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器件参数

参数名称

属性值

厂商名称

NXP(恩智浦)

包装说明

SIMM, SSIM72

Reach Compliance Code

unknown

最长访问时间

80 ns

I/O 类型

COMMON

JESD-30 代码

R-PSMA-N72

内存密度

16777216 bit

内存集成电路类型

FAST PAGE DRAM MODULE

内存宽度

端子数量

字数

524288 words

字数代码

512000

最高工作温度

70 °C

最低工作温度

组织

512KX32

输出特性

3-STATE

封装主体材料

PLASTIC/EPOXY

封装代码

SIMM

封装等效代码

SSIM72

封装形状

RECTANGULAR

封装形式

MICROELECTRONIC ASSEMBLY

电源

5 V

认证状态

Not Qualified

刷新周期

512

自我刷新

最大待机电流

0.016 A

最大压摆率

0.576 mA

标称供电电压 (Vsup)

5 V

表面贴装

技术

CMOS

温度等级

COMMERCIAL

端子形式

NO LEAD

端子节距

1.27 mm

端子位置

SINGLE

参数对比

与MCM32512SG80相近的元器件有：MCM32L512S10、MCM32L512SG10、MCM32L512S80、MCM32512S80、MCM32512SG10、MCM32L512SG70。描述及对比如下：

型号	MCM32512SG80	MCM32L512S10	MCM32L512SG10	MCM32L512S80	MCM32512S80	MCM32512SG10	MCM32L512SG70
描述	MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC	MEMORY MODULE,DRAM,FAST PAGE,512KX32,CMOS,SSIM,72PIN,PLASTIC
厂商名称	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
包装说明	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72	SIMM, SSIM72
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	80 ns	100 ns	100 ns	80 ns	80 ns	100 ns	70 ns
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PSMA-N72	R-PSMA-N72	R-PSMA-N72	R-PSMA-N72	R-PSMA-N72	R-PSMA-N72	R-PSMA-N72
内存密度	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
内存集成电路类型	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE	FAST PAGE DRAM MODULE
内存宽度	32	32	32	32	32	32	32
端子数量	72	72	72	72	72	72	72
字数	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
字数代码	512000	512000	512000	512000	512000	512000	512000
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM
封装等效代码	SSIM72	SSIM72	SSIM72	SSIM72	SSIM72	SSIM72	SSIM72
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	512	512	512	512	512	512	512
自我刷新	NO	NO	NO	NO	NO	NO	NO
最大待机电流	0.016 A	0.0032 A	0.0032 A	0.0032 A	0.016 A	0.016 A	0.0032 A
最大压摆率	0.576 mA	0.496 mA	0.496 mA	0.576 mA	0.576 mA	0.496 mA	0.656 mA
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE