* VILmin applied to each input pin, one at a time.
MOTOROLA
3–118
MECL Data
DL122 — Rev 6
MC10173
ELECTRICAL CHARACTERISTICS
(continued)
TEST VOLTAGE VALUES
(Volts)
@ Test Temperature
–30°C
+25°C
+85°C
Pin
Under
Test
8
5
6
7
9
IinL
Output Voltage
Output Voltage
Threshold Voltage
Threshold Voltage
Switching Times
Propagation Delay
Logic 1
Logic 0
Logic 1
Logic 0
(50Ω Load)
Data Input
t6+1+
t6–1–
t5+1+
t5–1–
t7–1+
t7–1–
t9+1+
t9+1–
t9–1+
t9–1–
tsetup
tsetup
thold
thold
t+
t–
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
6
5
5
6
6
6
5
7
7
7
7
VOH
VOL
VOHA
VOLA
All
1
2
1
2
1
2
1
2
6, 9
5
9
9
9
+1.11V
9
9
5
6
7
9
*
7
7
7
7
7
7
7
7
+0.31V
7
7
7
7
Pulse In
6
6
5
5
5, 7
5, 7
9
9
9
9
5, 7
7, 9
5, 7
7, 9
7
7
6
5
6
5
Pulse Out
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
VIHmax
–0.890
–0.810
–0.700
VILmin
–1.890
–1.850
–1.825
VIHAmin
–1.205
–1.105
–1.035
VILAmax
–1.500
–1.475
–1.440
VEE
–5.2
–5.2
–5.2
(VCC)
Gnd
16
16
16
16
16
16
16
16
16
16
16
16
16
16
+2.0 V
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
VIHmax
VILmin
VIHAmin
VILAmax
VEE
8
8
8
8
8
8
8
8
8
8
8
8
8
8
–3.2 V
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
Characteristic
Power Supply Drain Current
Input Current
Symbol
IE
Clock Input
Select Input
Setup TIme
Hold TIme
Rise Time
Fall Time
Data Input
Select Input
Data Input
Select Input
(20 to 80%)
(20 to 80%)
* VILmin applied to each input pin, one at a time.
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.
MECL Data
DL122 — Rev 6
3–119
MOTOROLA
MC10173
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
B
–N–
Y BRK
D
–L–
–M–
W
D
Z
0.007 (0.180)
M
T L–M
U
S
N
S
S
0.007 (0.180)
M
T L–M
N
S
20
1
X
V
VIEW D–D
G1
0.010 (0.250)
S
T L–M
S
N
S
A
Z
R
0.007 (0.180)
M
T L–M
0.007 (0.180)
M
T L–M
S
N
N
S
S
S
H
0.007 (0.180)
M
T L–M
S
N
S
C
E
0.004 (0.100)
G
G1
0.010 (0.250)
S
T L–M
J
–T–
SEATING
PLANE
K1
K
F
VIEW S
0.007 (0.180)
M
VIEW S
S
T L–M
S
N
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2
_
10
_
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2
_
10
_
7.88
8.38
1.02
–––
MOTOROLA
3–120
MECL Data
DL122 — Rev 6
MC10173
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
9
–A–
16
–B–
1
8
C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
_
15
_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
_
15
_
0.51
1.01
–T–
SEATING
PLANE
N
E
F
D
G
16 PL
K
M
J
16 PL
0.25 (0.010)
M
M
T B
S
0.25 (0.010)
T A
S
–A–
16
9
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
B
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
_
10
_
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
_
10
_
0.51
1.01
F
S
C
L
–T–
H
G
D
16 PL
SEATING
PLANE
K
J
T A
M
M
0.25 (0.010)
M
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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