描述 |
Logic Gates 4 Wide OR-AND/OR-AND |
Logic Gates 4 Wide OR-AND/OR-AND |
Logic Gates 4 Wide OR-AND/OR-AND Invert |
Logic Gates 4 Wide OR-AND/OR-AND Invert |
Logic Gates 4 Wide OR-AND/OR-AND |
Logic Gates 4 Wide OR-AND/OR-AND Invert |
Logic Gates 4 Wide OR-AND/OR-AND |
Logic Gates 4 Wide OR-AND/OR-AND Invert |
是否Rohs认证 |
符合 |
不符合 |
符合 |
符合 |
不符合 |
符合 |
不符合 |
符合 |
厂商名称 |
ON Semiconductor(安森美) |
ON Semiconductor(安森美) |
ON Semiconductor(安森美) |
ON Semiconductor(安森美) |
ON Semiconductor(安森美) |
ON Semiconductor(安森美) |
ON Semiconductor(安森美) |
ON Semiconductor(安森美) |
零件包装代码 |
SOIC |
DIP |
QLCC |
SOIC |
QLCC |
SOIC |
QLCC |
QLCC |
包装说明 |
EIAJ, SO-16 |
PLASTIC, DIP-16 |
LEAD FREE, PLASTIC, LCC-20 |
LEAD FREE, EIAJ, SO-16 |
PLASTIC, LCC-20 |
LEAD FREE, EIAJ, SO-16 |
PLASTIC, LCC-20 |
LEAD FREE, PLASTIC, LCC-20 |
针数 |
16 |
16 |
20 |
16 |
20 |
16 |
20 |
20 |
Reach Compliance Code |
unknown |
not_compliant |
unknown |
unknown |
not_compliant |
unknown |
not_compliant |
unknown |
系列 |
10H |
10H |
10H |
10H |
10H |
10H |
10H |
10H |
JESD-30 代码 |
R-PDSO-G16 |
R-PDIP-T16 |
S-PQCC-J20 |
R-PDSO-G16 |
S-PQCC-J20 |
R-PDSO-G16 |
S-PQCC-J20 |
S-PQCC-J20 |
JESD-609代码 |
e4 |
e0 |
e3 |
e4 |
e0 |
e4 |
e0 |
e3 |
长度 |
10.2 mm |
19.175 mm |
8.965 mm |
10.2 mm |
8.965 mm |
10.2 mm |
8.965 mm |
8.965 mm |
逻辑集成电路类型 |
OR-AND/OR-AND-INVERT GATE |
OR-AND/OR-AND-INVERT GATE |
OR-AND/OR-AND-INVERT GATE |
OR-AND/OR-AND-INVERT GATE |
OR-AND/OR-AND-INVERT GATE |
OR-AND/OR-AND-INVERT GATE |
OR-AND/OR-AND-INVERT GATE |
OR-AND/OR-AND-INVERT GATE |
功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
输入次数 |
11 |
11 |
11 |
11 |
11 |
11 |
11 |
11 |
端子数量 |
16 |
16 |
20 |
16 |
20 |
16 |
20 |
20 |
最高工作温度 |
75 °C |
75 °C |
75 °C |
75 °C |
75 °C |
75 °C |
75 °C |
75 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
SOP |
DIP |
QCCJ |
SOP |
QCCJ |
SOP |
QCCJ |
QCCJ |
封装等效代码 |
SOP16,.3 |
DIP16,.3 |
LDCC20,.4SQ |
SOP16,.3 |
LDCC20,.4SQ |
SOP16,.3 |
LDCC20,.4SQ |
LDCC20,.4SQ |
封装形状 |
RECTANGULAR |
RECTANGULAR |
SQUARE |
RECTANGULAR |
SQUARE |
RECTANGULAR |
SQUARE |
SQUARE |
封装形式 |
SMALL OUTLINE |
IN-LINE |
CHIP CARRIER |
SMALL OUTLINE |
CHIP CARRIER |
SMALL OUTLINE |
CHIP CARRIER |
CHIP CARRIER |
包装方法 |
TAPE AND REEL |
RAIL |
TAPE AND REEL |
TAPE AND REEL |
TAPE AND REEL |
RAIL |
RAIL |
RAIL |
Prop。Delay @ Nom-Sup |
2.4 ns |
2.4 ns |
2.4 ns |
2.4 ns |
2.4 ns |
2.4 ns |
2.4 ns |
2.4 ns |
传播延迟(tpd) |
2 ns |
2 ns |
2 ns |
2 ns |
2 ns |
2 ns |
2 ns |
2 ns |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
施密特触发器 |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
座面最大高度 |
2.05 mm |
4.44 mm |
4.57 mm |
2.05 mm |
4.57 mm |
2.05 mm |
4.57 mm |
4.57 mm |
表面贴装 |
YES |
NO |
YES |
YES |
YES |
YES |
YES |
YES |
技术 |
ECL |
ECL |
ECL |
ECL |
ECL |
ECL |
ECL |
ECL |
温度等级 |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
COMMERCIAL EXTENDED |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Lead (Sn80Pb20) |
Tin (Sn) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Lead (Sn80Pb20) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Lead (Sn80Pb20) |
Tin (Sn) |
端子形式 |
GULL WING |
THROUGH-HOLE |
J BEND |
GULL WING |
J BEND |
GULL WING |
J BEND |
J BEND |
端子节距 |
1.27 mm |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
端子位置 |
DUAL |
DUAL |
QUAD |
DUAL |
QUAD |
DUAL |
QUAD |
QUAD |
宽度 |
5.275 mm |
7.62 mm |
8.965 mm |
5.275 mm |
8.965 mm |
5.275 mm |
8.965 mm |
8.965 mm |
峰值回流温度(摄氏度) |
- |
NOT SPECIFIED |
260 |
260 |
240 |
260 |
240 |
260 |
处于峰值回流温度下的最长时间 |
- |
NOT SPECIFIED |
40 |
40 |
30 |
40 |
30 |
40 |