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MC10XS3535

Smart Front Corner Light Switch

厂商名称:FREESCALE (NXP)

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Freescale Semiconductor
Technical Data
Document Number: MC10XS3535
Rev. 6.0, 6/2012
Smart Front Corner Light Switch
(Triple 10 mOhm and Dual
35 mOhm)
The 10XS3535 is designed for low voltage automotive and industrial
lighting applications. Its five low R
DS(ON)
MOSFETs (three 10 mΩ, two
35 mΩ) can control the high sides of five separate resistive loads
(bulbs, Xenon-HID modules and LEDs).
Programming, control and diagnostics are accomplished using a
16-bit SPI interface (3.3 V or 5.0 V). Each output has its own pulse-
width modulation (PWM) control via the SPI. The 10XS3535 has highly
sophisticated failure mode handling to provide high availability of the
outputs. Its multiphase control and output edge shaping improves
electromagnetic compatibility (EMC) behavior.
The 10XS3535 is packaged in a power-enhanced 12 x 12 mm
nonleaded PQFN package with exposed tabs.
Features
• Triple 10 mΩ and dual 35 mΩ high side switches
• 16-bit SPI communication interface with daisy chain capability
• Current sense output with SPI-programmable multiplex switch
and board temperature feedback
• Digital diagnosis feature
• PWM module with multiphase feature including prescaler
• LEDs control including accurate current sensing and low duty-
cycle capability
• Fully protected switches
• Over-current shutdown detection
• Power net and reverse polarity protection
• Low-power mode
• Fail mode functions including autorestart feature
• External smart power switch control including current recopy
12V
5.0V
12V
10XS3535
HIGH SIDE SWITCH
Bottom View
FK SUFFIX
98ART10511D
24-PIN PQFN
PB FREE
ORDERING INFORMATION
Device
(For Tape and Reel,
add R2 Suffix)
MC10XS3535HFK
Temperature
Range (T
A
)
-40 to 125 °C
Package
24 PQFN
10XS3535
VCC
VBAT
CP
Watchdog
LIMP
OUT1
FLASHER
OUT2
IGN
RST
OUT3
CLOCK
OUT4
CS
FOG
OUT5
S0
FETIN
SI
SCLK
FETOUT
CSNS GND
MCU
Smart
Switch
Figure 1. 10XS3535 Simplified Application Diagram
Freescale Semiconductor, Inc. reserves the right to change the detail specifications,
as may be required, to permit improvements in the design of its products.
© Freescale Semiconductor, Inc., 2010-2012. All rights reserved.
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VCC
VBAT
CP
R
UP
Vcc failure
detection
Internal
Regulator
OV/UV/POR
detections
Charge
Pump
CS
SO
SI
SCLK
R
DWN
CLOCK
LIMP
FOG
FLASHER
IGN
RST
Logic
LED Control
Over-current
Detection
Open Load
Detection
Over-temperature
Detection
OUT1
Gate Drive
drain/gate clamp
OUT1
R
DWN
OUT2
OUT2
Over-temperature
Prewarning
OUT3
OUT3
OUT4
OUT4
OUT5
OUT5
CSNS
Selectable Output Current
Recopy (Analog MUX)
Current Recopy
Synchronization
VCC
Driver for External
MOSFET
FETIN
Temperature
Feedback
FETOUT
GND
Figure 2. 10XS3535 Simplified Internal Block Diagram
10XS3535
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
FLASHER
FETOUT
CLOCK
SCLK
FOG
LIMP
VCC
RST
13 12 11 10
CP
GND
16
17
9
8
7
6
5
4
3
IGN
2
SO
CS
SI
24
14
GND
23
FETIN
1
CSNS
GND
22
OUT1
Definition
OUT5
18
15
VBAT
19
OUT4
20
OUT3
21
OUT2
Figure 3. 10XS3535 Pin Connections (Transparent Top View Of Package)
Table 1. 10XS3535 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on
Page 20.
Pin
Number
1
2
3
4
5
Pin Name
FETIN
IGN
RST
FLASHER
CLOCK
Pin Function
Input
Input
Input
Input
Input/Output
Formal Name
External FET Input
Ignition Input
(Active High)
Reset
Flasher Input
(Active High)
Clock Input
This pin is the current sense recopy of the external SMART MOSFET.
This input wakes the device. It also controls the Outputs 1 and 2 in case of Fail
mode activation. This pin has a passive internal pull-down.
This input wakes the device. It is also used to initialize the device configuration
and fault registers through SPI. This digital pin has a passive internal pull-down.
This input wakes the device. This pin has a passive internal pull-down.
This pin state depends on RST logic level.
As long as RST input pin is set to logic [0], this pin is pulled up in order to report
