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MCM69L817ZP6

Cache SRAM, 256KX18, 6ns, MOS, PBGA119, 7 X 17 MM, PLASTIC, BGA-119

器件类别:存储    存储   

厂商名称:Motorola ( NXP )

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Motorola ( NXP )
包装说明
BGA,
Reach Compliance Code
unknown
ECCN代码
3A991.B.2.A
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MCM69L817/D
Product Preview
MCM69L817
256K x 18 Bit Data Latch
BurstRAM™ Synchronous
Fast Static RAM
The MCM69L817 is a 4M bit synchronous fast static RAM designed to provide
a burstable, high performance, secondary cache for the PowerPC™ and other
high performance microprocessors. It is organized as 256K words of 18 bits
each. This device integrates input registers, a 2–bit address counter, and high
speed SRAM onto a single monolithic circuit for reduced parts count in cache
data RAM applications. Synchronous design allows precise cycle control with the
use of an external clock (K).
Addresses (SA), data inputs (DQx), and all control signals except output
enable (G) and linear burst order (LBO) are clock (K) controlled through positive–
edge–triggered noninverting registers.
Bursts can be initiated with either ADSP or ADSC input pins. Subsequent burst
addresses can be generated internally by the MCM69L817 (burst sequence
operates in linear or interleaved mode dependent upon the state of LBO) and
controlled by the burst address advance (ADV) input pin.
Write cycles are internally self–timed and are initiated by the rising edge of the
clock (K) input. This feature eliminates complex off–chip write pulse generation
and provides increased timing flexibility for incoming signals.
Synchronous byte write (SBx), synchronous global write (SGW), and synchro-
nous write enable (SW) are provided to allow writes to either individual bytes or
to all bytes. The two bytes are designated as “a” and “b”. SBa controls DQa and
SBb controls DQb. Individual bytes are written if the selected byte writes SBx are
asserted with SW. All bytes are written if either SGW is asserted or if all SBx and
SW are asserted.
For read cycles, data is available at the following edge of the clock (K).
The MCM69L817 operates from a 3.3 V core power supply and all outputs
operate on a 3.3 V or 2.5 V power supply. All inputs and outputs are JEDEC stan-
dard JESD8–5 compatible.
MCM69L817 Speed Options
Speed
150 MHz
133 MHz
117 MHz
tKHKH
6.7 ns
7.5 ns
8.5 ns
tKHQV
6 ns
6.5 ns
7 ns
Setup
0.5 ns
0.5 ns
0.5 ns
Hold
1 ns
1 ns
1 ns
IDD
375 mA
350 mA
325 mA
ZP PACKAGE
PBGA
CASE 999–01
3.3 V + 10%, – 5% Core Power Supply, Operates with a 3.3 V or 2.5 V I/O
Supply
ADSP, ADSC, and ADV Burst Control Pins
Selectable Burst Sequencing Order (Linear/Interleaved)
Single–Cycle Deselect Timing
Internally Self–Timed Write Cycle
Byte Write and Global Write Control
PB1 Version 2.0 Compatible
JEDEC Standard 119–Pin PBGA Package
BurstRAM is a trademark of Motorola, Inc.
The PowerPC name is a trademark of IBM Corp., used under license therefrom.
This document contains information on a new product under development. Motorola reserves the right to change or discontinue this product without notice.
