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MD56V82160-6TAZ03

描述:
Synchronous DRAM, 16MX16, 5.4ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, LEAD FREE, PLASTIC, TSOP2-54
分类:
存储    存储   
文件大小:
361KB,共34页
制造商:
概述
Synchronous DRAM, 16MX16, 5.4ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, LEAD FREE, PLASTIC, TSOP2-54
器件参数
参数名称
属性值
厂商名称
LAPIS Semiconductor Co Ltd
零件包装代码
TSOP2
包装说明
TSOP2,
针数
54
Reach Compliance Code
unknown
ECCN代码
EAR99
访问模式
FOUR BANK PAGE BURST
最长访问时间
5.4 ns
其他特性
AUTO/SELF REFRESH
JESD-30 代码
R-PDSO-G54
长度
22.22 mm
内存密度
268435456 bit
内存集成电路类型
SYNCHRONOUS DRAM
内存宽度
16
功能数量
1
端口数量
1
端子数量
54
字数
16777216 words
字数代码
16000000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
16MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP2
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
认证状态
Not Qualified
座面最大高度
1.2 mm
自我刷新
YES
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
0.8 mm
端子位置
DUAL
宽度
10.16 mm
文档预览
OKI Semiconductor
MD56V82160
4-Bank
4,194,304-Word
16-Bit SYNCHRONOUS DYNAMIC RAM
FEDD56V82160-01
Issue Date:Feb.14, 2008
DESCRIPTION
The MD56V82160 is a 4-Bank
4,194,304-word
16-bit Synchronous dynamic RAM.
The device operates at 3.3 V. The inputs and outputs are LVTTL compatible.
FEATURES
Silicon gate, quadruple polysilicon CMOS, 1-transistor memory cell
4-Bank
4,194,304-word
16-bit configuration
Single 3.3 V power supply,
0.3
V tolerance
Input : LVTTL compatible
Output : LVTTL compatible
Refresh : 8192 cycles/64 ms
Programmable data transfer mode
-
CAS
Latency (2, 3)
- Burst Length (1, 2, 4, 8, Full Page)
- Data scramble (sequential, interleave)
A
uto-refresh, Self-refresh capability
Lead-Free Package:
54-pin 400 mil plastic TSOP (TypeII)
(
TSOP(2)54-P-400-0.80-K
)
(Product: MD56V82160-xxTAZ03)
xx indicates speed rank.
PRODUCT FAMILY
Family
CL-tRP-tRCD
3-3-3
2-3-3
Max.
Frequency
166 MHz
133 MHz
Access Time (Max.)
t
AC2
5.4 ns
t
AC3
5.4 ns
MD56V82160-6
1/1
FEDD56V82160-01
OKI Semiconductor
MD56V82160
PIN CONFIGURATION (TOP VIEW)
V
CC
1
DQ1 2
V
CC
Q 3
DQ2 4
DQ3 5
V
SS
Q 6
DQ4 7
DQ5 8
V
CC
Q 9
DQ6 10
DQ7 11
V
SS
Q 12
DQ8 13
V
CC
14
LDQM 15
WE
16
CAS
17
RAS
18
CS
19
BA0 20
BA1 21
A10(AP) 22
A0 23
A1 24
A2 25
A3 26
V
CC
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
V
SS
DQ16
V
SS
Q
DQ15
DQ14
V
CC
Q
DQ13
DQ12
V
SS
Q
DQ11
DQ10
V
CC
Q
DQ9
V
SS
NC
UDQM
CLK
CKE
A12
A11
34 A9
33 A8
32 A7
31 A6
30 A5
29 A4
28 V
SS
54-Pin Plastic TSOP(II)
(K Type)
Pin Name
CLK
CS
CKE
A0–A12
BA0,1
RAS
CAS
WE
Function
System Clock
Chip Select
Clock Enable
Address
Bank Select Address
Row Address Strobe
Column Address Strobe
Write Enable
Pin Name
UDQM, LDQM
DQi
V
CC
V
SS
V
CC
Q
V
SS
Q
NC
Function
Data Input/ Output Mask
Data Input/ Output
Power Supply (3.3 V)
Ground (0 V)
Data Output Power Supply (3.3 V)
Data Output Ground (0 V)
No Connection
Note : The same power supply voltage must be provided to every V
CC
pin and V
CC
Q pin.
The same GND voltage level must be provided to every V
SS
pin and V
SS
Q pin.
2/2
FEDD56V82160-01
OKI Semiconductor
MD56V82160
PIN DESCRIPTION
CLK
CS
Fetches all inputs at the
“H”
edge.
Disables or enables device operation by asserting or deactivating all inputs except CLK, CKE,
UDQM and LDQM.
Masks system clock to deactivate the subsequent CLK operation.
If CKE is deactivated, system clock will be masked so that the subsequent CLK operation is
deactivated. CKE should be asserted at least one cycle prior to a new command.
Row & column multiplexed.
Row address
: RA0
RA12
Column Address
: CA0
CA8
Slects bank to be activated during row address latch time and selects bank for precharge and
read/write during column address latch time.
CKE
Address
BA0, BA1
RAS
CAS
WE
UDQM,
LDQM
DQi
Masks the read data of two clocks later when UDQM and LDQM are set
“H”
at the
“H”
edge of the
clock signal. Masks the write data of the same clock when UDQM and LDQM are set
“H”
at the
“H”
edge of the clock signal. UDQM controls upper byte and LDQM controls lower byte.
Data inputs/outputs are multiplexed on the same pin.
