1. Within-device skew is defined as identical transitions on similar paths through a device.
MOTOROLA
2–2
ECLinPS and ECLinPS Lite
DL140 — Rev 4
MC10E107 MC100E107
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180)
U
T L –M
M
B
-N-
Y BRK
M
S
N
S
S
0.007 (0.180)
T L –M
N
S
D
Z
-L-
-M-
W
28
1
D
X
VIEW D-D
G1
0.010 (0.250)
S
V
T L –M
S
N
S
A
Z
R
0.007 (0.180)
0.007 (0.180)
M
T L –M
T L –M
S
N
N
S
H
S
0.007 (0.180)
M
T L –M
S
N
S
M
S
C
E
G
G1
0.010 (0.250)
S
K1
0.004 (0.100)
J
-T-
SEATING
PLANE
K
F
VIEW S
0.007 (0.180)
M
VIEW S
T L –M
S
T L –M
S
N
S
N
S
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485 0.495
0.485 0.495
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
0.026 0.032
0.020
—
0.025
—
0.450 0.456
0.450 0.456
0.042 0.048
0.042 0.048
0.042 0.056
—
0.020
2°
10°
0.410 0.430
0.040
—
MILLIMETERS
MIN
MAX
12.32 12.57
12.32 12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
—
0.64
—
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
—
0.50
2°
10°
10.42 10.92
1.02
—
ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–3
MOTOROLA
MC10E107 MC100E107
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