5/23/97
©
Motorola, Inc. 1997
MOTOROLA FAST SRAM
MCM69L817
1
FUNCTIONAL BLOCK DIAGRAM
LBO
ADV
K
ADSC
ADSP
K2
BURST
COUNTER
CLR
2
2
18
256K x 18 ARRAY
SA
SA1
SA0
ADDRESS
REGISTER
18
16
SGW
SW
SBa
WRITE
REGISTER
b
2
WRITE
REGISTER
c
18
18
DATA–IN
REGISTER
K
DATA–OUT
LATCH
SBb
K2
SE1
SE2
SE3
G
ENABLE
REGISTER
DQa – DQb
MCM69L817
2
MOTOROLA FAST SRAM
PIN ASSIGNMENT
1
A
B
C
D
E
NC
F
G
NC
H
J
K
L
M
N
P
R
T
U
DQb
DQb
NC
SBb
VSS
NC
VSS
VSS
VSS
VSS
VSS
LBO
SA
NC
ADV
SGW
VDD
K
NC
SW
SA1
SA0
VDD
NC
NC
VSS
VSS
NC
VSS
SBa
VSS
VSS
VSS
NC
SA
NC
NC
DQa
DQa
NC
VDDQ
DQb
NC
VDDQ
NC
NC
DQb
2
SA
SE2
SA
NC
3
SA
SA
SA
VSS
VSS
VSS
4
ADSP
ADSC
VDD
NC
SE1
G
5
SA
SA
SA
VSS
VSS
VSS
6
SA
SE3
SA
DQa
NC
7
VDDQ
NC
NC
NC
DQa
DQa VDDQ
VDDQ VDD
NC
DQb
DQb
NC
VDD VDDQ
NC
DQa
NC
DQa
NC
SA
SA
DQa
NC
VDDQ
NC
DQa
NC
NC
VDDQ DQb
DQb
NC
NC
NC
VDDQ
NC
DQb
SA
SA
NC
NC VDDQ
TOP VIEW 119 BUMP PBGA
Not to Scale
MOTOROLA FAST SRAM
MCM69L817
3
PBGA PIN DESCRIPTIONS
Pin Locations
4B
Symbol
ADSC
Type
Input
Description
Synchronous Address Status Controller: Active low, interrupts any
ongoing burst and latches a new external address. Used to initiate a
READ, WRITE, or chip deselect.
Synchronous Address Status Processor: Active low, interrupts any
ongoing burst and latches a new external address used to initiate a new
READ or chip deselect (exception — chip deselect does not occur
when ADSP is asserted and SE1 is high).
Synchronous Address Advance: Increments address count in
accordance with counter type selected (linear/interleaved).
Synchronous Data I/O: “x” refers to the byte being read or written
(byte a, b).
Asynchronous Output Enable Input:
Low — enables output buffers (DQx pins).
High — DQx pins are high impedance.
Clock: This signal registers the address, data in, and all control signals
except G and LBO.
Linear Burst Order Input: This pin must remain in steady state (this
signal not registered or latched). It must be tied high or low.
Low — linear burst counter (68K/PowerPC).
High — interleaved burst counter (486/i960/Pentium).
Synchronous Address Inputs: These inputs are registered and must
meet setup and hold times.
Synchronous Address Inputs: These pins must be wired to the two
LSBs of the address bus for proper burst operation. These inputs are
registered and must meet setup and hold times.
Synchronous Byte Write Inputs: “x” refers to the byte being written (byte
a, b). SGW overrides SBx.
Synchronous Chip Enable: Active low to enable chip.
Negated high — blocks ADSP or deselects chip when ADSC is
asserted.
Synchronous Chip Enable: Active high for depth expansion.
Synchronous Chip Enable: Active low for depth expansion.
Synchronous Global Write: This signal writes all bytes regardless of the
status of the SBx and SW signals. If only byte write signals SBx are
being used, tie this pin high.
Synchronous Write: This signal writes only those bytes that have been
selected using the byte write SBx pins. If only byte write signals SBx
are being used, tie this pin low.
Core Power Supply.
I/O Power Supply.
Ground.
No Connection: There is no connection to the chip.
