* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/
_
C from 65
_
to 125
_
C
SOIC Package: – 7 mW/
_
C from 65
_
to 125
_
C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
MOTOROLA
DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
RECOMMENDED OPERATING CONDITIONS
MAXIMUM RATINGS*
MC74HC58
Symbol
Vin, Vout
Symbol
Symbol
VCC
Vout
Tstg
ICC
Iout
VCC
Vin
PD
TL
VOH
tr, tf
Iin
VOL
ICC
TA
VIH
VIL
Iin
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
Storage Temperature
Power Dissipation in Still Air
DC Supply Current, VCC and GND Pins
DC Output Current, per Pin
DC Input Current, per Pin
DC Output Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Input Rise and Fall Time
(Figure 1)
Operating Temperature, All Package Types
DC Input Voltage, Output Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Maximum Quiescent Supply
Current (per Package)
Maximum Input Leakage Current
Maximum Low–Level Output
Voltage
Minimum High–Level Output
Voltage
Maximum Low–Level Input
Voltage
Minimum High–Level Input
Voltage
Parameter
Parameter
Parameter
Plastic DIP†
SOIC Package†
Vin = VIH or VIL
|Iout|
20
µA
Vin = VIH or VIL
|Iout|
20
µA
Vin = VCC or GND
Iout = 0
µA
Vin = VCC or GND
Vin = VIH or VIL |Iout|
|Iout|
Vin = VIH or VIL |Iout|
|Iout|
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20
µA
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20
µA
v
v
v
v
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
Test Conditions
– 0.5 to VCC + 0.5
– 1.5 to VCC + 1.5
– 65 to + 150
– 0.5 to + 7.0
2
– 55
Min
2.0
Value
v
4.0 mA
v
5.2 mA
v
4.0 mA
v
5.2 mA
0
0
0
0
±
50
±
25
±
20
260
750
500
+ 125
1000
500
400
VCC
Max
6.0
VCC
V
6.0
6.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
Unit
Unit
mW
mA
mA
mA
_
C
_
C
_
C
ns
V
V
V
V
V
– 55 to
25
_
C
±
0.1
1.5
3.15
4.2
0.26
0.26
3.98
5.48
0.1
0.1
0.1
1.9
4.4
5.9
0.3
0.9
1.2
2
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
Guaranteed Limit
v
85
_
C
v
125
_
C
High–Speed CMOS Logic Data
DL129 — Rev 6
±
1.0
1.5
3.15
4.2
0.33
0.33
3.84
5.34
0.1
0.1
0.1
1.9
4.4
5.9
0.3
0.9
1.2
20
v
±
1.0
1.5
3.15
4.2
0.40
0.40
3.70
5.20
0.1
0.1
0.1
1.9
4.4
5.9
0.3
0.9
1.2
40
v
Unit
µA
µA
V
V
V
V
MC74HC58
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎ Î Î Î Î
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
Î Î
Î
AC ELECTRICAL CHARACTERISTICS
(CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
Symbol
PLH,
tPHL
Parameter
VCC
V
2.0
4.5
6.0
2.0
4.5
6.0
—
– 55 to
25
_
C
125
25
21
75
15
13
10
v
85
_
C
v
125
_
C
155
31
26
95
19
16
10
190
38
32
110
22
19
10
Unit
ns
Maximum Propagation Delay, Any Input to Output Y
(Figures 1 and 2)
Maximum Output Transition Time, Any Output
(Figures 1 and 2)
Maximum Input Capacitance
tTLH,
tTHL
Cin
ns
pF
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Section)*
22
pF
* Used to determine the no–load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
tr
90%
ANY
INPUT
50%
10%
tPLH
90%
OUTPUT Y
tTLH
50%
10%
tTHL
* Includes all probe and jig capacitance
tPHL
tf
VCC
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
CL*
GND
Figure 1. Switching Waveforms
EXPANDED LOGIC DIAGRAM
A1
B1
C1
D1
E1
F1
1
12
13
9
10
11
Figure 2. Test Circuit
8
Y1
A2
B2
C2
D2
2
3
6
4
5
PIN 14 = VCC
PIN 7 = GND
Y2
High–Speed CMOS Logic Data
DL129 — Rev 6
3
MOTOROLA
MC74HC58
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
14
8
B
1
7
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0
_
10
_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0
_
10
_
0.39
1.01
A
F
C
N
H
G
D
SEATING
PLANE
L
J
K
M
–A–
14
8
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
–B–
1
7
P
7 PL
0.25 (0.010)
M
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
C
R
X 45°
F
SEATING
PLANE
D
14 PL
K
M
M
B
S
J
0.25 (0.010)
T
A
S
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0°
7°
6.20
5.80
0.50
0.25
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7°
0°
0.228 0.244
0.010 0.019
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different
applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does
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associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.
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