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MC9S12ZVL12MLC

Microcontroller

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
Objectid
145116090326
包装说明
LQFP-32
Reach Compliance Code
unknown
YTEOL
6
具有ADC
YES
地址总线宽度
32
位大小
16
边界扫描
NO
CPU系列
MC9S12ZVL
最大时钟频率
20 MHz
DAC 通道
NO
DMA 通道
NO
外部数据总线宽度
32
格式
FIXED POINT
集成缓存
NO
JESD-30 代码
S-PQFP-G32
长度
7 mm
低功率模式
YES
I/O 线路数量
20
端子数量
32
计时器数量
8
片上数据RAM宽度
8
片上程序ROM宽度
8
最高工作温度
125 °C
最低工作温度
-40 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
LQFP
封装等效代码
QFP32,.35SQ,32
封装形状
SQUARE
封装形式
FLATPACK, LOW PROFILE
RAM(字数)
8192
ROM(单词)
131072
ROM可编程性
FLASH
座面最大高度
1.6 mm
速度
32 MHz
最大压摆率
25 mA
最大供电电压
18 V
最小供电电压
5.5 V
标称供电电压
12 V
表面贴装
YES
技术
CMOS
温度等级
AUTOMOTIVE
端子形式
GULL WING
端子节距
0.8 mm
端子位置
QUAD
宽度
7 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
文档预览
MC9S12ZVL Family Reference
Manual and Datasheet
S12 MagniV
Microcontrollers
Rev. 2.48
April 3, 2019
MC9S12ZVLRM
nxp.com
The MC9S12ZVL family of microcontrollers is targeted at use in safety relevant systems and has
been developed using an ISO26262 compliant development system under the NXP Safe Assure
program.
For more details of how to use the device in safety relevant systems refer to the MC9S12ZVL
Safety Manual at :
http://nxp.com/S12ZVL
To provide the most up-to-date information, the revision of our documents on the World Wide Web will be
the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
http://nxp.com
A full list of family members and options is included in the device overview section.
This document contains information for all constituent modules, with the exception of the S12Z CPU. For
S12ZCPU information please refer to the CPU S12Z Reference Manual.
NOTE
This reference manual documents the entire S12ZVL-Family. It
contains a superset of features within the family. Some module versions
differ from one part to another within the family. Section 1.2.1
MC9S12ZVL-Family Member Comparison provides support to access
the correct information for a particular part within the family.
MC9S12ZVL Family Reference Manual, Rev. 2.48
NXP Semiconductors
2
Revision History
Date
Revision
Level
Description
Updated
Chapter 1, “Device Overview MC9S12ZVL-Family”
Updated
Chapter 10, “Analog-to-Digital Converter (ADC12B_LBA)”
Updated
Chapter 18, “Serial Communication Interface (S12SCIV6)”
Updated
Chapter 19, “Serial Peripheral Interface (S12SPIV5)”
Updated
Chapter 21, “LIN Physical Layer (S12LINPHYV2)””
Updated
Appendix A, “MCU Electrical Specifications”
Updated
Appendix O, “Detailed Register Address Map”
Updated
Appendix N, “Ordering Information”
Updated
Chapter 1, “Device Overview MC9S12ZVL-Family”
Updated
Chapter 8, “ECC Generation Module (SRAM_ECCV2)”
Updated
Chapter 10, “Analog-to-Digital Converter (ADC12B_LBA)”
Updated MC9S12ZVL”
Updated
Chapter 19, “Serial Peripheral Interface (S12SPIV5)”
Updated
Chapter 21, “LIN Physical Layer (S12LINPHYV2)””
Updated
Appendix A, “MCU Electrical Specifications”
Updated
Chapter 1, “Device Overview MC9S12ZVL-Family”
Updated
Chapter 5, “Background Debug Controller (S12ZBDCV2)”
Updated
Chapter 7, “S12Z DebugLite (S12ZDBGV3)”
Updated
Chapter 22, “Flash Module (S12ZFTMRZ)”
Updated
Chapter 21, “LIN Physical Layer (S12LINPHYV2)””
Updated
Appendix A, “MCU Electrical Specifications”
Updated
Appendix O, “Detailed Register Address Map
Updated
Appendix M, “Package Information
28 September 2013
0.14
28 November 2013
0.15
17 September 2014
1.00
16 October 2014
1.01
• Updated
Appendix A, “MCU Electrical Specifications”
Initial version including ZVL128
• Updated
Chapter 1, “Device Overview MC9S12ZVL-Family”
• Updated
Chapter 2, “Port Integration Module (S12ZVLPIMV2)”
• Added
Chapter 3, “5V Analog Comparator (ACMPV2)”
• Updated
Chapter 7, “S12Z DebugLite (S12ZDBGV3)”
• Updated
Chapter 10, “Analog-to-Digital Converter (ADC12B_LBA)”
• Added
Chapter 11, “Digital Analog Converter (DAC_8B5V_V2)”
• Added
Chapter 12, “Programmable Gain Amplifier (PGAV1)”
• Added
Chapter 13, “Scalable Controller Area Network (S12MSCANV2)”
• Updated
Chapter 22, “Flash Module (S12ZFTMRZ)”
• Updated
Appendix O, “Detailed Register Address Map”
• Updated
Chapter 1, “Device Overview MC9S12ZVL-Family”
