IC,TTL-TO-ECL TRANSLATOR,ECL10/TTL,DIP,16PIN,PLASTIC
厂商名称:NXP(恩智浦)
厂商官网:https://www.nxp.com
下载文档型号 | MC10124PS | MC10124LD | MC10124PDS |
---|---|---|---|
描述 | IC,TTL-TO-ECL TRANSLATOR,ECL10/TTL,DIP,16PIN,PLASTIC | IC,TTL-TO-ECL TRANSLATOR,ECL10/TTL,DIP,16PIN,CERAMIC | IC,TTL-TO-ECL TRANSLATOR,ECL10/TTL,DIP,16PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknow | unknown | unknown |
接口集成电路类型 | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR |
JESD-30 代码 | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 | e0 |
端子数量 | 16 | 16 | 16 |
最高工作温度 | 85 °C | 85 °C | 85 °C |
最低工作温度 | -30 °C | -30 °C | -30 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE |
电源 | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
表面贴装 | NO | NO | NO |
技术 | ECL10K | ECL10K | ECL10K |
温度等级 | OTHER | OTHER | OTHER |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL |