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MCS0402-250.5%ATE0105R

RES,SMT,THIN FILM,105 OHMS,50WV,.5% +/-TOL,-25,25PPM TC,0402 CASE

器件类别:无源元件    电阻器   

厂商名称:Vishay(威世)

厂商官网:http://www.vishay.com

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
Objectid
1181631126
包装说明
SMT, 0402
Reach Compliance Code
unknown
Country Of Origin
Germany, Israel
ECCN代码
EAR99
YTEOL
8.8
构造
Chip
JESD-609代码
e3
制造商序列号
MCS0402AT-PROF
端子数量
2
最高工作温度
155 °C
最低工作温度
-55 °C
封装高度
0.32 mm
封装长度
1 mm
封装形式
SMT
封装宽度
0.5 mm
包装方法
TR, Paper
额定功率耗散 (P)
0.1 W
电阻
105 Ω
电阻器类型
FIXED RESISTOR
系列
MCS 0402 AT-PROF
尺寸代码
0402
技术
THIN FILM
温度系数
25 ppm/°C
端子面层
Matte Tin (Sn) - with Nickel (Ni) barrier
容差
0.5%
工作电压
50 V
文档预览
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
www.vishay.com
Vishay Beyschlag
Professional Thin Film Chip Resistors
FEATURES
• Operating temperature up to 175 °C for 1000 h
• Rated dissipation
P
85
up to 0.4 W for size 1206
• AEC-Q200 qualified
• Approved to EN 140401-801
• Waste gas resistance verified by ASTM B 809
• Superior temperature cycling robustness
• Lead (Pb)-free solder contacts
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
Automotive-grade MC AT professional thin film chip
resistors are the perfect choice for most fields of modern
professional electronics where reliability and stability is of
major concern. Typical applications include automotive,
industrial,
telecommunication,
medical
equipment,
precision test and measuring equipment.
APPLICATIONS
• Automotive
• Telecommunication
• Medical equipment
• Industrial equipment
TECHNICAL SPECIFICATIONS
MCS 0402 AT
Imperial size
Metric size code
Resistance range
(1)
Resistance tolerance
Temperature coefficient
Rated dissipation
P
85 (2)
Operating voltage,
U
max.
AC/DC
Permissible film temperature,
F
max.
(2)
Operating temperature range
(2)
Insulation voltage
1 min;
U
ins
Continuous
Failure rate: FIT
observed
75 V
75 V
100 V
75 V
0.1 x 10
-9
/h
200 V
75 V
300 V
75 V
0.100 W
50 V
0402
RR1005M
2.43
to 221 k; 0
MCT 0603 AT
0603
RR1608M
1
to 511 k; 0
MCU 0805 AT
0805
RR2012M
1
to 1 M; 0
MCA 1206 AT
1206
RR3216M
1
to 1 M; 0
± 1 %, ± 0.5 %
± 50 ppm/K; ± 25 ppm/K
0.150 W
75 V
175 °C
- 55 °C to 175 °C
0.200 W
150 V
0.400 W
200 V
Notes
(1)
The AEC-Q200 qualification of the extended ranges (< 47
;
>100 k; > 47 k for 0402) is pending.
(2)
Please refer to APPLICATION INFORMATION next page.
Revision: 23-Jan-13
Document Number: 28760
1
For technical questions, contact:
thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
www.vishay.com
APPLICATION INFORMATION
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow
support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is
not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder
joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime. At the maximum permissible film temperature of 175 °C the useful lifetime is specified for 1000 h. The
designer may estimate the performance of the particular resistor application or set certain load and temperature limits in order
to maintain a desired stability.
Vishay Beyschlag
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
Operation Mode
Rated dissipation
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
Standard
P
70
0.063 W
0.100 W
0.125 W
0.250 W
125 °C
Power
P
70
0.100 W
0.125 W
0.200 W
0.400 W
155 °C
Advanced Temperature
P
85
0.100 W
0.150 W
0.200 W
0.400 W
175 °C
F
max.
Applied maximum film temperature,
Max. resistance change at rated
dissipation for resistance range:
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
|R/R| max., after:
1000 h
8000 h
225 000 h
0.15 %
0.25 %
1.0 %
0.3 %
0.5 %
-
0.5 %
