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MC10H113L

10H SERIES, QUAD 2-INPUT XOR GATE, CDIP16, CERAMIC, DIP-16

器件类别:逻辑   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

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器件参数
参数名称
属性值
是否无铅
含铅
厂商名称
Rochester Electronics
零件包装代码
DIP
包装说明
CERAMIC, DIP-16
针数
16
Reach Compliance Code
unknown
Is Samacsys
N
系列
10H
JESD-30 代码
R-GDIP-T16
JESD-609代码
e0
长度
19.49 mm
逻辑集成电路类型
XOR GATE
湿度敏感等级
NOT SPECIFIED
功能数量
4
输入次数
2
端子数量
16
最高工作温度
75 °C
最低工作温度
封装主体材料
CERAMIC, GLASS-SEALED
封装代码
DIP
封装形状
RECTANGULAR
封装形式
IN-LINE
峰值回流温度(摄氏度)
235
传播延迟(tpd)
1.8 ns
认证状态
COMMERCIAL
座面最大高度
5.08 mm
表面贴装
NO
技术
ECL
温度等级
COMMERCIAL EXTENDED
端子面层
TIN LEAD
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
7.62 mm
Base Number Matches
1
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MC10H113
Quad Exclusive OR Gate
Description
The MC10H113 is a Quad Exclusive OR Gate with an enable
common to all four gates. The outputs may be wire−ORed together to
perform a 4−bit comparison function (A = B). The enable is active
LOW.
Features
http://onsemi.com
MARKING DIAGRAMS*
16
MC10H113L
AWLYYWW
CDIP−16
L SUFFIX
CASE 620A
1
Propagation Delay, 1.3 ns Typical
Power Dissipation 175 mW Typ/Pkg (No Load)
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K™ Compatible
Pb−Free Packages are Available*
16
16
1
PDIP−16
P SUFFIX
CASE 648
1
MC10H113P
AWLYYWWG
10H113
ALYWG
SOEIAJ−16
CASE 966
1 20
20 1
PLLC−20
FN SUFFIX
CASE 775
A
WL, L
YY, Y
WW, W
G
10H113G
AWLYYWW
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
February, 2006
Rev. 8
1
Publication Order Number:
MC10H113/D
MC10H113
E
4
5
9
2
L
L
TRUTH TABLE
IN
L
H
L
H
X
E OUTPUT
L
L
L
L
L
H
H
H
L
L
6
7
3
H
H
X
V
CC1
A
out
B
out
A
in
A
in
B
in
Bin
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
D
out
C
out
D
in
D
in
C
in
C
in
Enable
10
11
V
CC1
= Pin 1
V
CC2
= Pin 16
14 V
EE
= Pin 8
12
13
15
V
EE
Pin assignment is for Dual−in−Line Package.
Figure 1. Logic Diagram
Figure 2. Pin Assignment
Table 1. MAXIMUM RATINGS
Symbol
V
EE
V
I
I
out
T
A
T
stg
Power Supply (V
CC
= 0)
Input Voltage (V
CC
= 0)
Output Current
Operating Temperature Range
Storage Temperature Range
Plastic
Ceramic
Continuous
Surge
Characteristic
Rating
−8.0
to 0
0 to V
EE
50
100
0 to +75
−55
to +150
−55
to +165
Unit
Vdc
Vdc
mA
°C
°C
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS
(V
EE
=
−5.2
V
±5%)
(Note 1)
Symbol
I
E
I
inH
Characteristic
Power Supply Current
Input Current High
Pins 5, 7, 11, 13
Pins 4, 6, 10, 12
Pin 9
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
Min
0.5
−1.02
−1.95
−1.17
−1.95
Max
46
430
510
1100
−0.84
−1.63
−0.84
−1.48
Min
0.5
−0.98
−1.95
−1.13
−1.95
25°
Max
42
270
320
740
−0.81
−1.63
−0.81
−1.48
Min
0.3
−0.92
−1.95
−1.07
−1.95
75°
Max
46
270
320
740
−0.735
−1.60
−0.735
−1.45
mA
Vdc
Vdc
Vdc
Vdc
Unit
mA
mA
I
inL
V
OH
V
OL
V
IH
V
IL
1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50
W
resistor to
−2.0
V.
http://onsemi.com
2
MC10H113
Table 3. AC CHARACTERISTICS
Symbol
t
pd
Characteristic
Propagation Delay
Data
Enable
Rise Time
Fall Time
Min
0.4
0.5
0.5
0.5
Max
1.7
2.3
1.8
1.8
Min
0.4
0.5
0.6
0.6
25°
Max
1.8
2.4
1.9
1.9
Min
0.5
0.6
0.6
0.6
75°
Max
1.9
2.5
2.0
2.0
ns
ns
Unit
ns
t
r
t
f
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
ORDERING INFORMATION
