High Q and High Power Chip Multilayer Ceramic Capacitors for General Purpose
GQM2195C2E560JB12_ (0805, C0G:EIA, 56pF, DC250V)
_: packaging code
1.Scope
Reference Sheet
This product specification is applied to High Q and High Power Chip Multilayer Ceramic Capacitors used for General Electronic equipment.
2.MURATA Part NO. System
(Ex.)
GQM
21
(1)L/W
Dimensions
9
(2)T
Dimensions
5C
(3)Temperature
Characteristics
2E
(4)Rated
Voltage
560
(5)Nominal
Capacitance
J
(6)Capacitance
Tolerance
B12
(7)Murata’s Control
Code
D
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
2.0±0.15
(1)-2 W
1.25±0.15
(2) T
0.85±0.15
e
0.2 to 0.7
(Unit:mm)
g
0.7 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
0±30 ppm/°C
25 to 125 °C
(25 °C)
DC 250 V
56 pF
±5 %
-55 to 125 °C
5.Package
mark
D
(8) Packaging
f180mm
Reel
PAPER W8P4
Packaging Unit
4000 pcs./Reel
Product specifications in this catalog are as of Jun.6,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GQM2195C2E560JB12-01
1
■
Specifications and Test Methods
No
1
Item
Rated Voltage
Shown in Rated value.
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
V
P-P
or V
O-P
, whichever is larger, should be maintained
within the rated voltage range.
2
3
4
Appearance
Dimension
Voltage proof
No defects or abnormalities.
Within the specified dimensions.
No defects or abnormalities.
Visual inspection.
Using Measuring instrument of dimension.
Measurement Point
Test Voltage
Applied Time
: Between the terminations
: 250% of the rated voltage
: 1s to 5 s
Charge/discharge current : 50mA max.
5
Insulation Resistance(I.R.)
More than 10,000MΩ
Measurement Point
: Between the terminations
Measurement Voltage :
Charging Time
DC Rated Voltage
: 2 min
Charge/discharge current : 50mA max.
Measurement Temperature : Room Temperature
6
7
Capacitance
Q
Shown in Rated value.
30pF and over
: Q≧1400
Measurement Temperature : Room Temperature
30pF and below : Q≧800+20C
C:Nominal Capacitance(pF)
8
Temperature Characteristics
of Capacitance
Nominal values of the temperature coefficient is shown in
Rated value.
But,the Capacitance Change under 20℃/25℃ is shown in Table A.
Capacitance Drift
Within +/-0.2% or +/-0.05pF
(Whichever is larger.)
Capacitance
C≦1000pF
Frequency
Voltage
1.0+/-0.1MHz 0.5 to 5.0Vrms
The capacitance change should be measured after 5 min
at each specified temp. stage.
Capacitance value as a reference is the value in step 3.
The capacitance drift is calculated by dividing the differences
between the maximum and minimum measured values in the
step 1,3 and 5 by the cap. value in step 3.
Step
1
2
3
4
5
Temperature(C)
Reference Temp.+/-2
Min. Operating Temp.+/-3
Reference Temp.+/-2
Max. Operating Temp.+/-3
Reference Temp.+/-2
9
Adhesive Strength
of Termination
No removal of the terminations or other defect
should occur.
Solder the capacitor on the test substrate shown in Fig.3.
Type
GQM18
GQM21
Applied Force(N)
5
10
Holding Time
: 10+/-1s
the capacitor side.
Applied Direction : In parallel with the test substrate and vertical with
10 Vibration
Appearance
Capacitance
Q
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration
Total amplitude
: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
: 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate
Bending test
Appearance
Capacitance
Change
No defects or abnormalities.
Within +/-5% or +/-0.5pF
(Whichever is larger)
Solder the capacitor on the test substrate shown in Fig.1.
Pressurization method : Shown in Fig.2
Flexure
Holding Time
Soldering Method
:
1mm
:
5+/-1s
: Reflow soldering
: Solder bath method
Solution of rosin ethanol 25(mass)%
: 80℃ to 120℃ for 10s to 30s
: Sn-3.0Ag-0.5Cu
: 245+/-5℃
: 2+/-0.5s
12 Solderability
95% of the terminations is to be soldered evenly and continuously.
Test Method
Flux
Preheat
Solder
Solder Temp.
Immersion time
JEMCNS-0022E
2
No
13 Resistance to
Item
Appearance
Capacitance
Change
Q
I.R.
No defects or abnormalities.
Within +/-2.5% or +/- 0.25pF
(Whichever is larger)
Specification
Test Method
Solder
Solder Temp.
Immersion time
Exposure Time
Preheat
Within the specified initial value.
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
: Solder bath method
: Sn-3.0Ag-0.5Cu
: 270+/-5℃
: 10+/-0.5s
: 24+/-2h
: 120℃ to 150℃ for 1 min
Soldering Heat
Within the specified initial value.
Voltage proof No defects.
14 Temperature
Sudden Change
Capacitance
Change
Q
I.R.
