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MCF53015CMJ240J

Microprocessors - MPU CFV3 SECURITY

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
零件包装代码
BGA
包装说明
BGA, BGA256,16X16,40
针数
256
Reach Compliance Code
compliant
ECCN代码
5A002
Samacsys Description
MCF5301x Microprocessors
地址总线宽度
24
位大小
32
边界扫描
YES
最大时钟频率
80 MHz
外部数据总线宽度
32
格式
FIXED POINT
集成缓存
YES
JESD-30 代码
S-PBGA-B256
低功率模式
YES
湿度敏感等级
3
端子数量
256
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA256,16X16,40
封装形状
SQUARE
封装形式
GRID ARRAY
峰值回流温度(摄氏度)
260
电源
1.2,1.8/3.3,3.3 V
认证状态
Not Qualified
速度
240 MHz
最大供电电压
1.32 V
最小供电电压
1.08 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Silver/Copper - with Nickel barrier
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
40
uPs/uCs/外围集成电路类型
MICROPROCESSOR
文档预览
Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MCF53017
Rev. 5, 3/2010
MCF53017
LQFP–208
28 x 28
MAPBGA–256
17 x 17
MCF5301x Data Sheet
Features
• Version 3 ColdFire
®
core with EMAC
• Up to 211 Dhrystone 2.1 MIPS @ 240 MHz
• 16 KBytes unified instruction/data cache
• 128 KBytes internal SRAM with standby power supply
support
• Crossbar switch technology (XBS) for concurrent access to
peripherals or RAM from multiple bus masters
• Enhanced Secure Digital Host Controller (eSDHC)
– Supports CE-ATA, SD Memory, miniSD Memory,
SDIO, miniSDIO, SD Combo, MMC, MMC plus, MMC
4x, and MMC RS cards
• Two ISO7816 smart card interfaces
• IC identification module
• Voice-band audio codec with integrated speaker,
microphone, headphone, and handset amplifiers
• 16- or 32-bit SDR, 16-bit DDR/mobile-DDR SDRAM
controller
• USB 2.0 On-the-Go controller
• USB host controller
• 2 10/100 Ethernet MACs
• Coprocessor for acceleration of the DES, 3DES, AES,
MD5, and SHA-1 algorithms
• Random number generator
• 16-channel DMA controller
• Synchronous serial interface
• 4 periodic interrupt timers
• 4 32-bit timers with DMA support
• Real-time clock (RTC) module with standby support
• DMA-supported serial peripheral interface (DSPI)
• 3 UARTs
• I
2
C bus interface
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© Freescale Semiconductor, Inc., 2010. All rights reserved.
Preliminary—Subject to Change Without Notice
Table of Contents
1
2
3
MCF5301x Family Comparison . . . . . . . . . . . . . . . . . . . . . . . .4
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Hardware Design Considerations . . . . . . . . . . . . . . . . . . . . . . .5
3.1 PLL Power Filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
3.2 USB Power Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
3.3 Supply Voltage Sequencing . . . . . . . . . . . . . . . . . . . . . .6
3.3.1 Power Up Sequence . . . . . . . . . . . . . . . . . . . . . .7
3.3.2 Power Down Sequence . . . . . . . . . . . . . . . . . . . .7
3.4 Power Consumption Specifications. . . . . . . . . . . . . . . . .8
Pin Assignments and Reset States . . . . . . . . . . . . . . . . . . . . .9
4.1 Signal Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
4.2 Pinout—208 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
4.3 Pinout–256 MAPBGA . . . . . . . . . . . . . . . . . . . . . . . . . .18
Preliminary Electrical Characteristics . . . . . . . . . . . . . . . . . . .19
5.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
5.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .20
5.3 ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
5.4 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .21
5.4.1 PLL Power Filtering . . . . . . . . . . . . . . . . . . . . . .22
5.4.2 USB Power Filtering. . . . . . . . . . . . . . . . . . . . . .22
5.4.3 Supply Voltage Sequencing and Separation
Cautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
5.5 Oscillator and PLL Electrical Characteristics . . . . . . . .24
5.6 External Interface Timing Characteristics . . . . . . . . . . .25
