Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±30 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change
ESD Classification - HBM ..................................... Class 6
Test Procedures And Requirements For Model MF-PSML Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C ................................................. Rmin
≤
R
≤
R1max
Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T
≤
max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
UL File Number .................................................... E174545
http://www.ul.com/ Follow link to Online Certifications Directory, then UL File No.
E174545, or
click here
TÜV Certificate Number ....................................... R 50302873
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 50302873,
or
click here
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
**Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)
and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
MF-PSML Series - Low Ohmic PTC Resettable Fuses
MF-NSMF Series - PTC Resettable Fuses
Product Dimensions
Model
Min.
2.00
(0.079)
A
Max.
2.30
(0.091)
Min.
1.20
(0.047)
B
Max.
1.50
(0.059)
Min.
0.30
(0.012)
C
Max.
0.60
(0.024)
D
Min.
0.20
(0.008)
MF-PSML075
MF-PSML110
MF-PSML150
MF-PSML175
MF-PSML200
MF-PSML260
MF-PSML300
MF-PSML350
2.00
(0.079)
2.30
(0.091)
1.20
(0.047)
1.50
(0.059)
0.45
(0.018)
0.80
(0.031)
0.20
(0.008)
MM
(INCHES)
Packaging:
MF-PSML075~MF-PSML200 = 6000 pcs. per reel
MF-PSML260~MF-PSML350 = 4500 pcs. per reel
Top View
Bottom View
A
Side View
C
Recommended Pad Layout
DIMENSIONS:
Terminal material:
Nickel/gold plated.
1.50 ± 0.10
(.059 ± .004)
PE
D
B
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
1.00 ± 0.05
(.039 ± .002)
1.20 ± 0.10
(.047 ± .004)
Thermal Derating Chart - Ihold (Amps)
Model
MF-PSML075
MF-PSML110
-40 °C
1.24
1.93
2.37
2.57
2.94
-20 °C
1.07
1.65
2.07
2.33
2.66
0 °C
0.94
1.37
1.80
2.07
2.36
Ambient Operating Temperature
23 °C
40 °C
50 °C
0.75
0.62
0.54
1.10
0.83
0.69
1.50
1.75
2.00
1.25
1.49
1.70
1.08
1.36
1.55
60 °C
0.47
0.55
0.93
1.24
1.42
70 °C
0.37
0.41
0.74
1.00
1.14
85 °C
0.23
0.31
0.50
0.91
1.04
MF-PSML260
MF-PSML300
MF-PSML350
MF-PSML150
MF-PSML175
MF-PSML200
3.82
4.41
5.51
3.46
3.99
4.66
3.07
3.54
4.13
2.60
3.00
3.50
2.21
2.55
2.98
2.02
2.33
2.71
1.85
2.13
2.49
1.48
1.71
2.00
1.35
1.56
1.82
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-PSML Series - Low Ohmic PTC Resettable Fuses
3312 - 2 mm SMD Trimming Potentiometer
Solder Reflow Recommendations
TP
RAMP-UP
TL
tL
TS MAX.
RAMP-DOWN
TS MIN.
tp
CRITICAL ZONE
T L TO TP
Notes:
•
•
•
•
•
•
Temperature
If reflow temperatures exceed the recommended profile, devices may
not meet the published specifications.
Compatible with Pb and Pb-free solder reflow profiles.
Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Multifuse
®
Polymer PTC Soldering
Recommendation guidelines.
Designed for single solder reflow operations.
All temperatures refer to topside of the package, measured on the
package body surface.
MF-PSML models cannot be wave soldered or hand soldered. Please
contact Bourns for soldering recommendations.
PREHEAT
25
ts
t 25 *C TO PEAK
8 MINS.
Time
Profile Feature
Average Ramp-Up Rate (TS
max
to T
p
)
PREHEAT:
Temperature Min. (TS
min
)
Temperature Max. (TS
max
)
Time (ts
min
to ts
max
)
3 °C / second max.
150 °C
200 °C
60~180 seconds
Pb-Free Assembly
Process
TIME MAINTAINED ABOVE:
Materials
Description
Temperature (T
L
)
1. Apply solder paste to
• Sn 96.5 / Ag 3.0 / Cu 0.5
Time (t
L
)
test board (8 - 10 mil thick)
Temperature
Time
Interval
Room temperature
Alloy water soluble or no
clean solder
(T )
Peak / Classification Temperature
paste
P
(see note 1)
• single sided epoxy glass
Time within 5 °C of Actual Peak Temperature (t
p
)
(G10) (UL approved)
Ramp-Down Rate
• PC board approx. 4x4x.06 in.
