NXP Semiconductors
Data sheet: Advance Information
Document Number: PF3000
Rev. 9.0, 8/2017
Power management integrated
circuit (PMIC) for i.MX 7 & i.MX 6SL/
SX/UL
The PF3000 is a power management integrated circuit (PMIC) designed
specifically for use with the NXP i.MX 7 and i.MX 6SL/SX/UL application
processors. With up to four buck converters, six linear regulators, RTC supply,
and coin-cell charger, the PF3000 can provide power for a complete system,
including applications processors, memory, and system peripherals. This device
is powered by SMARTMOS technology.
Features:
• Four adjustable high efficiency buck regulators: 1.75 A, 1.5 A, 1.25 A, 1.0 A
• Selectable modes: PWM, PFM, APS
• 5.0 V, 600 mA boost regulator with PFM or auto mode
• Six adjustable general purpose linear regulators
• Input voltage range: 2.8 V to 4.5 V or 3.7 V to 5.5 V
• OTP (One Time Programmable) memory for device configuration
• Programmable start-up sequence and timing
• Selectable output voltage, frequency, soft start
• I
2
C control
• Coin cell charger and always ON RTC supply
• DDR reference voltage
• -40 °C to +125 °C operating junction temperature
PF3000
POWER MANAGEMENT
EP SUFFIX
98ASA00719D
48 QFN 7.0 X 7.0
ES SUFFIX
98ASA00933D
48 QFN 7.0 X 7.0
Applications:
• Tablets
• eReaders
• Wearables
• POS terminals
• Industrial control
• Medical monitoring
• Home automation
• Home security/energy management
PF3000
VREFDDR
Switching regulators
SW3
0.90 to 1.65 V @ 1.5 A
SW1A
0.7 to 1.425 V, 1.8V, 3.3V @ 1.0 A
SW1B
0.70 to 1.475 V @ 1.75 A
SW2
1.50 to 1.85 V @ 1.25 A
or 2.5 to 3.3 V @ 1.25 A
SWBST
5.00 to 5.15 V @ 0.6 A
RESETBMCU
PWRON
STANDBY
SD_VSEL
INTB
DDR Memory
i.MX
DDR MEMORY
INTERFACE
Processor
ARM Core
Processor SOC
SATA - FLASH
NAND - NOR
Interfaces
Parallel control/GPIOS
External AMP
Microphones
Speakers
Audio
Codec
SD-MMC/
NAND Mem.
SATA
HDD
Linear
regulators
VLDO1
I
2
C
I
2
C
Sensors
1.8 to 3.3 V
@
100 mA
Camera
WAM
GPS/MIPI
VLDO2
0.80 to 1.55 V
@
250 mA
VCC_SD
1.80 to 1.85 V @ 100 mA
or 2.85 to 3.3 V @ 100 mA
GPS
MIPI
uPCIe
HDMI
USB
Ethernet
CAN
Camera
V33
2.85 - 3.3 V @ 350 mA
LDVS Display
Li CELL
Charger
VLDO3
1.8 - 3.3 V @ 100 mA
VLDO4
1.8 - 3.3 V @ 350 mA
COINCELL
Main Supply
2.8 – 5.5 V
Cluster/HUD
Front USB
POD
Rear Seat
Infotaiment
Rear USB
POD
Figure 1. PF3000 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© NXP B.V. 2017.
Table of Contents
Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Pinout diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5 General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6 Functional description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Functional description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6.2 Power generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6.3 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.3.1 Control logic and interface signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.3.2 One-time-programmable memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.3.4 16 MHz and 32 kHz clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
6.3.5 Optional front-end input LDO regulator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.3.6 Internal core voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.3.7 VREFDDR voltage reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.3.8 Buck regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
6.3.9 Boost regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
6.3.10 LDO Regulators Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.3.11 VSNVS LDO/switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.4 Power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
6.5 Modes of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
6.5.1 State diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
6.5.2 State machine flow summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
6.5.3 Performance characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
6.6 Control Interface I2C block description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
6.6.1 I2C device ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
6.6.2 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
6.6.3 Interrupt handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
6.6.4 Interrupt bit summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
6.6.5 Specific registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
6.6.6 Register map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .102
7 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
7.1 Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
8 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
9 Thermal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
9.1 Rating data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
9.2 Estimation of junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
10 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
10.1Packaging dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
1
2
3
4
PF3000
2
NXP Semiconductors
ORDERABLE PARTS
1
Orderable parts
The PF3000 is available with pre-programmed OTP memory configurations. The devices are identified using the program codes from
Table 1.
Details of the OTP programming for each device can be found in
Table 42.
