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MCM63Z737TQ15R

128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM

器件类别：存储    存储   

厂商名称：Motorola ( NXP )

厂商官网：https://www.nxp.com

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参数 预览 参数对比
器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Motorola ( NXP )
零件包装代码
QFP
包装说明
LQFP,
针数
100
Reach Compliance Code
unknow
ECCN代码
3A991.B.2.A
最长访问时间
15 ns
JESD-30 代码
R-PQFP-G100
JESD-609代码
e0
长度
20 mm
内存密度
4718592 bi
内存集成电路类型
ZBT SRAM
内存宽度
36
功能数量
1
端子数量
100
字数
131072 words
字数代码
128000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
128KX36
封装主体材料
PLASTIC/EPOXY
封装代码
LQFP
封装形状
RECTANGULAR
封装形式
FLATPACK, LOW PROFILE
并行/串行
PARALLEL
峰值回流温度（摄氏度）
NOT SPECIFIED
认证状态
Not Qualified
座面最大高度
1.6 mm
最大供电电压 (Vsup)
3.465 V
最小供电电压 (Vsup)
3.135 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
14 mm
文档预览
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MCM63Z737/D
Advance Information
128K x 36 and 256K x 18 Bit
Flow–Through ZBT™ RAM
Synchronous Fast Static RAM
The ZBT RAM is a 4M–bit synchronous fast static RAM designed to provide
zero bus turnaround. The ZBT RAM allows 100% use of bus cycles during
back–to–back read/write and write/read cycles. The MCM63Z737 is organized
as 128K words of 36 bits each and the MCM63Z819 is organized as 256K words
of 18 bits each, fabricated with high performance silicon gate CMOS technology.
This device integrates input registers, a 2–bit address counter, and high speed
SRAM onto a single monolithic circuit for reduced parts count in communication
applications. Synchronous design allows precise cycle control with the use of an
external clock (CK). CMOS circuitry reduces the overall power consumption of
the integrated functions for greater reliability.
Addresses (SA), data inputs (DQ), and all control signals except output enable
(G) and linear burst order (LBO) are clock (CK) controlled through positive–
edge–triggered noninverting registers.
Write cycles are internally self–timed and are initiated by the rising edge of the
clock (CK) input. This feature eliminates complex off–chip write pulse generation
and provides increased timing flexibility for incoming signals.
For read cycles, a flow–through SRAM allows output data to simply flow freely
from the memory array.
•
3.3 V LVTTL and LVCMOS Compatible
•
MCM63Z737/MCM63Z819–11 = 11 ns Access/15 ns Cycle (66 MHz)
MCM63Z737/MCM63Z819–15 = 15 ns Access/20 ns Cycle (50 MHz)
•
Selectable Burst Sequencing Order (Linear/Interleaved)
•
Internally Self–Timed Write Cycle
•
Single–Cycle Deselect
•
Byte Write Control
•
ADV Controlled Burst
•
100–Pin TQFP Package
MCM63Z737
MCM63Z819
TQ PACKAGE
TQFP
CASE 983A–01
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc., and the architecture is supported by
Micron Technology, Inc. and Motorola, Inc.
This document contains information on a new product. Specifications and information herein are subject to change without notice.
2/6/98
©
Motorola, Inc. 1998
MOTOROLA FAST SRAM
MCM63Z737
D
MCM63Z819
1
PIN ASSIGNMENT
SA
SA
SE1
SE2
SBd
SBc
SBb
SBa
SE3
VDD
VSS
CK
SW
CKE
G
ADV
NC
NC
SA
SA
DQc
DQc
DQc
VDDQ
VSS
DQc
DQc
DQc
DQc
VSS
VDDQ
DQc
DQc
VSS
VDD
VDD
VSS
DQd
DQd
VDDQ
VSS
DQd
DQd
DQd
DQd
VSS
VDDQ
DQd
DQd
DQd
100 99 98 97 9695 94 93 92 91 90 89 88 87 86 85 84 83 82 81
1
80
2
79
3
78
4
77
5
76
6
75
7
74
8
73
9
72
10
71
11
70
12
69
13
68
14
67
15
66
16
65
17
64
18
63
19
62
20
61
21
60
22
59
23
58
24
57
25
56
26
55
27
54
28
53
29
52
30
51
31 32 33 34 35 36 3738 39 40 41 42 43 44 4546 47 48 49 50
LBO
SA
SA
SA
SA
SA1
SA0
NC
NC
VSS
VDD
NC
NC
SA
SA
SA
SA
SA
SA
SA
DQb
DQb
DQb
VDDQ
VSS
DQb
DQb
DQb
DQb
VSS
VDDQ
DQb
DQb
VSS
VSS
VDD
VSS
DQa
DQa
VDDQ
VSS
DQa
DQa
DQa
DQa
VSS
VDDQ
DQa
DQa
DQa
TOP VIEW
MCM63Z737