4A
ADSP
Input
4G
(a) 6D, 7E, 6F, 7G, 6H, 7K, 6L, 6N, 7P
(b) 1D, 2E, 2G, 1H, 2K, 1L, 2M, 1N, 2P
4F
ADV
DQx
G
Input
I/O
Input
4K
3R
K
LBO
Input
Input
2A, 3A, 5A, 6A, 3B, 5B, 2C, 3C,
5C, 6C, 2R, 6R, 2T, 3T, 5T, 6T
4N, 4P
SA
SA1, SA0
Input
Input
5L, 3G
(a) (b)
4E
SBx
SE1
Input
Input
2B
6B
4H
SE2
SE3
SGW
Input
Input
Input
4M
SW
Input
4C, 2J, 4J, 6J, 4R
1A, 7A, 1F, 7F, 1J, 7J, 1M, 7M, 1U, 7U
3D, 5D, 3E, 5E, 3F, 5F, 5G, 3H, 5H,
3K, 5K, 3L, 3M, 5M, 3N, 5N, 3P, 5P
1B, 7B, 1C, 7C, 2D, 4D, 7D, 1E, 6E,
2F, 1G, 6G, 2H, 7H, 3J, 5J, 1K, 6K,
2L, 4L, 7L, 6M, 2N, 7N, 1P, 6P, 1R,
5R, 7R, 1T, 4T, 7T, 2U, 3U, 4U, 5U, 6U
VDD
VDDQ
VSS
NC
Supply
Supply
Supply
MCM69L817
4
MOTOROLA FAST SRAM
TRUTH TABLE
(See Notes 1 Through 5)
Next Cycle
Deselect
Deselect
Deselect
Deselect
Deselect
Begin Read
Begin Read
Continue Read
Continue Read
Continue Read
Continue Read
Suspend Read
Suspend Read
Suspend Read
Suspend Read
Begin Write
Continue Write
Continue Write
Suspend Write
Suspend Write
Address
Used
None
None
None
None
None
External
External
Next
Next
Next
Next
Current
Current
Current
Current
External
Next
Next
Current
Current
SE1
1
0
0
X
X
0
0
X
X
1
1
X
X
1
1
0
X
1
X
1
SE2
X
X
0
X
0
1
1
X
X
X
X
X
X
X
X
1
X
X
X
X
SE3
X
1
X
1
X
0
0
X
X
X
X
X
X
X
X
0
X
X
X
X
ADSP
X
0
0
1
1
0
1
1
1
X
X
1
1
X
X
1
1
X
1
X
ADSC
0
X
X
0
0
X
0
1
1
1
1
1
1
1
1
0
1
1
1
1
ADV
X
X
X
X
X
X
X
0
0
0
0
1
1
1
1
X
0
0
1
1
G3
X
X
X
X
X
X
X
1
0
1
0
1
0
1
0
X
X
X
X
X
DQx
High–Z
High–Z
High–Z
High–Z
High–Z
High–Z
High–Z
High–Z
DQ
High–Z
DQ
High–Z
DQ
High–Z
DQ
High–Z
High–Z
High–Z
High–Z
High–Z
Write 2, 4
X
X
X
X
X
X5
READ5
READ
READ
READ
READ
READ
READ
READ
READ
WRITE
WRITE
WRITE
WRITE
WRITE
NOTES:
1. X = don’t care. 1 = logic high. 0 = logic low.
2. Write is defined as either 1) any SBx and SW low or 2) SGW is low.
3. G is an asynchronous signal and is not sampled by the clock K. G drives the bus immediately (tGLQX) following G going low.
4. On write cycles that follow read cycles, G must be negated prior to the start of the write cycle to ensure proper write data setup times. G must
also remain negated at the completion of the write cycle to ensure proper write data hold times.
