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MC9S08MP16VLF

8-BIT, FLASH, 50.33MHz, MICROCONTROLLER, PQFP48, QFP-48

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Rochester Electronics
零件包装代码
QFP
包装说明
QFP-48
针数
48
Reach Compliance Code
unknown
具有ADC
YES
地址总线宽度
位大小
8
最大时钟频率
16 MHz
DAC 通道
YES
DMA 通道
NO
外部数据总线宽度
JESD-30 代码
S-PQFP-G48
JESD-609代码
e3
长度
7 mm
湿度敏感等级
3
端子数量
48
最高工作温度
105 °C
最低工作温度
-40 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
LFQFP
封装形状
SQUARE
封装形式
FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度)
260
ROM可编程性
FLASH
座面最大高度
1.6 mm
速度
50.33 MHz
最大供电电压
5.5 V
最小供电电压
2.7 V
标称供电电压
5 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
MATTE TIN
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
40
宽度
7 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
文档预览
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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MC9S08MP16
Rev. 2, 08/2011
MC9S08MP16 Series Data
Sheet
Features
• 8-Bit HCS08 Central Processor Unit (CPU)
– Up to 51.34 MHz CPU at 2.7V to 5.5V across temperature
range of –40°C to 105°C
– Up to 40 MHz CPU at 2.7V to 5.5V across temperature range
of –40°C to 125°C
– HC08 instruction set with added BGND instruction and
additional addressing modes for LDHX and STHX
– Support for up to 48 interrupt/reset sources
• On-Chip Memory
– Up to 16 KB flash memory; read/program/erase over full
operating voltage and temperature
– Up to 1 KB random-access memory (RAM)
– Security circuitry to prevent unauthorized access to RAM and
flash memory contents
• Power-Saving Modes
– Two low power stop modes; reduced power wait mode
– Peripheral clock gating can disable clocks to unused modules
• Clock Source Options
– Oscillator (XOSC) — Loop-control Pierce oscillator; Crystal
or ceramic resonator range of 31.25–38.4 kHz or 1–16 MHz
– Internal Clock Source (ICS) — Containing a
frequency-locked-loop (FLL) controlled by internal or
external reference; precision trimming of internal reference
allows 0.2% resolutions and 2% deviation over temperature
and voltage; supports CPU frequencies up to 51.34 MHz
• System Protection
– Watchdog computer operating properly (COP) reset running
from dedicated 1-kHz internal clock source or bus clock
– Low-voltage detection with reset or interrupt; selectable trip
points
– Illegal opcode and illegal address detection with reset
– Flash memory block protection
• Development Support
– Single-wire background debug interface
– Breakpoint capability to allow single breakpoint setting during
in-circuit debugging (plus three more breakpoints in on-chip
debug module)
– On-chip in-circuit emulator (ICE) debug module containing
three comparators and nine trigger modes. Eight deep FIFO for
storing change-of-flow addresses and event-only data. Debug
module supports both tag and force breakpoints
• Peripherals
IPC
— Interrupt Priority Controller with 4 programmable
interrupt priority levels
ADC
— 13-channel, 12-bit resolution; 2.5
s
conversion time;
automatic compare function; 1.7 mV/C temperature sensor;
internal bandgap reference channel; operation in stop3
48-LQFP
Case 932-03
28-SOIC
Case 751F-05
32-LQFP
Case 873A-03
PGA
— Differential programmable gain amplifier with
programmable gain (x1, x2, x4, x8, x16, or x32)
HSCMP
— Three fast analog comparators with positive and
negative inputs; separately selectable interrupt on rising and
falling comparator output; filtering; windowing; HSCMP1 and
HSCMP2 outputs can be optionally routed to FTM1 module;
runs in stop3
DAC
— Three 5-bit digital to analog convertor used as a
32-tap voltage reference for each comparator
PDB
— Two programmable delay blocks: PDB1 synchronizes
PWM with samples of ADC; PDB2 synchronizes PWM with
comparing window of analog comparators
SCI
— Full duplex non-return to zero (NRZ); LIN master
extended break generation; LIN slave extended break
detection; wake up on active edge
SPI
— Full-duplex or single-wire bidirectional;
Double-buffered transmit and receive; Master or Slave mode;
MSB-first or LSB-first shifting
IIC/SMBus
— Up to 400 kbps; Multi-master operation;
Programmable slave address; Interrupt driven byte-by-byte
data transfer; supports broadcast mode and 10-bit addressing;
SMBus compatible
FTM
— Two Flextimers with total of 8 channels; One
2-channel (FTM1) and one 6-channel (FTM2); supports
operation up to 2x bus clock; selectable input capture, output
compare, edge- or center-aligned PWM; dead time insertion;
fault inputs
MTIM
— 8-bit modulo counter with 8-bit prescaler
RTC
— (Real-time counter) 8-bit modulus counter with
binary or decimal based prescaler; External clock source for
precise time base, time-of-day, calendar or task scheduling;
Free running on-chip low power oscillator (1 kHz) for cyclic
wake-up without external components, runs in all MCU modes
CRC
— Cyclic redundancy check generator
KBI
— Three 8 channel keyboard interrupt module with
software selectable polarity on edge or edge/level modes
• Input/Output
– 40 GPIOs, 2 output-only pins.
