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MC10H174
Dual 4 to 1 Multiplexer
Description
The MC10H174 is a Dual 4−to−1 Multiplexer. This device is a
functional/ pinout duplication of the standard MECL 10K™ part, with
100% improvement in propagation delay and no increase in power
supply current.
Features
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MARKING DIAGRAMS*
16
MC10H174L
AWLYYWW
CDIP−16
L SUFFIX
CASE 620A
1
•
Propagation Delay, 1.5 ns Typical
•
Power Dissipation, 305 mW Typical
•
Improved Noise Margin 150 mV (over operating voltage and
temperature range)
•
Voltage Compensated
•
MECL 10K Compatible
•
Pb−Free Packages are Available*
16
16
1
PDIP−16
P SUFFIX
CASE 648
1
MC10H174P
AWLYYWWG
10H174
ALYWG
SOEIAJ−16
CASE 966
1 20
20 1
PLLC−20
FN SUFFIX
CASE 775
A
WL, L
YY, Y
WW, W
G
10H174G
AWLYYWW
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
February, 2006
−
Rev. 8
1
Publication Order Number:
MC10H174/D
MC10H174
LOGIC DIAGRAM
X0
X1
X2
X3
A
B
3
5
4
6
7
9
V
CC1
= PIN 1
V
CC2
= PIN 16
V
EE
= PIN 8
2Z
DIP PIN ASSIGNMENT
V
CC1
Q0
DO0
DO2
DO1
DO3
A
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
Q1
ENABLE
D10
D12
D11
D13
B
ENABLE 14
Y0 13
Y1
11
15 W
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
Y2 12
Y3 10
TRUTH TABLE
ENABLE
E
H
L
L
L
L
ADDRESS INPUTS
B
X
L
L
H
H
A
X
L
H
L
H
OUTPUTS
Z
L
X0
X1
X2
X3
W
L
Y0
Y1
Y2
Y3
Table 1. MAXIMUM RATINGS
Symbol
V
EE
V
I
I
out
T
A
T
stg
Power Supply (V
CC
= 0)
Input Voltage (V
CC
= 0)
Output Current
−
Continuous
−
Surge
Characteristic
Rating
−8.0
to 0
0 to V
EE
50
100
0 to +75
−55
to +150
−55
to +165
Unit
Vdc
Vdc
mA
°C
°C
°C
Operating Temperature Range
Storage Temperature Range
−
Plastic
−
Ceramic
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
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2
MC10H174
Table 2. ELECTRICAL CHARACTERISTICS
(V
EE
=
−5.2
V
±5%)
(Note 1)
0°
Symbol
I
E
I
inH
Characteristic
Power Supply Current
Input Current High
Pins 3−7 & 9−13
Pin 14
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
Min
−
−
−
0.5
−1.02
−1.95
−1.17
−1.95
Max
80
475
670
−
−0.84
−1.63
−0.84
−1.48
Min
−
−
−
0.5
−0.98
−1.95
−1.13
−1.95
25°
Max
73
300
420
−
−0.81
−1.63
−0.81
−1.48
Min
−
−
−
0.3
−0.92
−1.95
−1.07
−1.95
75°
Max
80
300
420
−
−0.735
−1.60
−0.735
−1.45
mA
Vdc
Vdc
Vdc
Vdc
Unit
mA
mAdc
I
inL
V
OH
V
OL
V
IH
V
IL
1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50
W
resistor to
−2.0
V.
Table 3. AC PARAMETERS
0°
Symbol
t
pd
Characteristic
Propagation Delay
Data
Select (A, B)
Enable
Rise Time
Fall Time
Min
0.7
1.0
0.4
0.5
0.5
Max
2.4
2.8
1.45
1.5
1.5
Min
0.8
1.1
0.4
0.5
0.5
25°
Max
2.5
2.9
1.5
1.6
1.6
Min
0.9
1.2
0.5
0.5
0.5
75°
Max
2.6
3.2
1.7
1.7
1.7
ns
ns
Unit
ns
t
r
t
f
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
ORDERING INFORMATION
Device
MC10H174FN
MC10H174FNG
MC10H174FNR2
MC10H174FNR2G
MC10H174L
MC10H174M
MC10H174MG
MC10H174MEL
MC10H174MELG
MC10H174P
MC10H174PG
Package
PLLC−20
PLLC−20
(Pb−Free)
PLLC−20
PLLC−20
(Pb−Free)
CDIP−16
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
PDIP−16
PDIP−16
(Pb−Free)
Shipping
†
46 Units / Rail
46 Units / Rail
500 / Tape & Reel
500 / Tape & Reel
25 Unit / Rail
50 Unit / Rail
50 Unit / Rail
2000 / Tape & Reel
2000 / Tape & Reel
25 Unit / Rail
25 Unit / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC10H174
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
B
−N−
Y BRK
D
−L−
−M−
W
D
V
0.010 (0.250)
T L−M
N
Z
0.007 (0.180)
M
T L−M
U
S
N
S
S
0.007 (0.180)
M
T L−M
N
S
20
1
X
VIEW D−D
G1
S
S
S
A
Z
R
0.007 (0.180)
M
T L−M
0.007 (0.180)
M
T L−M
S
N
N
S
S
S
H
K1
0.007 (0.180)
M
T L−M
S
N
S
C
E
G
G1
0.010 (0.250)
S
T L−M
0.004 (0.100)
J
−T−
VIEW S
S
SEATING
PLANE
K
F
VIEW S
0.007 (0.180)
M
T L−M
S
N
S
N
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS
−L−, −M−,
AND
−N−
DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM
−T−,
SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2
_
10
_
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2
_
10
_
7.88
8.38
1.02
−−−
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4
