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MC10H131MEL

10H SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16
10H 系列, 正边沿触发D触发器, 互补输出, PDIP16

器件类别:逻辑    逻辑   

厂商名称:ON Semiconductor(安森美)

厂商官网:http://www.onsemi.cn

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
ON Semiconductor(安森美)
零件包装代码
SOIC
包装说明
EIAJ, SOP-16
针数
16
Reach Compliance Code
unknow
系列
10H
JESD-30 代码
R-PDSO-G16
JESD-609代码
e4
长度
10.2 mm
逻辑集成电路类型
D FLIP-FLOP
最大频率@ Nom-Su
250000000 Hz
位数
2
功能数量
1
端子数量
16
最高工作温度
75 °C
最低工作温度
输出极性
COMPLEMENTARY
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP16,.3
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
包装方法
TAPE AND REEL
最大电源电流(ICC)
62 mA
传播延迟(tpd)
1.7 ns
认证状态
Not Qualified
座面最大高度
2.05 mm
表面贴装
YES
技术
ECL
温度等级
COMMERCIAL EXTENDED
端子面层
Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
触发器类型
POSITIVE EDGE
宽度
5.275 mm
最小 fmax
250 MHz
文档预览
MC10H131
Dual D Type Master‐Slave
Flip‐Flop
Description
The MC10H131 is a MECL 10H™ part which is a functional/pinout
duplication of the standard MECL 10K™ family part, with 100%
improvement in clock speed and propagation delay and no increase in
power-supply current.
Features
www.onsemi.com
Propagation Delay, 1.0 ns Typical
Power Dissipation, 235 mW Typical
Improved Noise Margin 150 mV (Over Operating Voltage and
16
1
PDIP−16
P SUFFIX
CASE 648−08
20
1
PLLC−20
FN SUFFIX
CASE 775−02
Temperature Range)
Voltage Compensated
MECL 10K Compatible
These Devices are Pb-Free, Halogen Free and are RoHS Compliant
MARKING DIAGRAMS*
1 20
16
MC10H131P
AWLYYWWG
1
10H131G
AWLYYWW
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
*For additional marking information, refer to
Application Note
AND8002/D.
ORDERING INFORMATION
Device
MC10H131FNG
MC10H131FNR2G
MC10H131PG
Package
PLCC−20
(Pb-Free)
PLCC−20
(Pb-Free)
PDIP−16
(Pb-Free)
Shipping
46 Units/Tube
500/Tape & Reel
25 Units/Tube
†For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure,
BRD8011/D.
©
Semiconductor Components Industries, LLC, 2016
August, 2016
Rev. 8
1
Publication Order Number:
MC10H131/D
MC10H131
S1 5
D1 7
CE1 6
Q1
Q1
R1 4
C
C
9
R2 13
Q2
CE2 11
D2 10
S2 12
Q2
2
3
Table 1. RS TRUTH TABLE
R
L
L
H
H
ND = Not Defined
14
15
S
L
H
L
H
Q
n+1
Q
n
H
L
ND
V
CC1
= PIN 1
V
CC2
= PIN 16
V
EE
= PIN 8
Table 2. CLOCKED TRUTH TABLE
C
L
D
X
L
H
Q
n+1
Q
n
L
H
Figure 1. Logic Diagram
H
H
V
CC1
Q1
Q1
R1
S1
C
E1
D1
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
Q2
Q2
R2
S2
C
E2
D2
C
C
C = CE + C
C
A clock H is a clock transition from a low to a high state.
Pin assignment is for Dual-in-Line Package.
Figure 2. Pin Assignment
Table 3. MAXIMUM RATINGS
Symbol
V
EE
V
I
I
out
Power Supply (V
CC
= 0)
Input Voltage (V
CC
= 0)
Output Current
Continuous
Surge
Operating Temperature Range
Storage Temperature Range
Plastic
Ceramic
Characteristic
Rating
−8.0
to 0
0 to V
EE
50
100
0 to +75
−55
to +150
−55
to +165
Unit
Vdc
Vdc
mA
T
A
T
stg
°C
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
MC10H131
Table 4. ELECTRICAL CHARACTERISTICS
(V
EE
=
−5.2
V
±5%)
(Note 1)
Symbol
I
E
I
inH
Characteristic
Power Supply Current
Input Current High
Pins 6, 11
Pin 9
Pins 7, 10
Pins 4, 5, 12, 13
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
Min
0.5
−1.02
−1.95
−1.17
−1.95
Max
62
530
660
485
790
−0.84
−1.63
−0.84
−1.48
Min
0.5
−0.98
−1.95
−1.13
−1.95
25°
Max
56
310
390
285
465
−0.81
−1.63
−0.81
−1.48
Min
0.3
−0.92
−1.95
−1.07
−1.95
75°
Max
62
310
390
285
465
−0.735
−1.60
−0.735
−1.45
Unit
mA
mA
I
inL
V
OH
V
OL
V
IH
V
IL
mA
Vdc
Vdc
Vdc
Vdc
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50
W
resistor to
−2.0
V.
Table 5. AC CHARACTERISTICS
Symbol
t
pd
Characteristic
Propagation Delay
Clock, CE
Set, Reset
Rise Time
Fall Time
Set-up Time
Hold Time
Toggle Frequency
Min
0.8
0.6
0.6
0.6
0.7
0.8
250
Max
1.6
1.6
2.0
2.0
Min
0.8
0.7
0.6
0.6
0.7
0.8
250
25°
Max
1.7
1.7
2.0
2.0
Min
0.8
0.7
0.6
0.6
0.7
0.8
250
75°
Max
1.8
1.8
2.2
2.2
Unit