Table 1. Orderable part variations
Part number
MC32PF3000A0EP
MC32PF3000A1EP
MC32PF3000A2EP
MC32PF3000A3EP
MC32PF3000A4EP
MC32PF3000A5EP
MC32PF3000A6EP
MC32PF3000A7EP
MC32PF3000A8EP
MC33PF3000A0ES
MC33PF3000A3ES
MC33PF3000A4ES
MC33PF3000A5ES
MC33PF3000A6ES
MC33PF3000A7ES
MC34PF3000A0EP
MC34PF3000A1EP
MC34PF3000A2EP
MC34PF3000A3EP
MC34PF3000A4EP
MC34PF3000A5EP
MC34PF3000A6EP
MC34PF3000A7EP
MC34PF3000A8EP
-40 °C to 105 °C
(For use in Industrial
applications)
98ASA00719D, 48 QFN 7.0 mm x
7.0 mm with exposed pad
-40 °C to 105 °C
(For use in Automotive
applications)
98ASA00933D, 48 QFN 7.0 mm x
7.0 mm WF-type (wettable flank)
-40 °C to 85 °C
(For use in Consumer
applications)
98ASA00719D, 48 QFN 7.0 mm x
7.0 mm with exposed pad
Temperature (T
A
)
Package
Programming options
0 - Not programmed
1 (i.MX 7 with DDR3L)
2 (i.MX 7 with LPDDR3)
3 (i.MX 6SX with DDR3L)
4 (i.MX 6SX with DDR3)
5 (i.MX 6SL with LPDDR2)
6 (i.MX 6UL with LPDDR2)
7 (i.MX 6UL with DDR3L)
8 (i.MX 6UL with DDR3)
0 - Not programmed
3 (i.MX 6SX with DDR3L)
4 (i.MX 6SX with DDR3)
5 (i.MX 6SL with LPDDR2)
6 (i.MX 6UL with LPDDR2)
7 (i.MX 6UL with DDR3L)
0 - Not programmed
1 (i.MX 7 with DDR3L)
2 (i.MX 7 with LPDDR3)
3 (i.MX 6SX with DDR3L)
4 (i.MX 6SX with DDR3)
5 (i.MX 6SL with LPDDR2)
6 (i.MX 6UL with LPDDR2)
7 (i.MX 6UL with DDR3L)
8 (i.MX 6UL with DDR3)
(1) (2)
(1) (2)
(1) (2)
Notes
,
,
,
Notes
1. For tape and reel, add an R2 suffix to the part number.
2. The programming options specified in this table are reference for customer application. The part number selection should match the board power
tree design.
Table 42
provides details of the OTP programming for each device.
PF3000
NXP Semiconductors
3
GENERAL DESCRIPTION
2
General description
The PF3000 is the power management integrated circuit (PMIC) designed primarily for use with NXP’s i.MX 7 series of multi-media
application processors. It is also capable of providing full power solution to i.MX 6SL/SX/UL processors.
2.1
Features
This section summarizes the PF3000 features.
• Input voltage range to PMIC: 2.8 V to 4.5 V, or 3.7 V to 5.5 V
(3)
• Buck regulators
• Configurable three to four channels
• SW1A/B, 2.75 A (single); 0.7 V to 1.425 V, 1.8 V, 3.3 V
• SW1A, 1.0 A (independent); 0.7 V to 1.425 V, 1.8 V, 3.3 V
• SW1B 1.75 A (independent); 0.7 V to 1.475 V
• SW2, 1.25 A; 1.50 V to 1.85 V or 2.50 V to 3.30 V
• SW3, 1.5 A; 0.90 V to 1.65 V
• Dynamic voltage scaling
• Modes: PWM, PFM, APS
• Programmable output voltage
• Programmable current limit
• Programmable soft start sequence
• Programmable PWM switching frequency
• Boost regulator
• SWBST, 5.0 to 5.15 V, 0.6 A, OTG support
• Modes: PFM and Auto
• OCP fault interrupt
• LDOs
• VCC_SD, 1.8 V to 1.85 V or 2.85 V to 3.30 V, 100 mA based on SD_VSEL
• V33, 2.85 V to 3.30 V, 350 mA
• VLDO1, 1.8 V to 3.3 V, 100 mA
• VLDO2, 0.80 V to 1.55 V, 250 mA
• VLDO3, 1.8 V to 3.3 V, 100 mA
• VLDO4, 1.8 V to 3.3 V, 350 mA
Always ON RTC Regulator/Switch VSNVS 3.0 V, 1.0 mA
DDR memory reference voltage, VREFDDR, 0.5 V to 0.9 V, 10 mA
OTP (One time programmable) memory for device configuration, user-programmable start-up sequence and timing
Battery backed memory including coin cell charger
I
2
C interface
User programmable standby, sleep/LPSR, and Off modes
•
•
•
•
•
•
Notes
3. 2.8 V to 4.5 V when VIN is used at input. 3.7 V to 5.5 V when VPWR is used as input.
PF3000
4
NXP Semiconductors
GENERAL DESCRIPTION
2.2
Functional block diagram
PF3000 functional internal block diagram
OTP startup configuration
OTP prototyping
(Try before burn)
Sequence and
timing
Voltage
Phasing and
frequency selection
Power generation
Switching regulators
SW1A
(0.7 V to 1.425 V,
1.8 V, 3.3 V, 1.0 A)
Linear regulators
VCC_SD
(1.80 V or 1.85 V, 100 mA)
or (2.85 V or 3.3 V, 100 mA)
V33
Bias & references
Internal core voltage reference
DDR voltage reference
SW2
Logic and control
Parallel MCU interface
Regulator control
SW3
(0.90 V to 1.65 V, 1.5 A)
(1.50 V to 1.85 V, 1.25 A)
or (2.50 V to 3.30 V, 1.25 A)
( 2.85 V to 3.30 V, 350 mA)
SW1B
(0.70 V to 1.475 V , 1.75 A)
VLDO1
(1.8 V to 3.3 V, 100 mA)
VLDO2
(0.80 V to 1.55 V, 250 mA)
VLDO3
(1.8 V to 3.3 V, 100 mA)
I
2
C communication & registers
VLDO4
(1.8 V to 3.3 V, 350 mA)
Fault detection and protection
Thermal
Current limit
Boost regulator
(5.0 V to 5.15 V, 600 mA)
USB OTG Supply
VSNVS
(1.0 V to 3.0 V, 1.0 mA)
RTC supply with coin cell
charger
VPWR front end LDO overvoltage indicator
Figure 2. Functional block diagram
PF3000
NXP Semiconductors
5
安防电子