Within +/-2.5% or +/- 0.25pF
(Whichever is larger)
Within the specified initial value.
Step
Temp.(C)
Min.Operating Temp.+0/-3
Room Temp.
Max.Operating Temp.+3/-0
Room Temp
Time (min)
30+/-3
2 to 3
30+/-3
2 to 3
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Perform the 5 cycles according to the four heat treatments
shown in the following table.
Within the specified initial value.
1
2
Voltage proof No defects.
3
4
Exposure Time
15 High
Temperature
High Humidity
(Steady)
Capacitance
Change
Q
Within +/-7.5% or +/- 0.75pF
(Whichever is larger)
30pF and over : Q≧200
30pF and below : Q≧100+10C/3
C:Nominal Capacitance(pF)
I.R.
16 Durability
Appearance
Capacitance
Change
Q
More than 500MΩ
No defects or abnormalities.
Within +/-3% or +/- 0.3pF
(Whichever is larger)
30pF and over : Q≧350
10pF and over , 30pF and below : Q≧275+5C/2
10pF and below : Q≧200+10C
C:Nominal Capacitance (pF)
I.R.
More than 1,000MΩ
Test Temperature
Test Humidity
Test Time
Applied Voltage
Exposure Time
Appearance
No defects or abnormalities.
: 24+/-2h
Solder the capacitor on the test substrate shown in Fig.3.
: 40+/-2℃
: 90%RH to 95%RH
: 500+/-12h
: DC Rated Voltage
: 24+/-2h
Charge/discharge current : 50mA max.
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
Test Time
Applied Voltage
Exposure Time
: Max. Operating Temp. +/-3℃
: 1000+/-12h
: 200% of the rated voltage
: 24+/-2h
Charge/discharge current : 50mA max.
Table A
Char.
2C
5C/5G
Max.
0.82
0.58
-55℃
Min.
-0.45
-0.24
Capacitance Change from 20C/25C (%)
-30℃
-25℃
Max.
Min.
Max.
Min.
-
-
0.49
-0.27
0.40
-0.17
-
-
-10℃
Max.
0.33
0.25
Min.
-0.18
-0.11
JEMCNS-0022E
3
Substrate Bending test
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
Thickness : 1.6mm
Copper foil thickness : 0.035mm
:
Solder resist (Coat with heat resistant resin for solder)
Land
f4.5
*1,2：2.0±0.05
φ1.5
+0.1
-0
4.0±0.1
＊1
＊2
Type
a
100
GQM18
GQM21
a
1.0
1.2
Dimension (mm)
b
Ａ
3.0
4.0
Ｂ
c
1.2
1.65
0.05以下
3.5±0.05
40
c
c
1.75±0.1
8.0±0.3
b
t
Fig.1
・Kind
of Solder : Sn-3.0Ag-0.5Cu
・Pressurization
method
(in mm)
20
50 min.
Pressurization
speed
1.0mm/s
tor
R5
Pressurize
Support
Capacitance meter
45
45
Flexure
Fig.2
(in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, High Temperature High Humidity(Steady) , Durability
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Kind
of Solder : Sn-3.0Ag-0.5Cu
・Land
Dimensions
Chip Capacitor
Land
c
Type
GQM18
GQM21
b
a
Solder Resist
a
1.0
1.2
Dimension (mm)
b
3.0
4.0
c
1.2
1.65
Fig.3
JEMCNS-0022E
4
PACKAGING
GQM Type
1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
φ180mm reel
φ330mm reel
Plastic Tape Paper Tape Plastic Tape
Paper Tape
Code:L
Code:J/F
Code:K
Code:D/E
Code:W
50000(W8P2)
10000(W8P2) 20000(W8P1)
4000
10000
4000
10000
4000
4000
4000
1000
Type
GQM15
GQM187
GQM188
GQM21
(LWT Dimensions Tolerance:±0.1)
GQM21
(LWT Dimensions Tolerance:±0.15)
GQM22
1.2 Dimensions of Tape
(1)GQM15 <Paper Tape W8P2 CODE:D/E/J/F>
1.75±0.1
*1,*2：2.0±0.05
φ1.5
-0
+0.1
(in mm)
4.0±0.1
*1
*2
*1,2：2.0±
3.5±0.05
Ａ
8.0±0.3
Ａ
Ｂ
0.05 max.
t
Type
Dimensions (Chip)
L
W
T
A *3
0.65
B *3
1.15
t
0.8 max.
GQM15 5 1.0±0.05
*3 Nominal value
0.5±0.05
0.5±0.05
(2)GQM15
<Paper Tape W8P1 CODE:W)
1.0±0.05
φ1.5
-0
+0.1
(in mm)
1.75±0.1
4.0±0.1
3.5±0.05
Ａ
1.0±0.05
8.0±0.3
Ｂ
t
Type
Dimensions (Chip)
L
W
T
A *3
0.65
B *3
1.15
t
0.8 max.
GQM15 5 1.0±0.05
*3 Nominal value
0.5±0.05
0.5±0.05
JEMCNP-01900C
5
Ｂ
51单片机
