IC,DECODER/DEMUX,BCD-TO-DECIMAL,HC-CMOS,DIP,16PIN,CERAMIC
厂商名称:NXP(恩智浦)
厂商官网:https://www.nxp.com
下载文档型号 | MC54HC42JDS | 54HC42/BEAJC | MC74HC42ND | MC74HC42DR2 | MC74HC42DDS | MC74HC42DD | MC74HC42NDS |
---|---|---|---|---|---|---|---|
描述 | IC,DECODER/DEMUX,BCD-TO-DECIMAL,HC-CMOS,DIP,16PIN,CERAMIC | IC,DECODER/DEMUX,BCD-TO-DECIMAL,HC-CMOS,DIP,16PIN,CERAMIC | IC,DECODER/DEMUX,BCD-TO-DECIMAL,HC-CMOS,DIP,16PIN,PLASTIC | IC,DECODER/DEMUX,BCD-TO-DECIMAL,HC-CMOS,SOP,16PIN,PLASTIC | IC,DECODER/DEMUX,BCD-TO-DECIMAL,HC-CMOS,SOP,16PIN,PLASTIC | IC,DECODER/DEMUX,BCD-TO-DECIMAL,HC-CMOS,SOP,16PIN,PLASTIC | IC,DECODER/DEMUX,BCD-TO-DECIMAL,HC-CMOS,DIP,16PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER | DECIMAL DECODER/DRIVER |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | SOP | SOP | SOP | DIP |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 | SOP16,.25 | SOP16,.25 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
表面贴装 | NO | NO | NO | YES | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |