Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS, PDSO16, 0.150 INCH, PLASTIC, SOIC-16
厂商名称:Motorola ( NXP )
厂商官网:https://www.nxp.com
下载文档型号 | MC74HC165D | MC74HC165N |
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描述 | Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS, PDSO16, 0.150 INCH, PLASTIC, SOIC-16 | Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS, PDIP16, PLASTIC, DIP-16 |
是否Rohs认证 | 不符合 | 不符合 |
厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) |
包装说明 | 0.150 INCH, PLASTIC, SOIC-16 | PLASTIC, DIP-16 |
Reach Compliance Code | unknown | unknown |
其他特性 | CLOCK INHIBIT | CLOCK INHIBIT |
计数方向 | RIGHT | RIGHT |
系列 | HC/UH | HC/UH |
JESD-30 代码 | R-PDSO-G16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 |
长度 | 9.9 mm | 19.175 mm |
负载电容(CL) | 50 pF | 50 pF |
逻辑集成电路类型 | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT |
位数 | 8 | 8 |
功能数量 | 1 | 1 |
端子数量 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C |
输出极性 | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED |
传播延迟(tpd) | 45 ns | 45 ns |
认证状态 | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 4.44 mm |
最大供电电压 (Vsup) | 6 V | 6 V |
最小供电电压 (Vsup) | 2 V | 2 V |
标称供电电压 (Vsup) | 5 V | 5 V |
表面贴装 | YES | NO |
技术 | CMOS | CMOS |
温度等级 | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 3.9 mm | 7.62 mm |
最小 fmax | 20 MHz | 20 MHz |
Base Number Matches | 1 | 1 |