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MC100LVEL12DG

100LVEL SERIES, 2-INPUT OR/NOR GATE, PDSO8, LEAD FREE, SOIC-8

器件类别:逻辑    逻辑   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

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器件参数
参数名称
属性值
是否无铅
含铅
厂商名称
Rochester Electronics
零件包装代码
SOIC
包装说明
LEAD FREE, SOIC-8
针数
8
Reach Compliance Code
unknow
其他特性
NECL MODE: VCC = 0V WITH VEE = -3.0V TO -3.8V
系列
100LVEL
JESD-30 代码
R-PDSO-G8
JESD-609代码
e3
长度
4.9 mm
逻辑集成电路类型
OR/NOR GATE
湿度敏感等级
NOT SPECIFIED
功能数量
1
输入次数
2
端子数量
8
最高工作温度
85 °C
最低工作温度
-40 °C
输出特性
OPEN-EMITTER
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
260
传播延迟(tpd)
0.58 ns
认证状态
COMMERCIAL
座面最大高度
1.75 mm
最大供电电压 (Vsup)
3.8 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
ECL
温度等级
INDUSTRIAL
端子面层
MATTE TIN
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
宽度
3.9 mm
文档预览
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MC100LVEL12
3.3V ECL Low Impedance
Driver
Description
The MC100LVEL12 is a low impedance drive buffer. With two
pairs of OR/NOR outputs the device is ideally suited for high drive
applications such as memory addressing. The device is functionally
equivalent to the EL12 device and operates from a 3.3 V power supply.
With propagation delays equivalent to the EL12, the LVEL12 is
ideally suited for those applications which require the ultimate in
AC performance in a low voltage environment.
Features
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MARKING
DIAGRAMS*
8
1
SOIC−8
D SUFFIX
CASE 751
8
1
TSSOP−8
DT SUFFIX
CASE 948R
8
KVL12
ALYW
G
1
445 ps Propagation Delay
Dual Outputs for 25
W
Drive Applications
ESD Protection: >4 kV Human Body Model,
> 200 V Machine Model
The 100 Series Contains Temperature Compensation
PECL Mode Operating Range:V
CC
= 3.0 V to 3.8 V
with V
EE
= 0 V
NECL Mode Operating Range: V
CC
= 0 V
with V
EE
=
−3.0
V to
−3.8
V
Internal Input Pulldown Resistors
Q Output will Default LOW with All Inputs Open or at V
EE
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level 1
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL−94 V−0 @ 0.125 in,
Oxygen Index: 28 to 34
Transistor Count = 83 devices
Pb−Free Packages are Available
8
KV12
ALYWG
G
1
1
DFN8
MN SUFFIX
CASE 506AA
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
December, 2006
Rev. 3
1
Publication Order Number:
MC100LVEL12/D
4A M
G
G
4
MC100LVEL12
Table 1. PIN DESCRIPTION
Q
a
1
8
V
CC
PIN
D0, D1
Qa, Qa; Qb, Qb
V
CC
V
EE
EP
FUNCTION
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
Exposed pad must be connected
to a sufficient thermal conduit.
Electrically connect to the most
negative supply or leave floating
open.
Q
b
2
7
D
0
Q
a
3
6
D
1
Q
b
4
5
V
EE
Figure 1. Logic Diagram and Pinout Assignment
Table 2. MAXIMUM RATINGS
Symbol
V
CC
V
EE
V
I
I
out
T
A
T
stg
q
JA
q
JC
q
JA
q
JC
q
JA
T
sol
Parameter
PECL Mode Power Supply
NECL Mode Power Supply
PECL Mode Input Voltage
NECL Mode Input Voltage
Output Current
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Pb
Pb−Free
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
8 SOIC
8 SOIC
8 SOIC
8 TSSOP
8 TSSOP
8 TSSOP
DFN8
DFN8
Condition 1
V
EE
= 0 V
V
CC
= 0 V
V
EE
= 0 V
V
CC
= 0 V
Continuous
Surge
V
I

