequency
Propagation Delay to
Output
Cycle−to−Cycle Jitter
Output Rise/Fall Times Q
(20%
80%)
150
120
Min
Typ
TBD
280
TBD
350
550
150
500
180
Max
Min
25°C
Typ
TBD
290
TBD
350
550
150
450
210
Max
Min
85°C
Typ
TBD
320
TBD
350
550
480
Max
Unit
GHz
ps
ps
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
10. 10 Series: V
EE
can vary +0.06 V /
−0.5
V.
100 Series: V
EE
can vary +0.8 V /
−0.5
V.
Q
Driver
Device
Q
Z
o
= 50
W
D
Receiver
Device
Z
o
= 50
W
50
W
50
W
D
V
TT
V
TT
= V
CC
3.0 V
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D
Termination of ECL Logic Devices.)
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4
MC10EL12, MC100EL12
ORDERING INFORMATION
Device
MC10EL12D
MC10EL12DG
MC10EL12DR2
MC10EL12DR2G
MC10EL12DT
MC10EL12DTG
MC10EL12DTR2
MC10EL12DTR2G
MC10EL12MNR4
MC10EL12MNR4G
MC100EL12D
MC100EL12DG
MC100EL12DR2
MC100EL12DR2G
MC100EL12DT
MC100EL12DTG
MC100EL12DTR2
MC100EL12DTR2G
MC100EL12MNR4
MC100EL12MNR4G
Package
SOIC−8
SOIC−8
(Pb−Free)
SOIC−8
SOIC−8
(Pb−Free)
TSSOP−8
TSSOP−8
(Pb−Free)
TSSOP−8
TSSOP−8
(Pb−Free)
DFN8
DFN8
(Pb−Free)
SOIC−8
SOIC−8
(Pb−Free)
SOIC−8
SOIC−8
(Pb−Free)
TSSOP−8
TSSOP−8
(Pb−Free)
TSSOP−8
TSSOP−8
(Pb−Free)
DFN8
DFN8
(Pb−Free)
Shipping
98 Units / Rail
98 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
100 Units / Rail
100 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
1000 / Tape & Reel
1000 / Tape & Reel
98 Units / Rail
98 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
100 Units / Rail
100 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
1000 / Tape & Reel
1000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
AN1406/D
AN1503/D
AN1504/D
AN1568/D
AN1672/D
AND8001/D
AND8002/D
AND8020/D
AND8066/D
AND8090/D
ECL Clock Distribution Techniques
Designing with PECL (ECL at +5.0 V)
ECLinPSt I/O SPiCE Modeling Kit
Metastability and the ECLinPS Family
Interfacing Between LVDS and ECL
The ECL Translator Guide
Odd Number Counters Design
Marking and Date Codes
Termination of ECL Logic Devices
Interfacing with ECLinPS
AC Characteristics of ECL Devices
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