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MDT10P23CCA5P

Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP18

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Micron Technology

厂商官网:http://www.mdtic.com.tw/

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器件参数
参数名称
属性值
厂商名称
Micron Technology
包装说明
DIP, DIP18,.3
Reach Compliance Code
unknown
位大小
8
JESD-30 代码
R-PDIP-T18
端子数量
18
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装等效代码
DIP18,.3
封装形状
RECTANGULAR
封装形式
IN-LINE
电源
2.5/5 V
认证状态
Not Qualified
RAM(字节)
72
ROM(单词)
2048
ROM可编程性
UVPROM
速度
20 MHz
表面贴装
NO
技术
CMOS
温度等级
INDUSTRIAL
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
参数对比
与MDT10P23CCA5P相近的元器件有:MDT10P23AEA3S、MDT10P23CCA1P、MDT10P23CCA2K、MDT10P23AEA5P、MDT10P23AEA1S、MDT10P23AEA5S、MDT10P23AEA2K、MDT10P23AEA1P。描述及对比如下:
型号 MDT10P23CCA5P MDT10P23AEA3S MDT10P23CCA1P MDT10P23CCA2K MDT10P23AEA5P MDT10P23AEA1S MDT10P23AEA5S MDT10P23AEA2K MDT10P23AEA1P
描述 Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP18 Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDSO24 Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP20 Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP22 Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP18 Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDSO20 Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDSO18 Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP22 Microcontroller, 8-Bit, UVPROM, 20MHz, CMOS, PDIP20
厂商名称 Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology
包装说明 DIP, DIP18,.3 SOP, SOP24,.4 DIP, DIP20,.3 DIP, DIP22,.3 DIP, DIP18,.3 SOP, SOP20,.4 SOP, SOP18,.4 DIP, DIP22,.3 DIP, DIP20,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
位大小 8 8 8 8 8 8 8 8 8
JESD-30 代码 R-PDIP-T18 R-PDSO-G24 R-PDIP-T20 R-PDIP-T22 R-PDIP-T18 R-PDSO-G20 R-PDSO-G18 R-PDIP-T22 R-PDIP-T20
端子数量 18 24 20 22 18 20 18 22 20
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP SOP DIP DIP DIP SOP SOP DIP DIP
封装等效代码 DIP18,.3 SOP24,.4 DIP20,.3 DIP22,.3 DIP18,.3 SOP20,.4 SOP18,.4 DIP22,.3 DIP20,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE
电源 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V 2.5/5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM(字节) 72 72 72 72 72 72 72 72 72
ROM(单词) 2048 2048 2048 2048 2048 2048 2048 2048 2048
ROM可编程性 UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM
速度 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
表面贴装 NO YES NO NO NO YES YES NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
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器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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