wake event. Otherwise, the PWM frequency and timing are generated from this
digital clock input by the PWM module.
This pin has a passive internal pull-down.
The Fail mode can be activated by this digital input. This pin has a passive
internal pull-down.
This input wakes the device. This pin has a passive internal pull-down.
When this digital signal is high, SPI signals are ignored. Asserting this pin low
starts a SPI transaction. The transaction is signaled as completed when this
signal returns high. This pin has a passive internal pull-up resistance.
This digital input pin is connected to the master microcontroller providing the
required bit shift clock for SPI communication. This pin has a passive internal
pull-down resistance.
6
7
8
LIMP
FOG
CS
Input
Input
Input
Limp Home Input
(Active High)
FOG Input (Active
high)
Chip Select
(Active Low)
SPI Clock Input
9
SCLK
Input
10XS3535
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
Table 1. 10XS3535 Pin Definitions (continued)
A functional description of each pin can be found in the Functional Pin Description section beginning on
Page 20.
Pin
Number
10
11
12
13
Pin Name
SI
VCC
SO
FETOUT
Pin Function
Input
Power
Output
Output
Formal Name
Master-Out Slave-
In
Logic Supply
Master-In Slave-
Out
External FET Gate
Definition
This data input is sampled on the positive edge of the SCLK. This pin has a
passive internal pull-down resistance.
SPI Logic power supply.
SPI data is sent to the MCU by this pin. This data output changes on the
negative edge of SCLK and when CS is high, this pin is high-impedance.
This pin controls an external SMART MOSFET by logic level. This output is also
called OUT6.
If OUT6 is not used in the application, this output pin is set to logic high when
the current sense output becomes valid when CSNS sync SPI bit is set to logic
[1].
14,17,23
15
16
22
18
21
20
19
24
GND
VBAT
CP
OUT1
OUT5
OUT2
OUT3
OUT4
CSNS
Ground
Power
Output
Output
Output
Ground
Battery Input
Charge Pump
Output 1
Output 5
Output 2
Output 3
Output 4
Current Sense
Output
This pin is the ground for the logic and analog circuitry of the device.
(1)
Power supply pin.
This pin is the connection for an external tank capacitor (for internal use only).
Protected 35 mΩ high side power output to the load.
Protected 10 mΩ high side power output to the load.
Output
This pin is used to output a current proportional to OUT1:OUT5, FET in current,
and it is used externally to generate a ground-referenced voltage for the
microcontroller to monitor output current. Moreover, this pin can report a voltage
proportional to the temperature on the GND flag.
OUT1:OUT5, FET in current sensing and Temperature feedback choice is SPI
programmable.
Notes
1. The pins 14, 17 and 23 must be shorted on the board.
10XS3535
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
ELECTRICAL RATINGS
Over-voltage Test Range (all OUT[1:5] ON with nominal DC current)
Maximum Operating Voltage
Load Dump (400 ms) @ 25 °C
Reverse Polarity Voltage Range (all OUT[1:5] ON with nominal DC current)
2.0 Min @ 25 °C
VCC Supply Voltage
OUT[1:5] Voltage
Positive
Negative (ground disconnected)
Digital Current in Clamping Mode (SI, SCLK, CS, RST, IGN, FLASHER, LIMP
and FOG)
FETIN Input Current
I
IN
I
FETIN
V
SO
V
CC
V
OUT
40
-16
±1.0
+10
-1.0
SO, FETOUT, CLOCK and CSNS Outputs Voltage
Outputs clamp energy using single pulse method (L = 2 mH; R = 0
Ω;
V
BAT =
14 V @150°C initial)
OUT[1,5]
OUT[2:4]
ESD Voltage
(2)
Human Body Model (HBM)
Human Body Model (HBM) OUT [1:5], VPWR, and GND
Charge Device Model (CDM)
Corner Pins (1, 13, 19, 21)
All Other Pins (2-12, 14-18, 20, 22-24)
±750
±500
E
1,5
E
2,3,4
V
ESD
±2000
±8000
30
100
V
- 0.3 to V
CC
+ 0.3
V
mA
mA
V
BAT
- 18
-0.3 to 5.5
V
V
V
BAT
28
40
V
V
Symbol
Value
Unit
mJ
Notes
2. ESD testing is performed in accordance with the Human Body Model (HBM) (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω)
and the Charge Device
Model.
10XS3535
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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