V
CC
V
I

V
EE
Condition 2
Rating
8 to 0
−8
to 0
6 to 0
−6
to 0
50
100
−40
to +85
−65
to +150
190
130
41 to 44
±
5%
185
140
41 to 44
±
5%
129
84
265
265
Units
V
V
V
V
mA
mA
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
MC100LVEL12
Table 3. LVPECL DC CHARACTERISTICS
V
CC
= 3.3 V; V
EE
= 0.0 V (Note 1)
−40°C
Symbol
I
EE
V
OH
V
OL
V
IH
V
IL
I
IH
I
IL
Characteristic
Power Supply Current
Output HIGH Voltage (Note 2)
Output LOW Voltage (Note 2)
Input HIGH Voltage
Input LOW Voltage
Input HIGH Current
Input LOW Current
0.5
2215
1470
2135
1490
Min
Typ
17
2295
1605
Max
24
2420
1745
2420
1825
150
0.5
2275
1490
2135
1490
Min
25°C
Typ
17
2345
1595
Max
24
2420
1680
2420
1825
150
0.5
2275
1490
2135
1490
Min
85°C
Typ
18
2345
1595
Max
25
2420
1680
2420
1825
150
Unit
mA
mV
mV
mV
mV
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary
±0.3
V.
2. Outputs are terminated through a 50
W
resistor to V
CC
2.0 V.
Table 4. LVNECL DC CHARACTERISTICS
V
CC
= 0.0 V; V
EE
=
−3.3
V (Note 3)
−40°C
Symbol
I
EE
V
OH
V
OL
V
IH
V
IL
I
IH
I
IL
Characteristic
Power Supply Current
Output HIGH Voltage (Note 4)
Output LOW Voltage (Note 4)
Input HIGH Voltage
Input LOW Voltage
Input HIGH Current
Input LOW Current
0.5
−1085
−1830
−1165
−1810
Min
Typ
17
−1005
−1695
Max
24
−880
−1555
−880
−1475
150
0.5
−1025
−1810
−1165
−1810
Min
25°C
Typ
17
−955
−1705
Max
24
−880
−1620
−880
−1475
150
0.5
−1025
−1810
−1165
−1810
Min
85°C
Typ
18
−955
−1705
Max
25
−880
−1620
−880
−1475
150
Unit
mA
mV
mV
mV
mV
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Input and output parameters vary 1:1 with V
CC
. V
EE
can vary
±0.3
V.
4. Outputs are terminated through a 50
W
resistor to V
CC
2.0 V.
Table 5. AC CHARACTERISTICS
V
CC
= 3.3 V; V
EE
= 0.0 V or V
CC
= 0.0 V; V
EE
=
−3.3
V (Note 5)
−40°C
Symbol
f
max
t
PLH
t
PHL
t
JITTER
t
r
t
f
Characteristic
Maximum Toggle Frequency
Propagation Delay to
Output
Cycle−to−Cycle Jitter
Output Rise/Fall Times Q
(20%
80%)
230
310
TBD
400
550
230
Min
Typ
TBD
580
310
Max
Min
25°C
Typ
TBD
445
TBD
400
550
230
580
320
TBD
400
550
Max
Min
85°C
Typ
TBD
590
Max
Unit
GHz
ps
ps
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. V
EE
can vary
±0.3
V.
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3
MC100LVEL12
Q
Driver
Device
Q
Z
o
= 50
W
50
W
50
W
D
Z
o
= 50
W
D
Receiver
Device
V
TT
V
TT
= V
CC
3.0 V
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D
Termination of ECL Logic Devices.)
ORDERING INFORMATION
Device
MC100LVEL12D
MC100LVEL12DG
MC100LVEL12DR2
MC100LVEL12DR2G
MC100LVEL12DT
MC100LVEL12DTG
MC100LVEL12DTR2
MC100LVEL12DTR2G
MC100LVEL12MNR4
MC100LVEL12MNR4G
Package
SOIC−8
SOIC−8
(Pb−Free)
SOIC−8
SOIC−8
(Pb−Free)
TSSOP−8
TSSOP−8
(Pb−Free)
TSSOP−8
TSSOP−8
(Pb−Free)
DFN8
DFN8
(Pb−Free)
Shipping
98 Units / Rail
98 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
100 Units / Rail
100 Units / Rail
2500 / Tape & Reel
