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MCM91000SG70

Fast Page DRAM Module, 1MX9, 70ns, CMOS, SIMM-30

器件类别:存储    存储   

厂商名称:Motorola ( NXP )

厂商官网:https://www.nxp.com

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器件参数
参数名称
属性值
厂商名称
Motorola ( NXP )
包装说明
SIMM-30
Reach Compliance Code
unknown
ECCN代码
EAR99
访问模式
FAST PAGE
最长访问时间
70 ns
其他特性
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT
JESD-30 代码
R-XSMA-N30
内存密度
9437184 bit
内存集成电路类型
FAST PAGE DRAM MODULE
内存宽度
9
功能数量
1
端口数量
1
端子数量
30
字数
1048576 words
字数代码
1000000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
1MX9
输出特性
3-STATE
封装主体材料
UNSPECIFIED
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
认证状态
Not Qualified
刷新周期
512
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
CMOS
温度等级
COMMERCIAL
端子形式
NO LEAD
端子位置
SINGLE
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参数对比
与MCM91000SG70相近的元器件有:MCM91000S80、MCM91000L80、MCM91000SG80、MCM91000LH80、MCM91000LH70、MCM91000S70、MCM91000AS70、MCM91000AS80、MCM91000L70。描述及对比如下:
型号 MCM91000SG70 MCM91000S80 MCM91000L80 MCM91000SG80 MCM91000LH80 MCM91000LH70 MCM91000S70 MCM91000AS70 MCM91000AS80 MCM91000L70
描述 Fast Page DRAM Module, 1MX9, 70ns, CMOS, SIMM-30 1MX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30 1MX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30 Fast Page DRAM Module, 1MX9, 80ns, CMOS, SIMM-30 Fast Page DRAM Module, 1MX9, 80ns, CMOS, SIMM-30 1MX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30 1M X 9 FAST PAGE DRAM MODULE, 70 ns, SMA30, SIMM-30 1MX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30 1MX9 FAST PAGE DRAM MODULE, 80ns, SMA30, SIMM-30 1MX9 FAST PAGE DRAM MODULE, 70ns, SMA30, SIMM-30
包装说明 SIMM-30 SIMM, SIM30 , SIP30,.2 SIMM-30 SIMM-30 , SIP30(UNSPEC) SIMM, SIM30 SIMM, SIM30 SIMM, SIM30 , SIP30,.2
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow unknow unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
最长访问时间 70 ns 80 ns 80 ns 80 ns 80 ns 70 ns 70 ns 70 ns 80 ns 70 ns
其他特性 RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; SEPARATE CAS FOR NINTH BIT
JESD-30 代码 R-XSMA-N30 R-XSMA-N30 R-XSMA-T30 R-XSMA-N30 R-XSMA-T30 R-XSMA-T30 R-XSMA-N30 R-XSMA-N30 R-XSMA-N30 R-XSMA-T30
内存密度 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bit 9437184 bi 9437184 bi 9437184 bi
内存集成电路类型 FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
内存宽度 9 9 9 9 9 9 9 9 9 9
功能数量 1 1 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1 1 1
端子数量 30 30 30 30 30 30 30 30 30 30
字数 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
字数代码 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 1MX9 1MX9 1MX9 1MX9 1MX9 1MX9 1MX9 1MX9 1MX9 1MX9
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 512 512 512 512 512 512 512 512 512 512
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD NO LEAD THROUGH-HOLE
端子位置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
厂商名称 Motorola ( NXP ) - Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
零件包装代码 - SIMM SIMM - - SIMM SIMM SIMM SIMM SIMM
针数 - 30 30 - - 30 30 30 30 30
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