-
-
2.43
to 221 k
1
to 511 k
1
to 1 M
1
to 1 M
2.43
to 221 k
1
to 511 k
1
to 1 M
1
to 1 M
2.43
to 221 k
1
to 511 k
1
to 1 M
1
to 1 M
Revision: 23-Jan-13
Document Number: 28760
2
For technical questions, contact:
thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
www.vishay.com
Vishay Beyschlag
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: MCT0603MD4641DPW00
M
C
T
0
6
0
3
M
D
4
6
4
1
D
P
W
0
0
TYPE/SIZE
MCS0402
MCT0603
MCU0805
MCA1206
VERSION
M
= AT
(Automotive)
TCR
D
= ± 25 ppm/K
C
= ± 50 ppm/K
Z
= Jumper
RESISTANCE
3 digit value
1 digit
multiplier
MULTIPLIER
8
= *10
-2
9
= *10
-1
0
= *10
0
1
= *10
1
2
= *10
2
3
= *10
3
4
= *10
4
0000
= Jumper
TOLERANCE
D
= ± 0.5 %
F
=±1%
Z
= Jumper
PACKAGING
E0
P5
PW
Product Description: MCT 0603-25 0.5 % AT PW 4K64
MCT
TYPE
MCS
MCT
MCU
MCA
0603
SIZE
0402
0603
0805
1206
-25
TCR
±
25
ppm/K
±
50
ppm/K
0.5 %
TOLERANCE
±
0.5 %
±
1%
AT
VERSION
AT
=
Automotive
PW
PACKAGING
E0
P5
PW
4K64
RESISTANCE
4K64
= 4.64 k
0R0
= Jumper
(1)
Notes
• Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION.
(1)
Jumpers are ordered by the resistance value 0
,
e.g. MCT 0603 P5 0R0.
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
DESCRIPTION
TCR
± 50 ppm/K
± 25 ppm/K
Jumper
TOLERANCE
±1%
± 0.5 %
-
MCS 0402 AT
2.43
to 221 k
10
to 221 k
20 m;
I
max.
= 0.63 A
RESISTANCE RANGE
MCT 0603 AT
1
to 511 k
10
to 511 k
20 m;
I
max.
= 1 A
MCU 0805 AT
1
to 1 M
10
to 1 M
20 m;
I
max.
= 1.5 A
MCA 1206 AT
1
to 1 M
10
to 1 M
20 m;
I
max.
= 2 A
Note
• Resistance values are available for ± 1 % tolerance from the E24 and E96 series; for ± 0.5 % tolerance from the E24 and E192 series.
PACKAGING
TYPE
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
CODE
E0
P5
PW
P5
PW
P5
QUANTITY
10 000
5000
20 000
5000
20 000
5000
Tape and reel
cardboard tape
acc. IEC 60286-3
Type I
PACKAGING
STYLE
WIDTH
8 mm
8 mm
8 mm
8 mm
PITCH
2 mm
4 mm
4 mm
4 mm
REEL
DIAMETER
180 mm/7"
180 mm/7"
330 mm/13"
180 mm/7"
330 mm/13"
180 mm/7"
Revision: 23-Jan-13
Document Number: 28760
3
For technical questions, contact:
thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
www.vishay.com
DIMENSIONS
T
t
Vishay Beyschlag
W
W
T
H
T
b
L
DIMENSIONS AND MASS
TYPE
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
H
(mm)
0.32 ± 0.05
0.45 + 0.1/- 0.05
0.52 ± 0.1
0.55 ± 0.1
L
(mm)
1.0 ± 0.05
1.55 ± 0.05
2.0 ± 0.1
3.2 + 0.1/- 0.2
W
(mm)
0.5 ± 0.05
0.85 ± 0.1
1.25 ± 0.15
1.6 ± 0.15
W
T
(mm)
> 75 % of W
> 75 % of W
> 75 % of W
> 75 % of W
T
t
(mm)
0.2 + 0.1/- 0.15
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
T
b
(mm)
0.2 ± 0.1
0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 ± 0.25
MASS
(mg)
0.6
1.9
4.6
9.2
SOLDER PAD DIMENSIONS
G
Y
Z
X
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
TYPE
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
G
(mm)
-
0.55
0.80
1.40
Y
(mm)
-
1.10
1.25
1.50
X
(mm)
-
1.10
1.50
1.90
Z
(mm)
-
2.75
3.30
4.40
G
(mm)
0.35
0.65
0.90
1.50
REFLOW SOLDERING
Y
(mm)
0.55
0.70
0.90
1.15
X
(mm)
0.55
0.95
1.40
1.75
Z
(mm)
1.45
2.05
2.70
3.80
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials may be required to maintain
the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which to a great extend depends on
board materials and design.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or
in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many
other parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation
mode”. Please note however that applications for “power operation mode” require special considerations for the design of solder pads and
adjacent conductor areas.
The terminations design withstands extended temperature cycling on the PCB. The robustness has been verified with appropriate solder
