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MC33269DR2

LDO Voltage Regulators 1.35-10V ADJ 800mA

器件类别:电源/电源管理    电源电路   

厂商名称:ON Semiconductor(安森美)

厂商官网:http://www.onsemi.cn

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器件:MC33269DR2

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器件参数
参数名称
属性值
是否Rohs认证
不符合
零件包装代码
SOIC
包装说明
SOP-8
针数
8
Reach Compliance Code
not_compliant
ECCN代码
EAR99
Factory Lead Time
1 week
可调性
ADJUSTABLE
最大回动电压 1
1.25 V
标称回动电压 1
1.1 V
最大差分输入-输出电压
15 V
最小差分输入-输出电压
1.35 V
JESD-30 代码
R-PDSO-G8
JESD-609代码
e0
长度
4.9 mm
最大电网调整率 (%/V)
0.017
最大负载调整率 (%)
0.5%
功能数量
1
输出次数
1
端子数量
8
工作温度TJ-Max
150 °C
工作温度TJ-Min
-40 °C
最大输出电流 1
0.8 A
最大输出电压 1
1.275 V
最小输出电压 1
1.225 V
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP8,.25
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
包装方法
TAPE AND REEL
峰值回流温度(摄氏度)
240
认证状态
Not Qualified
调节器类型
ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度
1.75 mm
表面贴装
YES
技术
BIPOLAR
端子面层
Tin/Lead (Sn80Pb20)
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
30
宽度
3.9 mm
Base Number Matches
1
文档预览
MC33269, NCV33269
800 mA, Adjustable Output,
Low Dropout Voltage
Regulator
The MC33269/NCV33269 series are low dropout, medium current,
fixed and adjustable, positive voltage regulators specifically designed
for use in low input voltage applications. These devices offer the
circuit designer an economical solution for precision voltage
regulation, while keeping power losses to a minimum.
The regulator consists of a 1.0 V dropout composite PNP−NPN pass
transistor, current limiting, and thermal shutdown.
Features
http://onsemi.com
SO−8
D SUFFIX
CASE 751
8
1
GND/Adj
V
out
V
in
1
2
3
4
8
7
6
5
(Top View)
DPAK
DT SUFFIX
CASE 369C
NC
V
out
NC
3.3 V, 3.5 V, 5.0 V, 12 V and Adjustable Versions
2.85 V version available as MC34268
Space Saving DPAK, SO−8 and SOT−223 Power Packages
1.0 V Dropout
Output Current in Excess of 800 mA
Thermal Protection
Short Circuit Protection
Output Trimmed to 1.0% Tolerance
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
1
3
1. GND/Adj
2. V
out
3. V
in
SOT−223
ST SUFFIX
CASE 318E
1 2 3
(Top View)
1
3
1
2
3
(Top View)
DEVICE TYPE/NOMINAL OUTPUT VOLTAGE
MC33269D
NCV33269D*
MC33269DT
NCV33269DTRK*
MC33269T
MC33269D−3.3
MC33269DT−3.3
NCV33269DTRK−3.3*
MC33269T−3.3
MC33269ST−3.3
Adj
Adj
Adj
Adj
Adj
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
MC33269T−3.5
MC33269D−5.0
MC33269DT−5.0
NCV33269DT−5.0*
NCV33269DTRK−5.0*
MC33269T−5.0
MC33269D−012
MC33269DT−012
NCV33269DTRK−012*
MC33269T−012
3.5 V
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
12 V
12 V
12 V
12 V
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
TO−220AB
T SUFFIX
CASE 221AB
1. GND/Adj
2. V
out
3. V
in
1
2
3
12 3
(Top View)