– Hysteresis and configurable pull up device on input pins;
Configurable slew rate and drive strength on output pins;
Sink/Source current up to 20mA
• Package Options
– 48-LQFP, 32-LQFP, 28-SOIC
– 48-LQFP qualified for automotive usage
Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
© Freescale Semiconductor, Inc., 2009-2011. All rights reserved.
Table of Contents
1
2
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
2.2 Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . . .9
2.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . .9
2.4 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .10
2.5 ESD Protection and Latch-Up Immunity . . . . . . . . . . . .11
2.6 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
2.7 Supply Current Characteristics . . . . . . . . . . . . . . . . . . .15
2.8 External Oscillator (XOSC) Characteristics . . . . . . . . .20
2.9 Internal Clock Source (ICS) Characteristics . . . . . . . . .21
2.10 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .23
2.11 Digital to Analog (DAC) Characteristics . . . . . . . . . . . .26
2.12 High Speed Comparator (HSCMP) Characteristics . . .26
2.13 Programmable Gain Amplifier (PGA) Characteristics .
2.14 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.14.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . .
2.14.2 FTM Module Timing . . . . . . . . . . . . . . . . . . . . .
2.14.3 MTIM Module Timing . . . . . . . . . . . . . . . . . . . .
2.14.4 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.15 Flash Memory Specifications. . . . . . . . . . . . . . . . . . . .
2.16 EMC Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.16.1 Radiated Emissions . . . . . . . . . . . . . . . . . . . . .
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Device Numbering Scheme. . . . . . . . . . . . . . . . . . . . .
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Related Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
26
27
27
28
29
30
33
33
33
34
35
35
35
35
3
4
5
6
MC9S08MP16 Series Data Sheet, Rev. 2
2
Freescale Semiconductor
Interrupt Priority Controller
(IPC)
HCS08 CORE
CPU
BKGD
INT
BKP
ON-CHIP ICE
DEBUG MODULE (DBG)
CYCLIC REDUNDANCY
CHECK (CRC)
8-BIT KEYBOARD
INTERRUPT (KBI1)
8-BIT KEYBOARD
INTERRUPT (KBI2)
BKGD/MS
8-BIT KEYBOARD
INTERRUPT (KBI3)
IIC MODULE (IIC)
KBI1P[7:0]
PTA7/SPSCK
PTA6/MOSI
PTA5/SCL/MISO
PTA4/TCLK/SDA/SS
PTA3/SCL/FTM1CH1
PTA2/SDA/FTM1CH0
PTA1/SCL/RxD
PTA0/SDA/TxD
PTB7/KBI1P7/ADP7/C3IN4
PTB6/KBI1P6/CMP3OUT/ADP6/C3IN3
