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MC2010W-2553-FB

Fixed Resistor, Metal Glaze/thick Film, 0.75W, 255000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP, LEAD FREE

器件类别:无源元件    电阻器   

厂商名称:RCD Components Inc.

厂商官网:http://www.rcdcomponents.com/

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
Objectid
1443697984
包装说明
CHIP, LEAD FREE
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
PRECISION
JESD-609代码
e3
制造商序列号
MC
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
155 °C
最低工作温度
-55 °C
封装形状
RECTANGULAR PACKAGE
包装方法
BULK
额定功率耗散 (P)
0.75 W
额定温度
70 °C
电阻
255000 Ω
电阻器类型
FIXED RESISTOR
尺寸代码
2010
表面贴装
YES
技术
METAL GLAZE/THICK FILM
温度系数
100 ppm/°C
端子面层
Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
容差
1%
工作电压
200 V
文档预览
THICK FILM CHIP RESISTORS AND JUMPERS
MC SERIES
50mW (0201) to 3W (2040)
ZC SERIES
Zero-ohm Chip Jumpers
H
Industry’s widest selection -
0.1Ω to 22M, 50mW to 3W, 0.25% to 5%, TC’s to 50ppm
H
0402, 0603, 0805, 1206 sizes heavily stocked in 1% & 5%
(other sizes available from stock in many popular values)
L
T
t
W
RESISTORS
MCAPS
& COILS
MDELAY
LINES
Industry’s lowest prices!
RCD’s Series MC resistors utilize precision thick film technology
offering inherently low inductance, exceptional reliability, and
superior performance under demanding applications. Heavy solder
plating with
NO LEACH
TM
nickel barrier assures superb solderabil-
ity and long shelf life. State-of-the-art production line enables the
industry’s most precise accuracies (as tight as 0.25% 50ppm!)
thereby replacing more costly thin-film chips in many applications.
RCD offers low cost offshore assembly of SM and leaded
PCB’s. Why not consider us to assemble your products?
MC Voltage TYPE ZC
Rating** Jumper**
25V
OPTIONS
H
Lead-free solder terminations (Option ‘W’)
H
User-trimmable chips (Option ‘U’)
H
Increased pulse capability (Option ‘P’)
H
Mil-spec screening/burn-in, special marking, non-standard
values & TC, high frequency designs, etc., are an RCD specialty!
RCD Type Wattage Std TC** Res. Range
MC, ZC Rating
ppm/°Ctyp
±0.5% Tol**
0201
0402
Stock i tem
0603
Stock i tem
0805
Stock i tem
1206
Stock i tem
1210
.05W
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
100
200
400
Res. Range
±1% Tol**
10
to 22K
22.1K to 1M
10
to 1M
1Ω to 9.76
10
to 1M
1Ω to 9.76
10
to 1M
Resis Range
±5% Tol**
10
to 1M
1- 9.1
,1.1M- 2.2M
10
to 1M
1- 9.1
,1.1M- 4.7M
10
to 1M
1- 9.1
,1.1M- 10M
Dimensions
Inch [mm]
L
W
T
t
1 Amp Max. .024±.002 .012±.002 .010±.002 .006±.002
50m
Max. [0.6±.03]
[.3±.03] [.25±.03] [.15±.05]
1 Amp Max. .040±.004 .020±.004 .014±.004 .010±.004
50m
Max. [1.00±.1]
[.5±.1]
[.35±.1]
[.25±.1]
1 Amp Max. .061±.005 .031±.004 .016±.006 .010±.006
50m
Max. [1.55±.12]
[.8±.1]
[.40±.15] [.25±.15]
1.5Amp Max. .079±.005 .050±.006 .020±.006 .016±.008
50m
Max. [2.0±.15] [1.25±.15] [.50±.15]
[.4±.2]
2 Amp Max. .126±.008 .061±.006 .024±.006 .020±.008
50m
Max. [3.2±.2] [1.55±.15] [.61±.15] [.51±.2]
3 Amp Max. .126±.008 .098±.008 .024±.008 .020±.010
50m
Max. [3.2±.2]
[2.5±.2]
[.6±.2]
