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MF-FSMF010X

RESISTOR, TEMPERATURE DEPENDENT, PTC RESETTABLE FUSE, SURFACE MOUNT
电阻, 温度依赖性, 正温度系数自恢复保险丝, 表面贴装

器件类别:无源元件   

厂商名称:Bourns

厂商官网:http://www.bourns.com

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器件参数
参数名称
属性值
最大工作温度
85 Cel
最小工作温度
-40 Cel
端子数量
2
加工封装描述
芯片, 0603, HALOGEN FREE AND ROHS COMPLIANT
无铅
Yes
欧盟RoHS规范
Yes
状态
ACTIVE
包装形状
矩形的 PACKAGE
端子形状
WRAPAROUND
端子涂层
安装特点
表面贴装
制造商系列
MF-FSMF
电阻类型
正温度系数自恢复保险丝
端子布局
双 ENDED
热敏电阻应用
OVERLOAD PROTECTION
额定交流电压
6 V
文档预览
PL
IA
NT
Features
Compact design to save board space -
Applications
USB port protection
HDMI 1.4 Source protection
PC motherboards - Plug and Play
CO
M
0603 footprint
Small size results in very fast time to react
to fault events
Low profile
RoHS compliant* and halogen free**
Agency recognition:
*R
oH
S
protection
Mobile phones - Battery and port
protection
PDAs / digital cameras
MF-FSMF Series - PTC Resettable Fuses
Electrical Characteristics
Max. Time
To Trip
Amperes
at 23 °C
0.50
1.00
8.00
8.00
Seconds
at 23 °C
1.00
0.60
0.10
0.10
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
0.5
0.5
0.5
0.5
Ihold
Model
V max.
Volts
I max.
Amps
Itrip
Resistance
Ohms
at 23 °C
RMin.
0.900
0.550
0.200
0.100
R1Max.
6.000
3.500
1.400
0.800
Amperes
at 23 °C
Hold
Trip
0.30
0.50
0.75
1.00
0.10
0.20
0.35
0.50
MF-FSMF010X
MF-FSMF020X
MF-FSMF035X
MF-FSMF050X
15
9
6
6
40
40
40
40
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State .................................................. 125 °C
Passive Aging ....................................................... +85 °C, 1000 hours..................................... ±5 % typical resistance change
Humidity Aging ..................................................... +85 °C, 85 % R.H. 1000 hours ................... ±5 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times ......................... ±10 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ......................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1, ................ No change
Condition A
Test Procedures And Requirements For Model MF-FSMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ................. Per MF physical description
Resistance ............................................................ In still air @ 23 °C ........................................ Rmin
R
R1max
Time to Trip........................................................... At specified current, Vmax, 23 °C .............. T
max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ........................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles .............................. No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours ........................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ......................................... 95 % min. coverage
UL File Number .................................................... E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
TÜV Certificate Number ....................................... R 50171531
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 50171531
Thermal Derating Chart - Ihold (Amps)
Ambient Operating Temperature
Model
MF-FSMF010X
MF-FSMF020X
MF-FSMF035X
MF-FSMF050X
-40 °C
0.13
0.27
0.47
0.67
-20 °C
0.12
0.25
0.41
0.59
0 °C
0.11
0.23
0.38
0.54
23 °C
0.10
0.20
0.35
0.50
40 °C
0.08
0.17
0.29
0.41
50 °C
0.07
0.14
0.26
0.37
60 °C
0.06
0.12
0.24
0.34
70 °C
0.05
0.10
0.20
0.29
85 °C
0.03
0.07
0.14
0.20
* RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
**Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br ) content is 900 ppm or less;
(b) the Chlorine ( Cl ) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine ( Cl ) content is 1500 ppm or less.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Additional Applications
Automotive electronic control modules
Game console port protection
MF-FSMF Series - PTC Resettable Fuses
Product Dimensions
A
Min.
MF-FSMF010X
MF-FSMF020X
MF-FSMF035X
MF-FSMF050X
1.45
(0.057)
1.45
(0.057)
1.45
(0.057)
1.45
(0.057)
Max.
1.85
(0.073)
1.85
(0.073)
1.85
(0.073)
1.85
(0.073)
Min.
0.65
(0.026)
0.65
(0.026)
0.65
(0.026)
0.65
(0.026)
B
Max.
1.05
(0.041)
1.05
(0.041)
1.05
(0.041)
1.05
(0.041)
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.65
(0.026)
C
Max.
0.65
(0.026)
0.65