2500 / Tape & Reel
1000 / Tape & Reel
1000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
AN1406/D
AN1503/D
AN1504/D
AN1568/D
AN1672/D
AND8001/D
AND8002/D
AND8020/D
AND8066/D
AND8090/D
ECL Clock Distribution Techniques
Designing with PECL (ECL at +5.0 V)
ECLinPSt I/O SPiCE Modeling Kit
Metastability and the ECLinPS Family
Interfacing Between LVDS and ECL
The ECL Translator Guide
Odd Number Counters Design
Marking and Date Codes
Termination of ECL Logic Devices
Interfacing with ECLinPS
AC Characteristics of ECL Devices
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参数对比
与MC100LVEL12DG相近的元器件有:MC100LVEL12DTG、MC100LVEL12DT、MC100LVEL12DR2、MC100LVEL12D。描述及对比如下:
型号 MC100LVEL12DG MC100LVEL12DTG MC100LVEL12DT MC100LVEL12DR2 MC100LVEL12D
描述 100LVEL SERIES, 2-INPUT OR/NOR GATE, PDSO8, LEAD FREE, SOIC-8 100LVEL SERIES, 2-INPUT OR/NOR GATE, PDSO8, LEAD FREE, PLASTIC, TSSOP-8 100LVEL SERIES, 2-INPUT OR/NOR GATE, PDSO8, PLASTIC, TSSOP-8 100LVEL SERIES, 2-INPUT OR/NOR GATE, PDSO8, SOIC-8 100LVEL SERIES, 2-INPUT OR/NOR GATE, PDSO8, SOIC-8
是否无铅 含铅 含铅 含铅 不含铅 不含铅
零件包装代码 SOIC SOIC SOIC SOIC SOIC
包装说明 LEAD FREE, SOIC-8 LEAD FREE, PLASTIC, TSSOP-8 PLASTIC, TSSOP-8 SOIC-8 SOIC-8
针数 8 8 8 8 8
Reach Compliance Code unknow unknown unknown unknown unknow
其他特性 NECL MODE: VCC = 0V WITH VEE = -3.0V TO -3.8V NECL MODE: VCC = 0V WITH VEE = -3.0V TO -3.8V NECL MODE: VCC = 0V WITH VEE = -3.0V TO -3.8V NECL MODE: VCC = 0V WITH VEE = -3.0V TO -3.8V NECL MODE: VCC = 0V WITH VEE = -3.0V TO -3.8V
系列 100LVEL 100LVEL 100LVEL 100LVEL 100LVEL
JESD-30 代码 R-PDSO-G8 S-PDSO-G8 S-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609代码 e3 e3 e0 e0 e0
长度 4.9 mm 3 mm 3 mm 4.9 mm 4.9 mm
逻辑集成电路类型 OR/NOR GATE OR/NOR GATE OR/NOR GATE OR/NOR GATE OR/NOR GATE
湿度敏感等级 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
功能数量 1 1 1 1 1
输入次数 2 2 2 2 2
端子数量 8 8 8 8 8
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP TSSOP TSSOP SOP SOP
封装形状 RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) 260 260 240 240 240
传播延迟(tpd) 0.58 ns 0.58 ns 0.58 ns 0.58 ns 0.58 ns
认证状态 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
座面最大高度 1.75 mm 1.1 mm 1.1 mm 1.75 mm 1.75 mm
最大供电电压 (Vsup) 3.8 V 3.8 V 3.8 V 3.8 V 3.8 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES
技术 ECL ECL ECL ECL ECL
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 MATTE TIN MATTE TIN TIN LEAD TIN LEAD TIN LEAD
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 1.27 mm 0.65 mm 0.65 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 40 40 30 30 30
宽度 3.9 mm 3 mm 3 mm 3.9 mm 3.9 mm
厂商名称 Rochester Electronics - Rochester Electronics Rochester Electronics Rochester Electronics
输出特性 OPEN-EMITTER - - OPEN-EMITTER OPEN-EMITTER
热门器件
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器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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