5.6.1 FlexBus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
5.7 SDRAM Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
5.7.1 SDR SDRAM AC Timing Characteristics. . . . . .27
5.7.2 DDR SDRAM AC Timing Characteristics . . . . .30
5.8 General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . . .32
5.9 Reset and Configuration Override Timing. . . . . . . . . . .33
5.10 USB On-The-Go . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
5.11 SSI Timing Specifications . . . . . . . . . . . . . . . . . . . . . . 34
5.12 I
2
C Input/Output Timing Specifications . . . . . . . . . . . . 35
5.13 Fast Ethernet AC Timing Specifications . . . . . . . . . . . 37
5.13.1 Receive Signal Timing Specifications . . . . . . . 37
5.13.2 Transmit Signal Timing Specifications . . . . . . . 37
5.13.3 Asynchronous Input Signal Timing Specifications38
5.13.4 MII Serial Management Timing Specifications . 38
5.14 32-Bit Timer Module Timing Specifications . . . . . . . . . 39
5.15 DSPI Timing Specifications . . . . . . . . . . . . . . . . . . . . . 39
5.16 eSDHC Electrical Specifications . . . . . . . . . . . . . . . . . 41
5.16.1 eSDHC Timing . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.16.2 eSDHC Electrical DC Characterisics . . . . . . . . 42
5.17 SIM Electrical Specifications . . . . . . . . . . . . . . . . . . . . 43
5.17.1 General Timing Requirements . . . . . . . . . . . . . 43
5.17.2 Reset Sequence. . . . . . . . . . . . . . . . . . . . . . . . 44
5.17.3 Power Down Sequence . . . . . . . . . . . . . . . . . . 45
5.18 IIM/Fusebox Electrical Specifications . . . . . . . . . . . . . 46
5.19 Voice Codec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
5.19.1 Voice Codec ADC Specifications . . . . . . . . . . . 47
5.19.2 Voice Codec DAC Specifications . . . . . . . . . . . 51
5.20 Integrated Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . 55
5.20.1 Speaker Amplifier . . . . . . . . . . . . . . . . . . . . . . . 55
5.20.2 Handset Amplifier . . . . . . . . . . . . . . . . . . . . . . . 56
5.20.3 Headphone Amplifier . . . . . . . . . . . . . . . . . . . . 57
5.20.4 Microphone Amplifier . . . . . . . . . . . . . . . . . . . . 57
5.21 JTAG and Boundary Scan Timing . . . . . . . . . . . . . . . . 58
5.22 Debug AC Timing Specifications . . . . . . . . . . . . . . . . . 60
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
4
5
6
7
8
MCF5301x Data Sheet, Rev. 5
2
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
MCF53017
Version 3 ColdFire Core
16K
Instruction/
Data
Cache
JTAG
Oscillator
PLL
EMAC
BDM
2 FECs
USB Host
128K
SRAM
Hardware
Divide
CAU
eDMA
eSDHC
USB OTG
Crossbar Switch (XBS)
Splitter
Peripheral Bridge
Codec
IIM
Smart Card
Interface
I
2
C
RTC &
Oscillator
4 DMA
Timers
DSPI
FlexBus
GPIO
SDRAM
Controller
SSI
RNG
2 INTCs
2 EPORTs
3 UARTs
4 PITs
LEGEND
BDM
CAU
DSPI
eDMA
eSDHC
EMAC
EPORT
FEC
GPIO
I
2
C
– Background debug module
– Cryptography acceleration unit
– DMA serial peripheral interface
– Enhanced direct memory access module
– Enhanced Secure Digital host controller
– Enchanced multiply-accumulate unit
– Edge port module
– Fast Ethernet Controller
– General purpose input/output module
– Inter-Integrated Circuit
IIM
INTC
JTAG
PCI
PIT
PLL
RNG
RTC
SSI
USB OTG
IC identification module
Interrupt controller
– Joint Test Action Group interface
– Peripheral Component Interconnect
– Programmable interrupt timers
– Phase locked loop module
– Random number generator
– Real time clock
– Synchronous serial interface
– Universal Serial Bus On-the-Go controller
MCF5301x Data Sheet, Rev. 5
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
3
MCF5301x Family Comparison
1
MCF5301x Family Comparison
Table 1. MCF5301x Family Configurations
MCF53010
MCF53011
MCF53012
MCF53013
MCF53014
MCF53015
MCF53016
MCF53017
2
3
4
4
2
The following table compares the various device derivatives available within the MCF5301x family.
