型号
- 型号
- 关键词
1M X 8 FAST PAGE DRAM MODULE, 80 ns, SMA30, SIMM-30
厂商名称：Motorola ( NXP )
厂商官网：https://www.nxp.com
下载文档| 型号 | MCM8L1000L80 | MCM8L1000S80 | MCM8L1000LH80 | MCM8L1000AS80 | MCM8L1000L70 |
|---|---|---|---|---|---|
| 描述 | 1M X 8 FAST PAGE DRAM MODULE, 80 ns, SMA30, SIMM-30 | 1MX8 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30 | 1M X 8 FAST PAGE DRAM MODULE, 80 ns, SMA30, SIMM-30 | 1MX8 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30 | 1MX8 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30 |
| 零件包装代码 | SIMM | SIMM | SIMM | SIMM | SIMM |
| 包装说明 | , SIP30(UNSPEC) | SIMM, SIM30 | , SIP30(UNSPEC) | SIMM, SIM30 | , SIP30(UNSPEC) |
| 针数 | 30 | 30 | 30 | 30 | 30 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 80 ns | 80 ns | 80 ns | 80 ns | 70 ns |
| 其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XSMA-T30 | R-XSMA-N30 | R-XSMA-T30 | R-XSMA-N30 | R-XSMA-T30 |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 30 | 30 | 30 | 30 | 30 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装等效代码 | SIP30(UNSPEC) | SIM30 | SIP30(UNSPEC) | SIM30 | SIP30(UNSPEC) |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 |
| 最大待机电流 | 0.0016 A | 0.0016 A | 0.0016 A | 0.0016 A | 0.0016 A |
| 最大压摆率 | 0.56 mA | 0.56 mA | 0.56 mA | 0.56 mA | 0.64 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| JESD-609代码 | e0 | - | e0 | - | e0 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED |
| 厂商名称 | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
