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MC10H172

Dual Binary to 1-4-Decoder(High)

厂商名称:Motorola ( NXP )

厂商官网:https://www.nxp.com

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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Dual Binary to 1-4-Decoder
(High)
The MC10H172 is a binary coded 2 line to dual 4 line decoder with
selected outputs high. With either E0 or E1 low, the corresponding
selected 4 outputs are low. The common enable E, when high, forces all
outputs low.
Propagation Delay, 2 ns Typical
Power Dissipation 325 mW Typical (same as MECL 10K)
Improved Noise Margin 150 mV (over operating voltage and
temperature range)
Voltage Compensated
MECL 10K–Compatible
MC10H172
L SUFFIX
CERAMIC PACKAGE
CASE 620–10
P SUFFIX
PLASTIC PACKAGE
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
MAXIMUM RATINGS
Characteristic
Power Supply (VCC = 0)
Input Voltage (VCC = 0)
Output Current — Continuous
— Surge
Operating Temperature Range
Storage Temperature Range — Plastic
— Ceramic
Symbol
VEE
VI
Iout
TA
Tstg
Rating
–8 to 0
0 to VEE
50
100
0 to +75
–55 to +150
–55 to +165
Unit
Vdc
Vdc
mA
E0 14
LOGIC DIAGRAM
10 Q0 3
11 Q0 2
12 Q0 1
°C
°C
B7
4 Q1 2
E 15
Max
85
265
–0.735
–1.60
–0.735
–1.45
Unit
mA
µA
µA
Vdc
Vdc
Vdc
Vdc
VCC1
25°
Max
2.0
2.6
1.7
1.7
Min
0.5
0.5
0.5
0.5
Max
2.1
2.7
1.8
1.8
Min
0.5
0.5
0.5
0.5
75°
Max
2.2
2.8
1.9
1.9
ns
ns
Unit
ns
0.5
0.5
tr
tf
0.5
0.5
E1
Q13
Q12
Q11
Q10
B
VEE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VCC2
E
E0
Q00
Q01
Q02
Q03
A
E1 2
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
5 Q1 1
6 Q1 0
A9
13 Q0 0
3 Q1 3
ELECTRICAL CHARACTERISTICS
(VEE = –5.2 V
±5%)
(See Note)
Characteristic
Power Supply Current
Input Current High
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
Symbol
IE
IinH
IinL
VOH
VOL
VIH
VIL
Min
0.5
–1.02
–1.95
–1.17
–1.95
Max
85
425
–0.84
–1.63
–0.84
–1.48
Min
0.5
25°
Max
77
265
Min
0.3
–0.92
–1.95
–1.07
–1.95
75°
–0.98 –0.81
–1.95 –1.63
–1.13 –0.81
–1.95 –1.48
DIP
PIN ASSIGNMENT
AC PARAMETERS
Characteristic
Propagation Delay
Data
Select
Rise Time
Fall Time
Symbol
tpd
Min
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed
circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated
through a 50–ohm resistor to –2.0 volts.
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–36 of the Motorola MECL Data
Book (DL122/D).
3/93
©
Motorola, Inc. 1996
2–33
REV 5
MC10H172
TRUTH TABLE
Enable Inputs
E
L
L
L
L
L
L
H
E1
H
H
H
H
L
H
X
E0
H
H
H
H
H
L
X
A
L
L
H
H
L
L
X
Inputs
B
L
H
L
H
L
L
X
Q1 0
H
L
L
L
L
H
L
Q1 1
L
H
L
L
L
L
L
Q1 2
L
L
H
L
L
L
L
Outputs
Q1 3
L
L
L
H
L
L
L
Q0 0
H
L
L
L
H
L
L
Q0 1
L
H
L
L
L
L
L
Q0 2
L
L
H
L
L
L
L
Q0 3
L
L
L
H
L
L
L
X = Don’t Care
MOTOROLA
2–34
MECL Data
DL122 — Rev 6
MC10H172
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
B
–N–
Y BRK
D
–L–
–M–
W
D
Z
0.007 (0.180)
M
T L–M
U
S
N
S
S
0.007 (0.180)
M
T L–M
N
S
20
1
X
V
VIEW D–D
G1
0.010 (0.250)