Module
Version 3 ColdFire Core with EMAC (enhanced
multiply-accumulate unit)
Core (system) clock
Peripheral and external bus clock
(Core clock
÷
3)
Performance (Dhrystone/2.1 MIPS)
Unified data/instruction cache
Static RAM (SRAM)
Voice-over-IP software
Cryptography acceleration unit (CAU)
Random number generator
Smart card interface (SIM)
Voice-band audio codec
Integrated audio amplifiers
IC identification module (IIM)
Enhanced Secure Digital host controller (eSDHC)
SDR/DDR SDRAM controller
FlexBus external interface
USB 2.0 On-the-Go
USB 2.0 Host
Synchronous serial interface (SSI)
Fast Ethernet controller (FEC)
UARTs
I
2
C
DSPI
Real-time clock
32-bit DMA timers
Watchdog timer (WDT)
Periodic interrupt timers (PIT)
Edge port module (EPORT)
Interrupt controllers (INTC)
up to 240 MHz
up to 80 MHz
up to 211
16 Kbytes
128 Kbytes
1 port
2 Kbits
2
3
4
4
2
2
3
4
4
2
2
3
4
4
2
2
3
4
4
2
2
3
4
4
2
2
3
4
4
2
2
3
4
4
2
2 ports
MCF5301x Data Sheet, Rev. 5
4
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
Ordering Information
Table 1. MCF5301x Family Configurations (continued)
MCF53010
MCF53011
MCF53012
MCF53013
MCF53014
MCF53015
MCF53016
MCF53017
5
Module
16-channel direct memory access (DMA)
General purpose I/O Module (GPIO)
JTAG - IEEE
®
1149.1 Test Access Port
Package
208 LQFP
256 MAPBGA
2
Ordering Information
Table 2. Orderable Part Numbers
Freescale Part Number
MCF53010CQT240
MCF53011CQT240
MCF53012CQT240
MCF53013CQT240
MCF53014CMJ240J
MCF53015CMJ240J
MCF53016CMJ240J
MCF53017CMJ240J
Description
MCF53010 Microprocessor
MCF53011 Microprocessor
208 LQFP
MCF53012 Microprocessor
MCF53013 Microprocessor
240 MHz
MCF53014 Microprocessor
MCF53015 Microprocessor
256 MAPBGA
MCF53016 Microprocessor
MCF53017 Microprocessor
–40
°
to +85
°
C
Package
Speed
Temperature
The following are not available from Freescale for import or sale in the United States prior to September 2010
MCF53014CMJ240
MCF53015CMJ240
MCF53016CMJ240
MCF53017CMJ240
MCF53014 Microprocessor
MCF53015 Microprocessor
256 MAPBGA
MCF53016 Microprocessor
MCF53017 Microprocessor
240 MHz
–40
°
to +85
°
C
3
3.1
Hardware Design Considerations
PLL Power Filtering
To further enhance noise isolation, an external filter is strongly recommended for PLL analog V
DD
pins. The filter shown in
Figure 1
should be connected between the board IV
DD
and the PLLV
DD
pins. The resistor and capacitors should be placed as
close to the dedicated PV
DD
pin as possible. The 10-ohm resistor in the given filter is required, do not implement the filter circuit
using only capacitors. The PV
DD
pins draw very little current, so concerns regarding voltage loss across the 10-ohm resistor are
not valid.
