型号 | MC35071AU | MC1741SCD | MC33201D |
---|---|---|---|
描述 | IC,OP-AMP,SINGLE,BIPOLAR,DIP,8PIN,CERAMIC | IC,OP-AMP,SINGLE,BIPOLAR,SOP,8PIN,PLASTIC | IC,OP-AMP,SINGLE,BIPOLAR,SOP,8PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
包装说明 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 |
Reach Compliance Code | unknown | unknown | unknow |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
频率补偿 | YES | YES | YES |
最大输入失调电压 | 5000 µV | 7500 µV | 9000 µV |
JESD-30 代码 | R-XDIP-T8 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e0 | e0 | e0 |
低-失调 | NO | NO | NO |
功能数量 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 70 °C | 105 °C |
最低工作温度 | -55 °C | - | -40 °C |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | SOP | SOP |
封装等效代码 | DIP8,.3 | SOP8,.25 | SOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
电源 | +-15 V | +-15 V | 2/6,GND/-6 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
最小摆率 | 8 V/us | 10 V/us | 0.5 V/us |
表面贴装 | NO | YES | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL |
25C 时的最大偏置电流 (IIB) | 0.5 µA | - | 0.2 µA |
标称负供电电压 (Vsup) | -15 V | -15 V | - |
最大压摆率 | 2.8 mA | - | 1.125 mA |
供电电压上限 | 44 V | - | 6.5 V |
标称供电电压 (Vsup) | 15 V | 15 V | - |
最小电压增益 | 50000 | - | 25000 |