Device
MC10H113FN
MC10H113FNG
MC10H113FNR2
MC10H113FNR2G
MC10H113L
MC10H113M
MC10H113MG
MC10H113MEL
MC10H113MELG
MC10H113P
MC10H113PG
Package
PLLC−20
PLLC−20
(Pb−Free)
PLLC−20
PLLC−20
(Pb−Free)
CDIP−16
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
PDIP−16
PDIP−16
(Pb−Free)
Shipping
46 Units / Rail
46 Units / Rail
500 / Tape & Reel
500 / Tape & Reel
25 Unit / Rail
50 Unit / Rail
50 Unit / Rail
2000 / Tape & Reel
2000 / Tape & Reel
25 Unit / Rail
25 Unit / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
3
MC10H113
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
B
−N−
Y BRK
D
−L−
−M−
W
D
V
0.010 (0.250)
T L−M
N
Z
0.007 (0.180)
M
T L−M
U
S
N
S
S
0.007 (0.180)
M
T L−M
N
S
20
1
X
VIEW D−D
G1
S
S
S
A
Z
R
0.007 (0.180)
M
T L−M
0.007 (0.180)
M
T L−M
S
N
N
S
S
S
H
K1
0.007 (0.180)
M
T L−M
S
N
S
C
E
G
G1
0.010 (0.250)
S
T L−M
0.004 (0.100)
J
−T−
VIEW S
S
SEATING
PLANE
K
F
VIEW S
0.007 (0.180)
M
T L−M
S
N
S
N
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS
−L−, −M−,
AND
−N−
DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM
−T−,
SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2
_
10
_
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2
_
10
_
7.88
8.38
1.02
−−−
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参数对比
与MC10H113L相近的元器件有:MC10H113M、MC10H113MEL、MC10H113FN、MC10H113P。描述及对比如下:
型号 MC10H113L MC10H113M MC10H113MEL MC10H113FN MC10H113P
描述 10H SERIES, QUAD 2-INPUT XOR GATE, CDIP16, CERAMIC, DIP-16 10H SERIES, QUAD 2-INPUT XOR GATE, PDSO16, EIAJ, SO-16 10H SERIES, QUAD 2-INPUT XOR GATE, PDSO16, EIAJ, SO-16 10H SERIES, QUAD 2-INPUT XOR GATE, PQCC20, PLASTIC, LCC-20 10H SERIES, QUAD 2-INPUT XOR GATE, PDIP16, PLASTIC, DIP-16
零件包装代码 DIP SOIC SOIC QLCC DIP
包装说明 CERAMIC, DIP-16 SOP, SOP, PLASTIC, LCC-20 PLASTIC, DIP-16
针数 16 16 16 20 16
Reach Compliance Code unknown unknown unknown unknown unknown
系列 10H 10H 10H 10H 10H
JESD-30 代码 R-GDIP-T16 R-PDSO-G16 R-PDSO-G16 S-PQCC-J20 R-PDIP-T16
长度 19.49 mm 10.2 mm 10.2 mm 8.965 mm 19.175 mm
逻辑集成电路类型 XOR GATE XOR GATE XOR GATE XOR GATE XOR GATE
功能数量 4 4 4 4 4
输入次数 2 2 2 2 2
端子数量 16 16 16 20 16
最高工作温度 75 °C 75 °C 75 °C 75 °C 75 °C
封装主体材料 CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP SOP SOP QCCJ DIP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE SMALL OUTLINE CHIP CARRIER IN-LINE
传播延迟(tpd) 1.8 ns 1.8 ns 1.8 ns 1.8 ns 1.8 ns
认证状态 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
座面最大高度 5.08 mm 2.05 mm 2.05 mm 4.57 mm 4.44 mm
表面贴装 NO YES YES YES NO
技术 ECL ECL ECL ECL ECL
温度等级 COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
端子面层 TIN LEAD NOT SPECIFIED NOT SPECIFIED TIN LEAD TIN LEAD
端子形式 THROUGH-HOLE GULL WING GULL WING J BEND THROUGH-HOLE
端子节距 2.54 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm
端子位置 DUAL DUAL DUAL QUAD DUAL
宽度 7.62 mm 5.275 mm 5.275 mm 8.965 mm 7.62 mm
是否无铅 含铅 - - 不含铅 含铅
厂商名称 Rochester Electronics - - Rochester Electronics Rochester Electronics
JESD-609代码 e0 - - e0 e0
湿度敏感等级 NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED
峰值回流温度(摄氏度) 235 - - 240 NOT SPECIFIED
处于峰值回流温度下的最长时间 NOT SPECIFIED - - 30 NOT SPECIFIED
Base Number Matches 1 1 1 - -
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00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
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