5. This read assumes the RAM was previously deselected.
LINEAR BURST ADDRESS TABLE
(LBO = VSS)
1st Address (External)
X . . . X00
X . . . X01
X . . . X10
X . . . X11
2nd Address (Internal)
X . . . X01
X . . . X10
X . . . X11
X . . . X00
3rd Address (Internal)
X . . . X10
X . . . X11
X . . . X00
X . . . X01
4th Address (Internal)
X . . . X11
X . . . X00
X . . . X01
X . . . X10
INTERLEAVED BURST ADDRESS TABLE
(LBO = VDD)
1st Address (External)
X . . . X00
X . . . X01
X . . . X10
X . . . X11
2nd Address (Internal)
X . . . X01
X . . . X00
X . . . X11
X . . . X10
3rd Address (Internal)
X . . . X10
X . . . X11
X . . . X00
X . . . X01
4th Address (Internal)
X . . . X11
X . . . X10
X . . . X01
X . . . X00
WRITE TRUTH TABLE
Cycle Type
Read
Read
Write Byte a
Write Byte b
Write All Bytes
Write All Bytes
SGW
H
H
H
H
H
L
SW
H
L
L
L
L
X
SBa
X
H
L
H
L
X
SBb
X
H
H
L
L
X
MOTOROLA FAST SRAM
MCM69L817
5
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参数对比
与MCM69L817ZP6相近的元器件有:MCM69L817ZP6.5、MCM69L817ZP6.5R、MCM69L817ZP7R、MCM69L817ZP7。描述及对比如下:
型号 MCM69L817ZP6 MCM69L817ZP6.5 MCM69L817ZP6.5R MCM69L817ZP7R MCM69L817ZP7
描述 Cache SRAM, 256KX18, 6ns, MOS, PBGA119, 7 X 17 MM, PLASTIC, BGA-119 Cache SRAM, 256KX18, 6.5ns, MOS, PBGA119, 7 X 17 MM, PLASTIC, BGA-119 Cache SRAM, 256KX18, 6.5ns, MOS, PBGA119, 7 X 17 MM, PLASTIC, BGA-119 Cache SRAM, 256KX18, 7ns, MOS, PBGA119, 7 X 17 MM, PLASTIC, BGA-119 Cache SRAM, 256KX18, 7ns, MOS, PBGA119, 7 X 17 MM, PLASTIC, BGA-119
厂商名称 Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
包装说明 BGA, BGA, BGA, BGA, BGA,
Reach Compliance Code unknown unknown unknown unknown unknown
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
是否Rohs认证 不符合 不符合 - - 不符合
最长访问时间 - 6.5 ns 6.5 ns 7 ns -
JESD-30 代码 - R-PBGA-B119 R-PBGA-B119 R-PBGA-B119 -
长度 - 22 mm 22 mm 22 mm -
内存密度 - 4718592 bit 4718592 bit 4718592 bit -
内存集成电路类型 - CACHE SRAM CACHE SRAM CACHE SRAM -
内存宽度 - 18 18 18 -
功能数量 - 1 1 1 -
端口数量 - 1 1 1 -
端子数量 - 119 119 119 -
字数 - 262144 words 262144 words 262144 words -
字数代码 - 256000 256000 256000 -
工作模式 - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS -
最高工作温度 - 70 °C 70 °C 70 °C -
组织 - 256KX18 256KX18 256KX18 -
输出特性 - 3-STATE 3-STATE 3-STATE -
可输出 - YES YES YES -
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 - BGA BGA BGA -
封装形状 - RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 - GRID ARRAY GRID ARRAY GRID ARRAY -
并行/串行 - PARALLEL PARALLEL PARALLEL -
认证状态 - Not Qualified Not Qualified Not Qualified -
座面最大高度 - 2.4 mm 2.4 mm 2.4 mm -
最大供电电压 (Vsup) - 3.6 V 3.6 V 3.6 V -
最小供电电压 (Vsup) - 3.135 V 3.135 V 3.135 V -
标称供电电压 (Vsup) - 3.3 V 3.3 V 3.3 V -
表面贴装 - YES YES YES -
技术 - MOS MOS MOS -
温度等级 - COMMERCIAL COMMERCIAL COMMERCIAL -
端子形式 - BALL BALL BALL -
端子节距 - 1.27 mm 1.27 mm 1.27 mm -
端子位置 - BOTTOM BOTTOM BOTTOM -
宽度 - 14 mm 14 mm 14 mm -
热门器件
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器件捷径:
S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY
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