型号
- 型号
- 关键词
4000/14000/40000 SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, CDIP16, 620-09
厂商名称：Motorola ( NXP )
厂商官网：https://www.nxp.com
下载文档| 型号 | MC14099BALDS | MC14099BCLD | MC14599BCPDS | MC14099BAL | MC14599BAL | MC14599BCLD |
|---|---|---|---|---|---|---|
| 描述 | 4000/14000/40000 SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, CDIP16, 620-09 | 4000/14000/40000 SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, CDIP16, 620-09 | 4000/14000/40000 SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PDIP18, 707-02 | D Latch, 4000/14000/40000 Series, 1-Func, Low Level Triggered, 1-Bit, True Output, CMOS, CDIP16, 620-09 | D Latch, 4000/14000/40000 Series, 1-Func, Low Level Triggered, 1-Bit, True Output, CMOS, CDIP18, 726-04 | 4000/14000/40000 SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, CDIP18, 726-04 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP18,.3 | DIP, | DIP, DIP18,.3 | DIP, DIP18,.3 |
| Reach Compliance Code | unknow | unknown | unknown | unknow | unknow | unknow |
| 其他特性 | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH |
| 系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-PDIP-T18 | R-GDIP-T16 | R-GDIP-T18 | R-GDIP-T18 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 19.3 mm | 19.3 mm | 22.73 mm | 19.3 mm | 22.73 mm | 22.73 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 18 | 16 | 18 | 18 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 传播延迟（tpd） | 400 ns | 400 ns | 400 ns | 400 ns | 400 ns | 400 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.19 mm | 4.19 mm | 4.57 mm | 4.19 mm | 5.08 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 触发器类型 | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| 厂商名称 | Motorola ( NXP ) | - | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| 零件包装代码 | DIP | DIP | DIP | - | - | DIP |
| 针数 | 16 | 16 | 18 | - | - | 18 |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP18,.3 | - | DIP18,.3 | DIP18,.3 |
| 电源 | 5/15 V | 5/15 V | 5/15 V | - | 5/15 V | 5/15 V |
DSP 与 ARM 处理器
汽车电子
RF/无线
下载中心专版
单片机
stm32/stm8