MCF5301x Data Sheet, Rev. 5
Freescale Semiconductor
Preliminary—Subject to Change Without Notice
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参数对比
与MCF53015CMJ240J相近的元器件有:MCF53013CQT240、PFC-UD1206-11-1982-1982-A-B-1、MCF53017CMJ240J、MCF53010CQT240、MCF53016CMJ240J。描述及对比如下:
型号 MCF53015CMJ240J MCF53013CQT240 PFC-UD1206-11-1982-1982-A-B-1 MCF53017CMJ240J MCF53010CQT240 MCF53016CMJ240J
描述 Microprocessors - MPU CFV3 SECURITY Microprocessors - MPU LONGJING C&I CFV3 VOIP+S Array/Network Resistor, Divider, 0.05% +/-Tol, 15ppm/Cel, Surface Mount, 0612, CHIP Microprocessors - MPU CFV3 SEC&VOIP Microprocessors - MPU LONGJING C&I CFV3 Microprocessors - MPU CFV3 VOIP
是否Rohs认证 符合 符合 不符合 符合 符合 符合
包装说明 BGA, BGA256,16X16,40 LFQFP, QFP208,1.2SQ,20 , 0612 BGA, BGA256,16X16,40 LFQFP, QFP208,1.2SQ,20 LBGA, BGA256,16X16,40
Reach Compliance Code compliant unknown compliant compliant unknown unknown
ECCN代码 5A002 5A002 EAR99 5A002 5A992 5A992
端子数量 256 208 3 256 208 256
最高工作温度 85 °C 85 °C 125 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -55 °C -40 °C -40 °C -40 °C
封装形状 SQUARE SQUARE RECTANGULAR PACKAGE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH SMT GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS THIN FILM CMOS CMOS CMOS
端子面层 Tin/Silver/Copper - with Nickel barrier Matte Tin (Sn) Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Tin/Silver/Copper - with Nickel barrier MATTE TIN TIN SILVER COPPER
是否无铅 不含铅 - 含铅 不含铅 不含铅 不含铅
厂商名称 NXP(恩智浦) NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
零件包装代码 BGA QFP - BGA QFP BGA
针数 256 208 - 256 208 256
位大小 32 32 - 32 32 32
边界扫描 YES YES - YES YES YES
格式 FIXED POINT FIXED POINT - FIXED POINT FIXED POINT FIXED POINT
集成缓存 YES YES - YES YES YES
JESD-30 代码 S-PBGA-B256 S-PQFP-G208 - S-PBGA-B256 S-PQFP-G208 S-PBGA-B256
低功率模式 YES YES - YES YES YES
湿度敏感等级 3 3 - 3 3 3
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA LFQFP - BGA LFQFP LBGA
封装等效代码 BGA256,16X16,40 QFP208,1.2SQ,20 - BGA256,16X16,40 QFP208,1.2SQ,20 BGA256,16X16,40
峰值回流温度(摄氏度) 260 NOT SPECIFIED - 260 260 260
电源 1.2,1.8/3.3,3.3 V 1.2,1.8/3.3,3.3 V - 1.2,1.8/3.3,3.3 V 1.2,1.8/3.3,3.3 V 1.2,1.8/3.3,3.3 V
认证状态 Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified
速度 240 MHz 240 MHz - 240 MHz 240 MHz 240 MHz
最大供电电压 1.32 V 1.32 V - 1.32 V 1.32 V 1.32 V
最小供电电压 1.08 V 1.08 V - 1.08 V 1.08 V 1.08 V
温度等级 INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL GULL WING - BALL GULL WING BALL
端子节距 1 mm 0.5 mm - 1 mm 0.5 mm 1 mm
端子位置 BOTTOM QUAD - BOTTOM QUAD BOTTOM
处于峰值回流温度下的最长时间 40 NOT SPECIFIED - 40 40 40
uPs/uCs/外围集成电路类型 MICROPROCESSOR MICROPROCESSOR - MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
JESD-609代码 - e3 e0 - e3 e1
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