• Added new version of
Chapter 8, “ECC Generation Module
(SRAM_ECCV2)”
• Added new version of
Chapter 9, “S12 Clock, Reset and Power
Management Unit (S12CPMU_UHV)”
• Added new version of
Chapter 12, “Programmable Gain Amplifier
(PGAV1)
• added VL128 specific parameter (3.3V VDDX mode, Supply Current
Table) to
Appendix A, “MCU Electrical Specifications
11 December 2014
2.00
05 May 2015
2.00 Draft D
MC912ZVL Family Reference Manual, Rev. 2.48
NXP Semiconductors
3
Revision History
Date
Revision
Level
Description
• Added new version of
Chapter 12, “Programmable Gain Amplifier
(PGAV1)
• Added new version of
Chapter 11, “Digital Analog Converter
(DAC_8B5V_V2)
• added missing modules DAC, PGA, ACMP, PWM1 to
Appendix O,
“Detailed Register Address Map
• update voltage range inside
Appendix I, “ACMP Electrical Specifications
and
Appendix G, “DAC_8B5V Electrical Specifications
• Added new version of
Chapter 1, “Device Overview MC9S12ZVL-Family”
• Added new version of
Appendix A, “MCU Electrical Specifications
• Added new version v0.4 of
Appendix A, “MCU Electrical Specifications”
• correct Order Information
• change to NXP style
• Added new version of
Appendix A, “MCU Electrical Specifications
• Added version 0.80 of
Appendix A, “MCU Electrical Specifications
• changed to
Chapter 10, “Analog-to-Digital Converter (ADC12B_LBA)
version V3
• Added version 0.90 of
Appendix A, “MCU Electrical Specifications
• Added version 2.00 of
Chapter 1, “Device Overview MC9S12ZVL-Family
• Added version 1.0 of
Appendix A, “MCU Electrical Specifications
• Added version 1.1 of
Appendix A, “MCU Electrical Specifications
• Added version 1.2 of
Appendix A, “MCU Electrical Specifications
• Added version 1.21 of
Appendix A, “MCU Electrical Specifications
• Added version 2.1 of
Chapter 1, “Device Overview MC9S12ZVL-Family
• Added version 1.22 of
Appendix A, “MCU Electrical Specifications
• Added version 1.23 of
Appendix A, “MCU Electrical Specifications
• Added version 1.24 of
Appendix A, “MCU Electrical Specifications
• Added version 2.11 of
Chapter 2, “Port Integration Module
(S12ZVLPIMV2)
• Added version 1.25 of
Appendix A, “MCU Electrical Specifications
• Added version 1.26 of
Appendix A, “MCU Electrical Specifications
• Added version 1.27 of
Appendix A, “MCU Electrical Specifications
• Added version 2.12 of
Chapter 2, “Port Integration Module
(S12ZVLPIMV2)
• Added version 1.29 of
Appendix A, “MCU Electrical Specifications
• Added version 3.04 of
Chapter 16, “Timer Module (TIM16B2CV3)
• Added version 3.04 of
Chapter 15, “Timer Module (TIM16B6CV3)
13 May 2015
2.00 Draft E
05 June 2015
27 October 2015
25 February 2016
2.00 Draft F
2.00 Draft G
2.00Draft I
10 May 2016
2.00
08 August 2017
12 September 2017
10 October 2017
19 October 2017
24 October 2017
28-March 2018
29-March 2018
9-Jul 2018
23-Aug 2018
12 Nov 2018
19 Nov 2018
2.10
2.20
2.30
2.40
2.41
2.42
2.43
2.44
2.45
2.46
2.47
3 Apr 2019
2.48
MC912ZVL Family Reference Manual, Rev. 2.48
4
NXP Semiconductors
NXP Semiconductor reserves the right to make changes without further notice to any products herein. NXP Semiconductor
makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does NXP
Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in
NXP Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary
over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical
experts. NXP Semiconductor does not convey any license under its patent rights nor the rights of others. NXP Semiconductor
products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the NXP Semiconductor
product could create a situation where personal injury or death may occur. Should Buyer purchase or use NXP Semiconductor
products for any such unintended or unauthorized application, Buyer shall indemnify and hold NXP Semiconductor and its
officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and
reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended
or unauthorized use, even if such claim alleges that NXP Semiconductor was negligent regarding the design or manufacture of
the part.
MC912ZVL Family Reference Manual, Rev. 2.48
NXP Semiconductors
5
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