Functionality depends on the combination. For details, see the function truth table.
3/3
FEDD56V82160-01
OKI Semiconductor
MD56V82160
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Parameter
Voltage on Any Pin Relative to V
SS
V
CC
Supply Voltage
Storage Temperature
Power Dissipation
Short Circuit Output Current
Operating Temperature
Symbol
V
IN
, V
OUT
V
CC
, V
CC
Q
T
stg
P
D*
I
OS
T
opr
Value
–0.5
to 4.6
–0.5
to 4.6
–65
to 150
1000
50
0 to 70
Unit
V
V
°C
mW
mA
°C
*: Ta = 25C
Recommended Operating Conditions
(Voltages referenced to V
SS
= V
SS
Q = 0 V)
Parameter
Power Supply Voltage
Input High Voltage
Input Low Voltage
Symbol
V
CC
, V
CC
Q
V
IH
V
IL
Min.
3.0
2.0
0.3
Typ.
3.3
0
Max.
3.6
V
CC
+ 0.3
0.8
Unit
V
V
V
V
IH
(MAX)=4.6V AC for pulse width
10ns acceptable.
V
IL
(MIN)=−1.5V AC for pulse width
10ns acceptable.
Pin Capacitance
(V
bias
= 1.4 V, Ta = 25°C, f = 1 MHz)
Parameter
Input Capacitance (CLK)
Input Capacitance
(RAS,
CAS, WE, CS,
CKE, UDQM, LDQM,)
Symbol
C
CLK
Min.
2
Max.
3
Unit
pF
C
IN
1.5
4.5
pF
Input Capacitance
(Address)
Input/Output Capacitance (DQ1
DQ16)
C
ADD
1.5
3
C
OUT
2
4.5
pF
4/4
FEDD56V82160-01
OKI Semiconductor
MD56V82160
DC Characteristics
Parameter
Output High
Voltage
Output Low
Voltage
Input Leakage
Current
Output Leakage
Current
Operating Current
Symbol
Bank
VOH
VOL
ILI
ILO
One Bank
Active
Condition
CKE
MD56V82160-6
Others
IOH =1.0mA
IOL =1.0mA
Min.
2.4
5
5
Max.
0.4
5
5
Unit Note
V
V
A
A
Any input 0V
VIN
V
CC
+ 0.3V,
all other pins are not under test = 0V
ICC1
ICC2P
ICC2PS
tRC = Min.
BL=2
IO=0mA
150
15
mA
Precharge
Standby Current
(Power-Down)
CKE = VIL(max) tCC = 10ns
CKE
CLK =
tCC =
VIL(max)
CS = VIH(min)
mA
5
ICC2N
Precharge
Standby Current
(Non Power Down)
tCC = 10ns
ALL
Banks CKE = V
IH(min) Input
Signals
Precharge
changed one
during20ns.
CLK = VIL(max)
are
time
40
mA
Banks CKE = V
t
=
ICC2NS ALL
IH(min) CC
Precharge
Input
Signals
stable.
Active Standby
Current
(Power-Down)
ICC3P
ICC3PS
One Bank
Active
CKE= VIL(max)
tCC = 10ns
are
30
35
mA
20
CKE
CLK =
tCC =
VIL(max)
CS = VIH(min)
ICC3N
Active Standby
Current
(Non Power Down)
ICC3NS
One Bank
Active
CKE = VIH(min)
tCC = 10ns
Input
Signals
changed one
during20ns.
CLK = VIL(max)
are
time
65
mA
Operating
Current(Burst)
Refresh Current
Self-Refresh
Current
ICC4
ICC5
ICC6
4Banks
Activated
CKE = VIH(min) tCC =
Input
Signals
stable.
IO=0mA
CKE=0.2V
Page Burst
tCCD=2CLKs
are
45
165
200
6
mA
mA
mA
1
2
tARFC = tARFC(min.)
Notes: 1. Measured with outputs open.
2. Refresh period is 64ms.
3. Unless otherwise noted,input swing level is VIH/VIL=VCCQ/VSSQ.
5/5
参数对比
与MD56V82160-6TAZ03相近的元器件有:。描述及对比如下:
型号 MD56V82160-6TAZ03
描述 Synchronous DRAM, 16MX16, 5.4ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, LEAD FREE, PLASTIC, TSOP2-54
厂商名称 LAPIS Semiconductor Co Ltd
零件包装代码 TSOP2
包装说明 TSOP2,
针数 54
Reach Compliance Code unknown
ECCN代码 EAR99
访问模式 FOUR BANK PAGE BURST
最长访问时间 5.4 ns
其他特性 AUTO/SELF REFRESH
JESD-30 代码 R-PDSO-G54
长度 22.22 mm
内存密度 268435456 bit
内存集成电路类型 SYNCHRONOUS DRAM
内存宽度 16
功能数量 1
端口数量 1
端子数量 54
字数 16777216 words
字数代码 16000000
工作模式 SYNCHRONOUS
最高工作温度 70 °C
组织 16MX16
封装主体材料 PLASTIC/EPOXY
封装代码 TSOP2
封装形状 RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE
认证状态 Not Qualified
座面最大高度 1.2 mm
自我刷新 YES
最大供电电压 (Vsup) 3.6 V
最小供电电压 (Vsup) 3 V
标称供电电压 (Vsup) 3.3 V
表面贴装 YES
技术 CMOS
温度等级 COMMERCIAL
端子形式 GULL WING
端子节距 0.8 mm
端子位置 DUAL
宽度 10.16 mm
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器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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