paste material through extensive testing.
Revision: 23-Jan-13
Document Number: 28760
4
For technical questions, contact:
thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
www.vishay.com
DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of special metal alloy is deposited on a
high grade (Al
2
O
3
) ceramic substrate and conditioned to
achieve the desired temperature coefficient. Specially
designed inner contacts are deposited on both sides. A
special laser is used to achieve the target value by smoothly
cutting a meander groove in the resistive layer without
damaging the ceramics. The resistor elements are covered
by a unique protective coating designed for electrical,
mechanical and climatic protection. The terminations
receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. This
includes full screening for the elimination of products with
potential risk of early field failures (feasible for
R
10
).
Only accepted products are laid directly into the paper tape
in accordance with
IEC 60286-3
(3)
.
Vishay Beyschlag
APPROVALS
The resistors are approved within the IECQ-CECC Quality
Assessment System for Electronic Components to the detail
specification
EN 140401-801
which refers to
EN 60115-1,
EN 140400
and the variety of environmental test procedures
of the
IEC 60068
(3)
series. The detail specification refers to
the climatic categories 55/125/56, which relates to the
“standard operation mode” of this datasheet.
Conformity is attested by the use of the
CECC
logo (
the mark of conformity on the package label.
The resistors are qualified according to AEC-Q200.
Qualification of the extended ranges is pending.
Vishay BEYSCHLAG has achieved
“Approval of
Manufacturer”
in accordance with
IECQ 03-1.
The release
certificate for
“Technology Approval Schedule”
in
accordance with
CECC 240001
based on
IECQ 03-3
is
granted for the Vishay BEYSCHLAG manufacturing
process.
) as
RELATED PRODUCTS
For more information about products with better TCR and
tighter tolerance please refer to the precision datasheet
(www.vishay.com/doc?28785).
Chip resistor arrays
may be used in sensing applications or
precision amplifiers where close matching between multiple
resistors is necessary. Please refer to the ACAS AT -
Precision datasheet (www.vishay.com/doc?28770).
MC AT series is also available with gold termination for
conductive gluing. Please refer to the datasheet
(www.vishay.com/doc?28877).
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase as shown in
IEC 61760-1
(3)
. The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, if applied, shall be
qualified by appropriate means to ensure the long-term
stability of the whole system.
The resistors are RoHS compliant; the pure tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
All products comply with the
GADSL
(1)
and the
CEFIC-EECA-EICTA
(2)
list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the use of Hazardous
Substances directive (RoHS)
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
Notes
(1)
Global Automotive Declarable Substance List, see
www.gadsl.org.
(2)
CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation
representing
the
information
and
communications
technology
and
consumer
electronics),
see
www.eicta.org/index.php?id=995
issues
environment policy
chemicals
chemicals for electronics.
(3)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
Revision: 23-Jan-13
Document Number: 28760
5
For technical questions, contact:
thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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