MCM63Z737
D
MCM63Z819
2
MOTOROLA FAST SRAM
PIN ASSIGNMENT
SA
SA
SE1
SE2
NC
NC
SBb
SBa
SE3
VDD
VSS
CK
SW
CKE
G
ADV
NC
NC
SA
SA
NC
NC
NC
VDDQ
VSS
NC
NC
DQb
DQb
VSS
VDDQ
DQb
DQb
VSS
VDD
VDD
VSS
DQb
DQb
VDDQ
VSS
DQb
DQb
DQb
NC
VSS
VDDQ
NC
NC
NC
100 99 98 97 9695 94 93 92 91 90 89 88 87 86 85 84 83 82 81
1
80
2
79
3
78
4
77
5
76
6
75
7
74
8
73
9
72
10
71
11
70
12
69
13
68
14
67
15
66
16
65
17
64
18
63
19
62
20
61
21
60
22
59
23
58
24
57
25
56
26
55
27
54
28
53
29
52
30
51
31 32 33 34 35 36 3738 39 40 41 42 43 44 4546 47 48 49 50
LBO
SA
SA
SA
SA
SA1
SA0
NC
NC
VSS
VDD
NC
NC
SA
SA
SA
SA
SA
SA
SA
SA
NC
NC
VDDQ
VSS
NC
DQa
DQa
DQa
VSS
VDDQ
DQa
DQa
VSS
VSS
VDD
VSS
DQa
DQa
VDDQ
VSS
DQa
DQa
NC
NC
VSS
VDDQ
NC
NC
NC
TOP VIEW
MCM63Z819
MOTOROLA FAST SRAM
MCM63Z737
D
MCM63Z819
3
MCM63Z737 PIN DESCRIPTIONS
Pin Locations
85
89
87
(a) 51, 52, 53, 56, 57, 58, 59, 62, 63
(b) 68, 69, 72, 73, 74, 75, 78, 79, 80
(c) 1, 2, 3, 6, 7, 8, 9, 12, 13
(d) 18, 19, 22, 23, 24, 25, 28, 29, 30
86
31
Symbol
ADV
CK
CKE
DQx
Type
Input
Input
Input
I/O
Description
Synchronous Load/Advance: Loads a new address into counter when
low. RAM uses internally generated burst addresses when high.
Clock: This signal registers the address, data in, and all control signals
except G and LBO.
Clock Enable: Disables the CK input when CKE is high.
Synchronous Data I/O: “x” refers to the byte being read or written
(byte a, b, c, d).
G
LBO
Input
Input
Asynchronous Output Enable.
Linear Burst Order Input: This pin must remain in steady state (this
signal not registered or latched). It must be tied high or low.
Low – linear burst counter.
High – interleaved burst counter.
Synchronous Address Inputs: These inputs are registered and must
meet setup and hold times.
Synchronous Burst Address Inputs: The two LSB’s of the address field.
These pins must preset the burst address counter values. These inputs
are registered and must meet setup and hold times.
Synchronous Byte Write Inputs: Enables write to byte “x”
(byte a, b, c, d) in conjunction with SW. Has no effect on read cycles.
Synchronous Chip Enable: Active low to enable chip.
Synchronous Chip Enable: Active high for depth expansion.
Synchronous Chip Enable: Active low for depth expansion.
Synchronous Write: This signal writes only those bytes that have been
selected using the byte write SBx pins.
Core Power Supply.
I/O Power Supply.
Ground.
No Connection: There is no connection to the chip.
32, 33, 34, 35, 44, 45, 46,
47, 48, 49, 50, 81, 82, 99, 100
36, 37
SA
SA0, SA1
Input
Input
93, 94, 95, 96
(a) (b) (c) (d)
98
97
92
88
15, 16, 41, 65, 91
4, 11, 20, 27, 54, 61, 70, 77
5, 10, 14, 17, 21, 26, 40,
55, 60, 64, 66, 67, 71, 76, 90
38, 39, 42, 43, 83, 84
SBx
SE1
SE2
SE3
SW
VDD
VDDQ
VSS
NC
Input
Input
Input
Input
Input
Supply
Supply
Supply
—
MCM63Z737
D
MCM63Z819
4
MOTOROLA FAST SRAM
MCM63Z819 PIN DESCRIPTIONS
Pin Locations
85
89
87
(a) 58, 59, 62, 63, 68, 69, 72, 73, 74
(b) 8, 9, 12, 13, 18, 19, 22, 23, 24
86
31
Symbol
ADV
CK
CKE
DQx
G
LBO
Type
Input
Input
Input
I/O
Input
Input
Description
Synchronous Load/Advance: Loads a new address into counter when
low. RAM uses internally generated burst addresses when high.
Clock: This signal registers the address, data in, and all control signals
except G and LBO.
Clock Enable: Disables the CK input when CKE is high.
Synchronous Data I/O: “x” refers to the byte being read or written
(byte a, b).
Asynchronous Output Enable.
Linear Burst Order Input: This pin must remain in steady state (this
signal not registered or latched). It must be tied high or low.
Low – linear burst counter.
High – interleaved burst counter.
Synchronous Address Inputs: These inputs are registered and must
meet setup and hold times.