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and
Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 8 of this data sheet.
©
Semiconductor Components Industries, LLC, 2014
1
August, 2014 − Rev. 28
Publication Order Number:
MC33269/D
MC33269, NCV33269
MAXIMUM RATINGS
Rating
Power Supply Input Voltage
Power Dissipation
Case 369C (DPAK)
Symbol
V
in
T
A
= 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
T
A
= 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
T
A
= 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
T
A
= 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
P
D
q
JA
q
JC
P
D
q
JA
q
JC
P
D
q
JA
q
JC
P
D
q
JA
q
JC
T
J
MC33269
T
A
T
stg
ESD
Value
20
Unit
V
Case 751 (SO−8)
Case 221A (TO−220)
Case 318E (SOT−223)
Internally Limited
92
6.0
Internally Limited
160
25
Internally Limited
65
5.0
Internally Limited
156
15
−40 to +150
−40 to +125
−40 to +125
−55 to +150
4000
400
W
°C/W
°C/W
W
°C/W
°C/W
W
°C/W
°C/W
W
°C/W
°C/W
°C
°C
°C
V
Operating Die Junction Temperature Range
Operating Ambient Temperature Range
NCV33269
Storage Temperature
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
Machine Model (MM)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS
(C
O
= 10
mF,
T
A
= 25°C, for min/max values T
A
= −40°C to +125°C, unless otherwise noted.)
Characteristic
Output Voltage (I
out
= 10 mA, T
A
= 25°C)
3.3 Suffix (V
CC
= 5.3 V)
3.5 Suffix (V
CC
= 5.5 V)
5.0 Suffix (V
CC
= 7.0 V)
12 Suffix (V
CC
= 14 V)
Output Voltage (Line, Load and Temperature) (Note 1)
(1.25 V
V
in
− V
out
15 V, I
out
= 500 mA)
(1.35 V
V
in
− V
out
10 V, I
out
= 800 mA)
3.3 Suffix
3.5 Suffix
5.0 Suffix
12 Suffix
Reference Voltage for Adjustable Voltage
(I
out
= 10 mA, V
in
− V
out
= 2.0 V, T
A
= 25°C)
Reference Voltage (Line, Load and Temperature) (Note 1) for Adjustable Voltage
(1.25 V
V
in
− V
out
15 V, I
out
= 500 mA)
(1.35 V
V
in
− V
out
10 V, I
out
= 800 mA)
Line Regulation
Load Regulation
Dropout Voltage
Ripple Rejection
Current Limit
Quiescent Current (Fixed Output)
Minimum Required Load Current
Adjustment Pin Current
(I
out
= 10 mA, V
in
= [V
out
+ 1.5 V] to V
in
= 20 V, T
A
= 25°C)
(V
in
= V
out
+ 3.0 V, I
out
= 10 mA to 800 mA, T
A
= 25°C)
(I
out
= 500 mA)
(I
out
= 800 mA)
(10 V
pp
, 120 Hz Sinewave; I
out
= 500 mA)
(V
in
− V
out
= 10 V)
(1.5 V
V
out
3.5 V)
(5 V
V
out
12 V)
Fixed Output Voltage
Adjustable Voltage
V
ref
V
ref
V
O
3.23
3.43
4.90
11.76
1.235
1.225
3.3
3.5
5.0
12
1.25
1.25
3.37
3.57
5.10
12.24
1.265
1.275
V
V
Symbol
V
O
3.27
3.465
4.95
11.88
3.3
3.5
5.0
12
3.33
3.535
5.05
12.12
V
Min
Typ
Max
Unit
V
Reg
line
Reg
load
V
in
− V
out
RR
I
Limit
I
Q
I
Load
I
Adj
55
800
8.0
1.0
1.1
5.5
0.3
0.5
1.25
1.35
8.0
20
0
120
%
%
V
dB
mA
mA
mA
mA
1. The MC33269−12, V
in
− V
out
is limited to 8.0 V maximum, because of the 20 V maximum rating applied to V
in.
http://onsemi.com
2
MC33269, NCV33269
V
in
V
out
Trim Links
V
Adj
Gnd
This device contains 38 active transistors.
Figure 1. Internal Schematic
http://onsemi.com
3
MC33269, NCV33269
1.5
Vin -Vout , DROPOUT VOLTAGE (V)
1.3
1.1
0.9
0.7
0.5
T
A
= 25°C
T
A
= -40°C
Δ
VO , OUTPUT
VOLTAGE DEVIATION
100
mV/Div
C
in
= 10
mF
C
O
= 10
mF
Tantalum
V
in
= V
O
+ 3.0 V
Preload = 0.1 A
T
A
= 125°C
I O , OUTPUT
CURRENT
0.5 A
0
200
400
600
800
1000
0A
20 ms/DIV
I
O
, OUTPUT LOAD CURRENT (mA)
Figure 2. Dropout Voltage versus
Output Load Current
V FB(OV), OVERVOLTAGE INPUT THRESHOLD (%VFB )
Figure 3. Transient Load Regulation
1100
I
O
= 800 mA
OUTPUT CURRENT (A)
1060
1020
980
940
900
-55
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-25
0
25
50
75
T
A
, AMBIENT TEMPERATURE (°C)
100
125
0
2.0
4.0
6.0
8.0
10
12
14
16
T
A
= 25°C
MC33269D-XX
L = 25 mm Copper
INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V)
Figure 4. Dropout Voltage
versus Temperature
Figure 5. MC33269−XX Output DC Current versus
Input−Output Differential Voltage
70
RR, RIPPLE REJECTION RATIO (dB)
60
V
O
= 12 V
50
40
30
20
0.1
V
in
= V
O
+ 3.0 V
I
L
= 800 mA
T
A
= 25°C
RR, RIPPLE REJECTION RATIO (dB)
V
O
= 3.3 V or 5.0 V
70
60
50
40
30
20
0.1
V
in
= 8.0 V
V
out
= 5.0 V
I
L
= 800 mA
C
Adj
= 22
mF
T
A
= 25°C
1.0
10
f, FREQUENCY (kHz)
100
1.0
10
f, FREQUENCY (kHz)
100
Figure 6. MC33269 Ripple Rejection
versus Frequency
Figure 7. MC33269−ADJ Ripple Rejection
versus Frequency
http://onsemi.com
4
MC33269, NCV33269
170
R
θ
JA, THERMAL RESISTANCE,
150
130
110
90
70
50
R
qJA
30
0
10
20
Graph represents symmetrical layout
JUNCTION-TO-AIR (
°
C/W)
P
D(max)
for T
A
= 50°C
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
50
L, LENGTH OF COPPER (mm)
Figure 8. SOP−8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
100
R
θ
JA, THERMAL RESISTANCE,
JUNCTION-TO-AIR (
°
C/W)
90
80
70
60
50
Minimum
Size Pad
Free Air
Mounted
Vertically
P
D(max)
for T
A
= 50°C
2.0
40
0
5.0
10
L, LENGTH OF COPPER (mm)
Figure 9. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
R
θ
JA, THERMAL RESISTANCE
JUNCTION‐TO‐AIR (
°
C/W)
240
200
160
120
80
Free Air
Mounted
Vertically
Minimum
Size Pad
P
D(max)
for T
A
= 50°C
1.25
2.0 oz. Copper
L
0.83
0.63
0.50
0.42
0.35
L
R
qJA
40
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 10. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
http://onsemi.com
5
PD, MAXIMUM POWER DISSIPATION (W)
280
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏ Ï
Ï ÏÏÏ
ÏÏÏ ÏÏ ÏÏ
ÏÏÏ ÏÏÏ
L
2.0 oz.
Copper
L
3.0 mm
30
40
L
R
qJA
15
20
2.4
ÏÏÏ
ÏÏÏ
ÏÏÏ
ÏÏÏ
25
30
2.0 oz. Copper
L
1.6
1.2
0.8
0.4
0
2.50
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