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MC10H188
Hex Buffer with Enable
Description
The MC10H188 is a high−speed Hex Buffer with a common Enable
input. When Enable is in the high−state, all outputs are in the
low−state. When Enable is in the low−state, the outputs take the same
state as the inputs.
This MECL 10H™ part is a functional/pinout duplication of the
standard MECL 10K™ family part, with 100% improvement in
propagation delay and no increase in power−supply current.
Features
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MARKING DIAGRAMS*
16
MC10H188L
AWLYYWW
CDIP−16
L SUFFIX
CASE 620A
1
•
Propagation Delay, 1.3 ns Typical Data−to−Output
•
Power Dissipation 180 mW Typ/Pkg (No Load)
•
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
•
Voltage Compensated
•
MECL 10K Compatible
•
Pb−Free Packages are Available*
LOGIC DIAGRAM
9
5
6
7
10
11
12
X
Y
16
2
3
4
13
14
15
TRUTH TABLE
Inputs Output
X Y OUT
L L
L
L H
H
H L
L
H H
L
V
CC1
= Pin 1
V
CC2
= Pin 16
V
EE
= Pin 8
OUT
16
1
PDIP−16
P SUFFIX
CASE 648
1
MC10H188P
AWLYYWWG
10H188
ALYWG
SOEIAJ−16
CASE 966
1 20
DIP
PIN ASSIGNMENT
V
CC1
A
OUT
B
OUT
C
OUT
A
IN
B
IN
C
IN
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
F
OUT
E
OUT
D
OUT
F
IN
E
IN
D
IN
COMMON
*For additional marking information, refer to
Application Note AND8002/D.
20 1
PLLC−20
FN SUFFIX
CASE 775
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
10H188G
AWLYYWW
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
February, 2006
−
Rev. 7
1
Publication Order Number:
MC10H188/D
MC10H188
Table 1. MAXIMUM RATINGS
Symbol
V
EE
V
I
I
out
T
A
T
stg
Power Supply (V
CC
= 0)
Input Voltage (V
CC
= 0)
Output Current
−
Continuous
−
Surge
Characteristic
Rating
−8.0
to 0
0 to V
EE
50
100
0 to +75
−55
to +150
−55
to +165
Unit
Vdc
Vdc
mA
°C
°C
°C
Operating Temperature Range
Storage Temperature Range
−
Plastic
−
Ceramic
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS
(V
EE
=
−5.2
V
±5%)
(Note )
0°
Symbol
I
E
I
inH
I
inL
V
OH
V
OL
V
IH
V
IL
Characteristic
Power Supply Current
Input Current High
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
Min
−
−
0.5
−1.02
−1.95
−1.17
−1.95
Max
46
495
−
−0.84
−1.63
−0.84
−1.48
Min
−
−
0.5
−0.98
−1.95
−1.13
−1.95
25°
Max
42
310
−
−0.81
−1.63
−0.81
−1.48
Min
−
−
0.3
−0.92
−1.95
−1.07
−1.95
75°
Max
46
310
−
−0.735
−1.60
−0.735
−1.45
Unit
mA
mA
mA
Vdc
Vdc
Vdc
Vdc
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50
W
resistor to
−2.0
V.
Table 3. AC PARAMETERS
0°
Symbol
t
pd
Characteristic
Propagation Delay
Enable
Data
Rise Time
Fall Time
Min
0.7
0.7
0.7
0.7
Max
2.2
1.9
2.4
2.4
Min
0.7
0.7
0.7
0.7
25°
Max
2.2
1.9
2.4
2.4
Min
0.7
0.7
0.7
0.7
75°
Max
2.2
1.9
2.4
2.4
ns
ns
Unit
ns
t
r
t
f
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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2
MC10H188
ORDERING INFORMATION
Device
MC10H188FN
MC10H188FNG
MC10H188FNR2
MC10H188FNR2G
MC10H188L
MC10H188M
MC10H188MG
MC10H188MEL
MC10H188MELG
MC10H188P
MC10H188PG
Package
PLLC−20
PLLC−20
(Pb−Free)
PLLC−20
PLLC−20
(Pb−Free)
CDIP−16
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
PDIP−16
PDIP−16
(Pb−Free)
Shipping
†
46 Units / Rail
46 Units / Rail
500 / Tape & Reel
500 / Tape & Reel
25 Unit / Rail
50 Unit / Rail
50 Unit / Rail
2000 / Tape & Reel
2000 / Tape & Reel
25 Unit / Rail
25 Unit / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC10H188
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
B
−N−
Y BRK
D
−L−
−M−
W
D
V
0.010 (0.250)
T L−M
N
Z
0.007 (0.180)
M
T L−M
U
S
N
S
S
0.007 (0.180)
M
T L−M
N
S
20
1
X
VIEW D−D
G1
S
S
S
A
Z
R
0.007 (0.180)
M
T L−M
0.007 (0.180)
M
T L−M
S
N
N
S
S
S
H
K1
0.007 (0.180)
M
T L−M
S
N
S
C
E
G
G1
0.010 (0.250)
S
T L−M
0.004 (0.100)
J
−T−
VIEW S
S
SEATING
PLANE
K
F
VIEW S
0.007 (0.180)
M
T L−M
S
N
S
N
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS
−L−, −M−,
AND
−N−
DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM
−T−,
SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2
_
10
_
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2
_
10
_
7.88
8.38
1.02
−−−
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4