PTB5/KBI1P5/CMP2OUT/ADP5/C2IN4
PTB4/KBI1P4/ADP4/C2IN3
PTB3/KBI1P3/ADP3/C3IN2/PGA-
PTB2/KBI1P2/ADP2/C1IN2/PGA+
PTB1/KBI1P1/ADP1/C2IN2
PTB0/KBI1P0/ADP0/CIN1
PTC7/KBI2P7/TCLK
PTC6/KBI2P6/FTM2FAULT
PTC5/KBI2P5/FTM2CH5
PTC4/KBI2P4/FTM2CH4
PTC3/KBI2P3/FTM2CH3
PTC2/KBI2P2/FTM2CH2
PTC1/KBI2P1/FTM2CH1
PTC0/KBI2P0/FTM2CH0
PTD7/KBI3P7/CMP3OUT
PTD6/KBI3P6/CMP2OUT
PTD5/KBI3P5/CMP1OUT
PTD4/KBI3P4/PDB2OUT
PTD3/KBI3P3/FTM1FAULT
PTD2/KBI3P2/PDB1OUT
PTD1/KBI3P1/SCL
PTD0/KBI3P0/SDA
PTE6/EXTAL
PTE5/XTAL
PTE4/ADP12/C1IN4
PTE3/ADP11/C1IN3
PTE2/ADP10
PTE1/ADP9
PTE0/ADP8
PTF2
PTF1/RESET
PTF0/BKGD/MS
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
COP
KBI2P[7:0]
KBI3P[7:0]
RESET
LVD
USER FLASH
SCL
SDA
(Only on MC9S08MP16)
2-CHANNEL FLEXTIMER
(FTM1)
6-CHANNEL FLEXTIMER
(MC9S08MP16 = 16384 BYTES)
(MC9S08MP12 = 12288 BYTES)
USER RAM
TCLK
FTM1FAULT
FTM2CH[5:0]
TCLK
FTM2FAULT
TCLK
(FTM2)
8-BIT MODULO TIMER
(MTIM)
SERIAL COMMUNICATIONS
INTERFACE (SCI)
XTAL
EXTAL
SERIAL PERIPHERAL
INTERFACE (SPI)
PROGRAMMABLE DELAY
BLOCK (PDB1)
PROGRAMMABLE DELAY
BLOCK (PDB2)
12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
PROGRAMMABLE
GAIN AMPLIFIER (
PGA)
50.33 MHz INTERNAL CLOCK
SOURCE (ICS)
LOW-POWER OSCILLATOR
31.25 kHz to 38.4 kHz
1 MHz to 16 MHz
(XOSC)
REAL TIME
COUNTER (RTC)
TxD
RxD
SS
SPSCK
MISO
MOSI
PDB1OUT
PDB2OUT
V
REFH
V
DDA
/V
REFH
V
SSA
/V
REFL
VOLTAGE
REGULATOR
V
REFL
V
DD1
V
SS1
V
DD2
V
SS2
PGA+
PGA–
CIN1
C1IN2
C1IN3
C1IN4
CMP1OUT
C2IN2
C2IN3
C2IN4
CMP2OUT
C3IN2
C3IN3
C3IN4
CMP3OUT
(Only on MC9S08MP16)
DIGITAL-TO-ANALOG
CONVERTER (DAC1)
HIGH SPEED ANALOG
COMPARATOR (HSCMP1)
DIGITAL-TO-ANALOG
CONVERTER (DAC2)
HIGH SPEED ANALOG
COMPARATOR (HSCMP2)
DIGITAL-TO-ANALOG
CONVERTER (DAC3)
HIGH SPEED ANALOG
COMPARATOR (HSCMP3)
Notes:
When PTF1 is configured as RESET, pin becomes bi-directional with output being open-drain drive containing an internal pull-up device.
When PTF0 is configured as BKGD, pin becomes bi-directional.
V
DD2
pad is tied internally on 32-pin and 28-pin packages,
V
SS2
pad is tied internally on 28-pin packages
Figure 1. MC9S08MP16 Series Block Diagram
MC9S08MP16 Series Data Sheet, Rev. 2
Freescale Semiconductor
3
PORT F
PORT E
ADP12–ADP0
PORT D
PORT C
(MC9S08MP16 = 1024 BYTES)
(MC9S08MP12 = 512 BYTES)
PORT B
FTM1CH[1:0]
PORT A
pins not available on 28-pin packages
pins not available on 32-pin or 28-pin packages
Pin Assignments
1
Pin Assignments
PTB6/KBI1P6/CMP3OUT/ADP6/C3IN3
38
This section shows the pin assignments for the MC9S08MP16 Series devices.