[.5±.25]
3 Amp Max. .197±.008 .102±.008 .024±.008 .020±.010
50m
Max. [5.0±.2]
[2.6±.2]
[.6±.2]
[.50±.25]
4 Amp Max. .250±.01 .125±.010 .024±.008 .034±.021
50m
Max. [6.35±.25] [3.2±.25]
[.6±.2]
[.86±.53]
N/A
.201±.008 .402±.008 .024±.008 ±.018
[5.1±.2]
[10.2±.2]
[.6±.2]
[1.4±.46]
.063W
50V
10
to 1M
10
to 1M
10
to 1M
10
to 1M
10
to 1M
10
to 1M
.1W
50V
.125W
.25W
.33W
2010
.75W
2512
1.0W
2040
2.0/3.0*
10
to 1M
0.1-9.76
, 1.02M-10M 0.1-9.1
, 1.1M-20M
10
to 1M
1.02M to 5.6M
10
to 5.6M
0.1-9.76
Ω,
5.62M-10M 0.1-9.1
, 6.2M-22M
10
to 1M
1.02M to 5.6M
10
to 5.6M
0.1-9.76
Ω,
5.62M-10M 0.1-9.1
, 6.2M-22M
10
to 1M
1.02M to 5.6M
10
to 5.6M
0.1-9.76
Ω,
5.62M-10M 0.1-9.1
, 6.2M-22M
10
to 1M
1.02M to 5.6M
10
to 5.6M
0.1-9.76
Ω,
5.62M-10M 0.1-9.1
, 6.2M-22M
10
to 1M
10
to 1M
1- 9.1
150V
200V
200V
200V
250V
350V
* 2040 chips may be operated up to 3W with consideration of mounting density, termination pad area, board material, and ambient temperature to control self-heating to 155°C. ** Extended range avail.
TYPICAL PERFORMANCE
Thermal Shock (-55° to +125°C )
Overload (2.5x W, 5S, NTE 2x rated V)
Low T mp. Operati on (-55°C )
e
Hi gh T mp. Exposure (125°C , 100hrs)
e
Resi stance to Solder Heat
Moi sture Resi stance
Load Li fe(1000 hrs.)
Operati ng T mp. (+175°C avail.)
e
Power D erati ng (above 70°C )
0.2%
∆R
1%
∆R
0.2%
∆R
0.5%
∆R
0.2%
∆R
0.5%
∆R
1.0%
∆R
-55 to +155°C
Derate by 1.18%/°C
PULSE WITHSTAND CHART
(increased pulse levels avail.)
500
Peak Power (Watts)
100
MC2512P
MC2010P
MC1210P
MC1206P
MC0805P
MC0603P
MC0402P
1uS
10uS
100uS
1mS
10mS
100mS
10
P/N DESIGNATION:
MC 1206
- 2210 - F T
1
RCD Type:
MC or ZC
Chip Size:
0201 to 2040
Options:
W, U, P, etc (leave blank if std)
Resis. Value:
4 digit code if tol. is 0.25% to 1%
(R100= .1Ω, 1R00=1Ω, 10R0=10Ω, 1000=100Ω, 1001=1KΩ)
3 digit code if tol. is 2% or 5% (R10=0.1Ω, 1R0=1Ω, 100=10Ω,
101=100Ω, 102=1KΩ) Leave blank on ZC zero-ohm chips
Tolerance:
J=5%, G=2%, F=1%, D=0.5%, C=0.25%
Leave blank on ZC zero-ohm chips. Opt.U trimmable
chips use W=±15%, M=±20%, U=0 to +30%)
Pulse Duration
Packaging:
B=Bulk, T=Tape & Reel
TC:
50=50ppm, 101=100ppm, 201=200ppm (leave
blank if std)
Pulse capability is dependent on res. value, waveform, repetition, etc.
Chart is a general guide for Opt. P version, single or infrequent pulses,
with peak voltage levels not exceeding 150V for 0402 & 0603 size,
300V for 0805, 400V for 1206 & 1210, 450V for 2010 & 2512. Max
pulse wattage for standard parts (w/o Opt.P) is 50% less, max pulse
voltage is 50V less. Increased pulse levels available. For improved
performance and reliability, a 30% pulse derating factor is recommended
(50% for frequent pulses, high values, etc). Consult RCD for application
assistance. Verify selection by evaluating under worst-case conditions.
RCD Components Inc.,
520 E. Industrial Park Dr., Manchester, NH USA 03109
Tel: (603) 669-0054 Fax:(603) 669-5455 E-mail: sales@rcdcomponents.com
www.rcdcomponents.com
FA033C Specifications subject to change without notice
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