ns
t
r
t
f
t
set
t
hold
f
tog
ns
ns
ns
ns
MHz
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
APPLICATION INFORMATION
The MC10H131 is a dual master-slave type D flip-flop.
Asynchronous Set (S) and Reset (R) override Clock (C
C
)
and Clock Enable (CE) inputs. Each flip-flop may be
clocked separately by holding the common clock in the new
low state and using the enable inputs for the clocking
function. If the common clock is to be used to clock the
flip-flop, the Clock Enable inputs must be in the low state.
In this case, the enable inputs perform the function of
controlling the common clock.
The output states of the flip-flop change on the positive
transition of the clock. A change in the information present
at the data (D) input will not affect the output information at
any other time due to master slave construction.
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3
MC10H131
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE F
B
−N−
Y BRK
D
−L−
−M−
W
D
V
Z
0.007 (0.180)
U
M
T L-M
M
S
N
S
S
0.007 (0.180)
T L-M
N
S
20
1
X
VIEW D−D
G1
0.010 (0.250)
S
T L-M
S
N
S
A
Z
R
0.007 (0.180)
0.007 (0.180)
M
T L-M
T L-M
S
N
N
S
M
S
S
H
K1
0.007 (0.180)
M
T L-M
S
N
S
C
E
0.004 (0.100)
G
G1
0.010 (0.250)
S
T L-M
J
−T−
VIEW S
S
SEATING
PLANE
K
F
VIEW S
0.007 (0.180)
M
T L-M
S
N
S
N
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS
−L−, −M−,
AND
−N−
DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM
−T−,
SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.021
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2
_
10
_
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.53
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2
_
10
_
7.88
8.38
1.02
−−−
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4
MC10H131
PACKAGE DIMENSIONS
PDIP−16
CASE 648−08
ISSUE V
D
16
9
A
H
E1
E
1
NOTE 8
b2
TOP VIEW
8
B
A2
A
L
c
WITH LEADS CONSTRAINED
NOTE 5
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
DIM
A
A1
A2
b
b2
C
D
D1
E
E1
e
eB
L
M
INCHES
MIN
MAX
−−−−
0.210
0.015
−−−−
0.115 0.195
0.014 0.022
0.060 TYP
0.008 0.014
0.735 0.775
0.005
−−−−
0.300 0.325
0.240 0.280
0.100 BSC
−−−−
0.430
0.115 0.150
−−−−
10
°
MILLIMETERS
MIN
MAX
−−−
5.33
0.38
−−−
2.92
4.95
0.35
0.56
1.52 TYP
0.20
0.36
18.67 19.69
0.13
−−−
7.62
8.26
6.10
7.11
2.54 BSC
−−−
10.92
2.92
3.81
−−−
10
°
e/2
NOTE 3
A1
D1
e
SIDE VIEW
16X
b
C
SEATING
PLANE
M
eB
END VIEW
0.010
M
C A
M
B
M
NOTE 6
STYLE 1:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. CATHODE
9. ANODE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
15. ANODE
16. ANODE
STYLE 2:
PIN 1. COMMON DRAIN
2. COMMON DRAIN
3. COMMON DRAIN
4. COMMON DRAIN
5. COMMON DRAIN
6. COMMON DRAIN
7. COMMON DRAIN
8. COMMON DRAIN
9. GATE
10. SOURCE
11. GATE
12. SOURCE
13. GATE
14. SOURCE
15. GATE
16. SOURCE
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5
MC10H131/D
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参数对比
与MC10H131MEL相近的元器件有:MC10H131_06、MC10H131。描述及对比如下:
型号 MC10H131MEL MC10H131_06 MC10H131
描述 10H SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16 10H SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16 10H SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16
系列 10H 10H 10H
位数 2 2 2
功能数量 1 1 1
端子数量 16 16 16
输出极性 COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
温度等级 COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
端子形式 GULL WING THROUGH-HOLE THROUGH-HOLE
端子位置 DUAL DUAL DUAL
触发器类型 POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
最大工作温度 - 75 Cel 75 Cel
最小工作温度 - 0.0 Cel 0.0 Cel
加工封装描述 - LEAD FREE, PLASTIC, DIP-16 LEAD FREE, PLASTIC, DIP-16
状态 - ACTIVE ACTIVE
工艺 - ECL ECL
包装形状 - RECTANGULAR RECTANGULAR
包装尺寸 - IN-LINE IN-LINE
端子间距 - 2.54 mm 2.54 mm
端子涂层 - TIN LEAD TIN LEAD
包装材料 - PLASTIC/EPOXY PLASTIC/EPOXY
输出特性 - O-EMT O-EMT
逻辑IC类型 - D FLIP-FLOP D FLIP-FLOP
传播延迟TPD - 1.7 ns 1.7 ns
最大-最小频率 - 250 MHz 250 MHz
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