PTB5/KBI1P5/CMP2OUT/ADP5/C2IN4
37
36
35
34
33
32
31
30
29
28
27
26
25
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
PTC4/KBI2P4/FTM2CH4
PTC5/KBI2P5/FTM2CH5
PTC6/KBI2P6/FTM2FAULT
PTC7/KBI2P7/TCLK
PTD0/KBI3P0/SDA
PTD1/KBI3P1/SCL
PTD2/KBI3P2/PDB1OUT
PTD3/KBI3P3/FTM1FAULT
V
SS1
V
DD1
PTA0/SDA/TxD
PTA1/SCL/RxD
1
2
3
4
5
6
7
8
9
10
11
12
39
PTB7/KBI1P7/ADP7/C3IN4
PTC3/KBI2P3/FTM2CH3
PTC2/KBI2P2/FTM2CH2
PTC1/KBI2P1/FTM2CH1
PTC0/KBI2P0/FTM2CH0
PTF0/BKGD/MS
PTE6/EXTAL
PTE5/XTAL
V
DD2
V
SS2
PTB4/KBI1P4/ADP4/C2IN3
PTE4/ADP12/C1IN4
PTE3/ADP11/C1IN3
V
SSA
/V
REFL
V
DDA
/V
REFH
PTB3/KBI1P3/ADP3/C3IN2/PGA–
PTB2/KBI1P2/ADP2/C1IN2/PGA+
PTB1/KBI1P1/ADP1/C2IN2
PTB0/KBI1P0/ADP0/CIN1
PTE2/ADP10
PTE1/ADP9
PTE0/ADP8
PTF2
PTA2/SDA/FTM1CH0
PTA3/SCL/FTM1CH1
PTA6/MOSI
PTA4/TCLK/SDA/SS
PTD4/KBI3P4/PDB2OUT
PTD5/KBI3P5/CMP1OUT
PTD6/KBI3P6/CMP2OUT
PTD7/KBI3P7/CMP3OUT
PTA5/SCL/MISO
PTA7/SPSCK
PTF1/RESET
Note:
Pins in
bold
are lost in the next
lower pin count package.
Figure 2. MC9S08MP16 Series in 48-LQFP
MC9S08MP16 Series Data Sheet, Rev. 2
4
Freescale Semiconductor
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参数对比
与MC9S08MP16VLF相近的元器件有:MC9S08MP16VWL、MC9S08MP16VLC。描述及对比如下:
型号 MC9S08MP16VLF MC9S08MP16VWL MC9S08MP16VLC
描述 8-BIT, FLASH, 50.33MHz, MICROCONTROLLER, PQFP48, QFP-48 8-BIT, FLASH, 50.33 MHz, MICROCONTROLLER, PDSO28, SOIC-28 8-BIT, FLASH, 50.33 MHz, MICROCONTROLLER, PQFP32, QFP-32
是否无铅 不含铅 不含铅 不含铅
厂商名称 Rochester Electronics Rochester Electronics Rochester Electronics
零件包装代码 QFP SOIC QFP
包装说明 QFP-48 SOP, LQFP,
针数 48 28 32
Reach Compliance Code unknown unknown unknown
具有ADC YES YES YES
位大小 8 8 8
最大时钟频率 16 MHz 16 MHz 16 MHz
DAC 通道 YES YES YES
DMA 通道 NO NO NO
JESD-30 代码 S-PQFP-G48 R-PDSO-G28 S-PQFP-G32
JESD-609代码 e3 e3 e3
长度 7 mm 17.925 mm 7 mm
湿度敏感等级 3 3 3
端子数量 48 28 32
最高工作温度 105 °C 105 °C 105 °C
最低工作温度 -40 °C -40 °C -40 °C
PWM 通道 YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP SOP LQFP
封装形状 SQUARE RECTANGULAR SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH SMALL OUTLINE FLATPACK, LOW PROFILE
峰值回流温度(摄氏度) 260 260 260
ROM可编程性 FLASH FLASH FLASH
座面最大高度 1.6 mm 2.65 mm 1.6 mm
速度 50.33 MHz 50.33 MHz 50.33 MHz
最大供电电压 5.5 V 5.5 V 5.5 V
最小供电电压 2.7 V 2.7 V 2.7 V
标称供电电压 5 V 5 V 5 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 MATTE TIN MATTE TIN MATTE TIN
端子形式 GULL WING GULL WING GULL WING
端子节距 0.5 mm 1.27 mm 0.8 mm
端子位置 QUAD DUAL QUAD
处于峰值回流温度下的最长时间 40 40 40
宽度 7 mm 7.5 mm 7 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
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