(0.026)
0.65
(0.026)
1.00
(0.039)
D
Min.
0.20
(0.008)
0.20
(0.008)
0.20
(0.008)
0.20
(0.008)
DIMENSIONS:
MM
(INCHES)
Model
Packaging: MF-FSMF010X = 5000 pcs. per reel;
MF-FSMF020X & MF-FSMF035X = 6000 pcs. per reel;
MF-FSMF050X = 4000 pcs. per reel
Top View
Bottom View
A
Side View
C
Recommended Pad Layout
Terminal material:
Nickel/gold plated.
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
I
D
B
1.00 ± 0.05
(.039 ± .002)
0.70 ± 0.05
(.028 ± .002)
1.00 ± 0.05
(.039 ± .002)
Solder Reflow Recommendations
300
250
Temperature (°C)
200
150
100
50
0
How To Order
Soldering
Cooling
Preheating
MF - FSMF 020 X - 2
Multifuse
®
Product
Designator
Series
FSMF = 0603 Surface Mount
Component
Hold Current, Ihold
010-050 (0.10 - 0.50 Amps)
Multifuse
®
freeXpansion™ Design
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
Typical Part Marking
160–220
10–20
Time (seconds)
120
PART IDENTIFICATION:
MF-FSMF010X = II
MF-FSMF020X = I
MF-FSMF035X = •
MF-FSMF050X = —
I
Notes:
• MF-FSMF models cannot be wave soldered. Please contact Bourns for hand soldering
recommendations.
• If reflow temperatures exceed the recommended profile, devices may not meet the
performance requirements.
• Compatible with Pb and Pb-free solder reflow profiles.
• Excess solder may cause a short circuit, especially during hand soldering. Please refer to
the Multifuse
®
Polymer PTC Soldering Recommendation guidelines.
BIWEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL:
WEEK 1 AND 2 = A
WEEK 51 AND 52 = Z
“freeXpansion Design” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-FSMF Series - PTC Resettable Fuses
Typical Time to Trip at 23 °C
MF
020
MF
X
-FS
MF
035
X
MF
-FS
MF
050
X
MF
010
X
100
10
Time to Trip (Seconds)
1
0.1
0.01
0.001
0.1
MF
-FS
MF
-FS
1
10
Fault Current (Amps)
The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific
customer applications may differ from these values due to the influence of other variables.
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
MF-FSMF SERIES, REV. G, 05/11
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-FSMF Series Tape and Reel Specifications
Product Dimensions
Tape Dimensions
W
P0
P1
P2
A0
B0
D0
F
E1
T
10 P0
Reel Dimensions
A max.
N min.
W1
W2 max.
185
(7.283)
50
(1.97)
8.4 + 1.5/ -0.0
(0.331 + 0.059/-0)
14.4
(0.567)
185
(7.283)
50
(1.97)
8.4 + 1.5/ -0.0
(0.331 + 0.059/-0)
14.4
(0.567)
185
(7.283)
50
(1.97)
8.4 + 1.5/ -0.0
(0.331 + 0.059/-0)
14.4
(0.567)
MF-FSMF010X
per EIA 481-1
8.0 ± 0.1
(0.315 ± 0.004)
4.0 ± 0.1
(0.157 ± 0.004)
4.0 ± 0.05
(0.157 ± 0.002)
2.0 ± 0.05
(0.079 ± 0.002)
1.17 ± 0.05
(0.046 ± 0.002)
2.02 ± 0.05
(0.079 ± 0.002)
1.55 ± 0.05
(0.061 ± 0.002)
3.5 ± 0.05
(0.138 + 0.002)
1.75 ± 0.1
(0.069 ± 0.004)
0.75 ± 0.05
(0.030 ± 0.002)
40.0 ± 0.1
(1.575 ± 0.004)
MF-FSMF020X, MF-FSMF035X
per EIA 481-1
8.0 ± 0.1
(0.315 ± 0.004)
4.0 ± 0.1
(0.157 ± 0.004)
4.0 ± 0.05
(0.157 ± 0.002)
2.0 ± 0.05
(0.079 ± 0.002)
1.17 ± 0.05
(0.046 ± 0.002)
2.02 ± 0.05
(0.079 ± 0.002)
1.55 ± 0.05
(0.061 ± 0.002)
3.5 ± 0.05
(0.138 + 0.002)
1.75 ± 0.1
(0.069 ± 0.004)
0.60 ± 0.05
(0.024 ± 0.002)
40.0 ± 0.1
(1.575 ± 0.004)
MF-FSMF050X
per EIA 481-1
8.0 ± 0.1
(0.315 ± 0.004)
4.0 ± 0.1
(0.157 ± 0.004)
4.0 ± 0.05
(0.157 ± 0.002)
2.0 ± 0.05
(0.079 ± 0.002)
1.17 ± 0.05
(0.046 ± 0.002)
2.02 ± 0.05
(0.079 ± 0.002)
1.55 ± 0.05
(0.061 ± 0.002)
3.5 ± 0.05
(0.138 + 0.002)
1.75 ± 0.1
(0.069 ± 0.004)
0.95 ± 0.05
(0.037 ± 0.002)
40.0 ± 0.1
(1.575 ± 0.004)
10 P0
T
P0
D0
E1
W2(MEASURED
AT HUB)
F W
A
N(HUB DIA.)
B0
P2
P1
A0
W1(MEASURED
AT HUB)
DIMENSIONS:
MM
(INCHES)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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参数对比
与MF-FSMF010X相近的元器件有:MF-FSMF035X。描述及对比如下:
型号 MF-FSMF010X MF-FSMF035X
描述 RESISTOR, TEMPERATURE DEPENDENT, PTC RESETTABLE FUSE, SURFACE MOUNT RESISTOR, TEMPERATURE DEPENDENT, PTC RESETTABLE FUSE, SURFACE MOUNT
最大工作温度 85 Cel 85 Cel
最小工作温度 -40 Cel -40 Cel
端子数量 2 2
加工封装描述 芯片, 0603, HALOGEN FREE AND ROHS COMPLIANT 芯片, 0603, HALOGEN FREE AND ROHS COMPLIANT
无铅 Yes Yes
欧盟RoHS规范 Yes Yes
状态 ACTIVE ACTIVE
包装形状 矩形的 PACKAGE 矩形的 PACKAGE
端子形状 WRAPAROUND WRAPAROUND
端子涂层
安装特点 表面贴装 表面贴装
制造商系列 MF-FSMF MF-FSMF
电阻类型 正温度系数自恢复保险丝 正温度系数自恢复保险丝
端子布局 双 ENDED 双 ENDED
热敏电阻应用 OVERLOAD PROTECTION OVERLOAD PROTECTION
额定交流电压 6 V 6 V
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