Synchronous Burst Address Inputs: The two LSB’s of the address field.
These pins must preset the burst address counter values. These inputs
are registered and must meet setup and hold times.
Synchronous Byte Write Inputs: Enables write to byte “x”
(byte a, b) in conjunction with SW. Has no effect on read cycles.
Synchronous Chip Enable: Active low to enable chip.
Synchronous Chip Enable: Active high for depth expansion.
Synchronous Chip Enable: Active low for depth expansion.
Synchronous Write: This signal writes only those bytes that have been
selected using the byte write SBx pins.
Core Power Supply.
I/O Power Supply.
Ground.
No Connection: There is no connection to the chip.
32, 33, 34, 35, 44, 45, 46,
47, 48, 49, 50, 80, 81, 82, 99, 100
36, 37
SA
SA0, SA1
Input
Input
93, 94
(a) (b)
98
97
92
88
15, 16, 41, 65, 91
4, 11, 20, 27, 54, 61, 70, 77
5, 10, 14, 17, 21, 26, 40,
55, 60, 64, 66, 67, 71, 76, 90
1, 2, 3, 6, 7, 25, 28, 29, 30, 38,
39, 42, 43, 51, 52, 53, 56, 57,
75, 78, 79, 83, 84, 95, 96
SBx
SE1
SE2
SE3
SW
VDD
VDDQ
VSS
NC
Input
Input
Input
Input
Input
Supply
Supply
Supply
—
MOTOROLA FAST SRAM
MCM63Z737
D
MCM63Z819
5
查看更多>
参数对比
与MCM63Z737TQ15R相近的元器件有：MCM63Z819TQ15R、MCM63Z819TQ15、MCM63Z819TQ11、MCM63Z737TQ11R、MCM63Z737TQ15、MCM63Z737、MCM63Z737TQ11。描述及对比如下：
型号 MCM63Z737TQ15R MCM63Z819TQ15R MCM63Z819TQ15 MCM63Z819TQ11 MCM63Z737TQ11R MCM63Z737TQ15 MCM63Z737 MCM63Z737TQ11
描述 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM 128K x 36 and 256K x 18 Bit Flow-Through ZBT RAM Synchronous Fast Static RAM
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 - 不符合
厂商名称 Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) - Motorola ( NXP )
零件包装代码 QFP QFP QFP QFP - QFP - QFP
包装说明 LQFP, LQFP, LQFP, LQFP, TQFP-100 LQFP, - LQFP,
针数 100 100 100 100 - 100 - 100
Reach Compliance Code unknow unknow unknow unknow unknow unknow - unknow
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A - 3A991.B.2.A
最长访问时间 15 ns 15 ns 15 ns 11 ns 11 ns 15 ns - 11 ns
JESD-30 代码 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 - R-PQFP-G100
JESD-609代码 e0 e0 e0 e0 e0 e0 - e0
长度 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm - 20 mm
内存密度 4718592 bi 4718592 bi 4718592 bi 4718592 bi 4718592 bi 4718592 bi - 4718592 bi
内存集成电路类型 ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM - ZBT SRAM
内存宽度 36 18 18 18 36 36 - 36
功能数量 1 1 1 1 1 1 - 1
端子数量 100 100 100 100 100 100 - 100
字数 131072 words 262144 words 262144 words 262144 words 131072 words 131072 words - 131072 words
字数代码 128000 256000 256000 256000 128000 128000 - 128000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C - 70 °C
组织 128KX36 256KX18 256KX18 256KX18 128KX36 128KX36 - 128KX36
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 LQFP LQFP LQFP LQFP LQFP LQFP - LQFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE - FLATPACK, LOW PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL - PARALLEL
峰值回流温度（摄氏度） NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm - 1.6 mm
最大供电电压 (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V - 3.465 V
最小供电电压 (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V - 3.135 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V - 3.3 V
表面贴装 YES YES YES YES YES YES - YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS - CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL - COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING - GULL WING
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm - 0.65 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD - QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm - 14 mm
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器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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