Convection oven
(see note 2)
150 °C to 190 °C
Inspect solder joint to determine if solder joint is
acceptable (i.e. exhibits wetting of joint’s surface).
217 °C
Use the following criteria (ref. acceptability of printed
board assemblies, IPC-A-610):
60~150 seconds
260 °C
A) Acceptable (see Figure 1)
20~40 seconds
component and solder to PCB termination)
6 °C / second max.
2.5 °C ± 0.5 °/sec.
90 ± 30 sec.
does not exceed 90 °.
electrical clearances and are attached
8 minutes max.
(soldered) to a metal surface.
B) Unacceptable (see Figure 2)
(2) Solder balls that do not violate minimum
(1) The solder connection wetting angle (solder to
3. Ramp up
2.
Time
test units
25 °C to Peak Temperature
Place
within
onto board 6 units/board
4. Preheat (TS)
6. Peak temperature (TP)
5. Time above liquidus (TL)
How to Order
MF - PSML 075 - 2
Multifuse
®
Product
7. Ramp down
Designator
Series
PSML = 0805 Surface
High pressure deionized
8. Cleaning water clean profile
Mount
Component
water 65 PSI max.
Hold Current, Ihold
075 - 350 (0.75 Amps - 3.50 Amps)
Packaging
Temperature
per
Lead/Pad Junction
of
EIA 481-1
Packaged
-2
using 6-zone
Reel
(Derived
= Tape and
Convection Oven)
(1) Solder connection wetting angle exceeding
220 °C
Typical Part
60-90 sec.
Marking
90 °.
250 °C +0 °/-5 °
(2)
vary.
Represents total content. Layout may
Incomplete reflow of solder paste.
10-20 sec. within
Asia-Pacific:
5 °C of peak
(3) Dewetting.
PART IDENTIFICATION:
Tel: +886-2 2562-4117
Room temperature 3 °C ± 0.5 °C/sec.
If unacceptable, determine cause and correct prior to
MF-PSML075 = PD
Email: asiacus@bourns.com
(see note 2)
next run.
MF-PSML110 = PE
72 °F to 160 °F
As required
MF-PSML150 = PG
NOTES:
Europe:
(22 °C to 71 °C)
MF-PSML175 = PH
Tel: +36 88
1. Water soluble solder paste only above 100K.
520 390
MF-PSML200 = PJ
Email: eurocus@bourns.com
2. Refer to
MF-PSML260 = PN
ref. temperature profile. Temperature at
lead/pad junction with “K” type thermocouple.
MF-PSML300 = PP
The Americas:
3. Units that
for environmental
MF-PSML350 = PS
are board mounted
Tel: +1-951 781-5500
testing must see a peak temperature in the reflow
BIWEEKLY DATE CODE WILL APPEAR
zone, as specified. This is to ensure that all test
Email: americus@bourns.com
ON THE PACKAGING LABEL:
units will see “worst case conditions”.
www.bourns.com
WEEK 1 AND 2 = A
4. Ramp down rate to be measured from 245 °C to
WEEK 51 AND 52 = Z
150 °C.
PE
5. Process Description 8 does not apply to open
frame trimmers.
MF-PSML SERIES, REV. D, 02/18
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-PSML Series Tape and Reel Specifications
MF-PSML Series
per EIA 481-1
8.0 ± 0.30
(0.315 ± 0.012)
4.0 ± 0.10
(0.157 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
1.70 ± 0.10
(0.067 ± 0.004)
2.45 ± 0.10
(0.096 ± 0.004)
4.35
(0.171)
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
3.5 ± 0.05
(0.138 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
6.25
(0.246)
0.6
(0.024)
0.1
(0.004)
0.65 ± 0.10
(0.026 ± 0.004)
0.95 ± 0.10
(0.037 ± 0.004)
390
(15.35)
160
(6.30)
185
(7.28)
50
(1.97)
8.4 + 1.5/-0.0
(0.331 + 0.059/-0.0)
14.4
(0.567)
P0
Tape Dimensions
W
P0
P1
P2
A0
B0
B1 max.
D0
F
E1
E2 min.
T max.
T1 max.
K0 (MF-PSML075~MF-PSML200)
K0 (MF-PSML260~MF-PSML350)
Leader min.
Trailer min.
Reel Dimensions
A max.
N min.
W1
W2 max.
DIMENSIONS:
E1
T
COVER
TAPE
D0
P2
MM
(INCHES)
W2(MEASURED
AT HUB)
F
B1
B0
K0
T1
A0
P1
E2 W
A
N(HUB DIA.)
W1(MEASURED
AT HUB)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