S
T L–M
S
N
S
A
Z
R
0.007 (0.180)
M
T L–M
0.007 (0.180)
M
T L–M
S
N
N
S
S
S
H
0.007 (0.180)
M
T L–M
S
N
S
C
E
0.004 (0.100)
G
G1
0.010 (0.250)
S
T L–M
J
–T–
SEATING
PLANE
K1
K
F
VIEW S
0.007 (0.180)
M
VIEW S
S
T L–M
S
N
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2
_
10
_
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2
_
10
_
7.88
8.38
1.02
–––
MECL Data
DL122 — Rev 6
2–35
MOTOROLA
MC10H172
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
9
–A–
16
–B–
1
8
C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
_
15
_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
_
15
_
0.51
1.01
–T–
SEATING
PLANE
N
E
F
D
G
16 PL
K
M
J
16 PL
0.25 (0.010)
M
M
T B
S
0.25 (0.010)
T A
S
–A–
16
9
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
B
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
_
10
_
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
_
10
_
0.51
1.01
F
S
C
L
–T–
H
G
D
16 PL
SEATING
PLANE
K
J
T A
M
M
0.25 (0.010)
M
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE/Locations Not Listed:
Motorola Literature Distribution;
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454
MFAX:
RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609
INTERNET:
http://Design–NET.com
JAPAN:
Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315
ASIA/PACIFIC:
Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298
MOTOROLA
2–36
*MC10H172/D*
MC10H172/D
MECL Data
DL122 — Rev 6
查看更多>
参数对比
与MC10H172相近的元器件有:MC10H172P、MC10H172L、MC10H172FN。描述及对比如下:
型号 MC10H172 MC10H172P MC10H172L MC10H172FN
描述 Dual Binary to 1-4-Decoder(High) Dual Binary to 1-4-Decoder(High) Dual Binary to 1-4-Decoder(High) Dual Binary to 1-4-Decoder(High)
厂商名称 - Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
包装说明 - PLASTIC, DIP-16 DIP, DIP16,.3 QCCJ, LDCC20,.4SQ
Reach Compliance Code - unknow unknow unknow
ECCN代码 - EAR99 EAR99 EAR99
系列 - 10H 10H 10H
JESD-30 代码 - R-PDIP-T16 R-GDIP-T16 S-PQCC-J20
JESD-609代码 - e0 e0 e0
长度 - 19.175 mm 19.495 mm 8.9662 mm
逻辑集成电路类型 - OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER
功能数量 - 2 2 2
端子数量 - 16 16 20
最高工作温度 - 75 °C 75 °C 75 °C
输出特性 - OPEN-EMITTER OPEN-EMITTER OPEN-EMITTER
输出极性 - INVERTED INVERTED INVERTED
封装主体材料 - PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY
封装代码 - DIP DIP QCCJ
封装等效代码 - DIP16,.3 DIP16,.3 LDCC20,.4SQ
封装形状 - RECTANGULAR RECTANGULAR SQUARE
封装形式 - IN-LINE IN-LINE CHIP CARRIER
最大电源电流(ICC) - 85 mA 85 mA 85 mA
Prop。Delay @ Nom-Su - 2.8 ns 2.8 ns 2.8 ns
传播延迟(tpd) - 2.8 ns 2.8 ns 2.8 ns
认证状态 - Not Qualified Not Qualified Not Qualified
座面最大高度 - 4.44 mm 5.08 mm 4.57 mm
表面贴装 - NO NO YES
技术 - ECL ECL ECL
温度等级 - COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
端子面层 - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 - THROUGH-HOLE THROUGH-HOLE J BEND
端子节距 - 2.54 mm 2.54 mm 1.27 mm
端子位置 - DUAL DUAL QUAD
宽度 - 7.62 mm 7.62 mm 8.9662 mm
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