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MK10DX64VLH5

General Purpose Relays DPST-NO PC MT 12VDC

器件类别:半导体    嵌入式处理器和控制器   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

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器件:MK10DX64VLH5

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器件参数
参数名称
属性值
产品种类
Product Category
ARM Microcontrollers - MCU
制造商
Manufacturer
NXP(恩智浦)
RoHS
Details
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
LQFP-64
Core
ARM Cortex M4
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
64 kB
Data RAM Size
16 kB
ADC Resolution
16 bit
工作电源电压
Operating Supply Voltage
3.3 V
最大工作温度
Maximum Operating Temperature
+ 105 C
接口类型
Interface Type
I2S, SPI, UART
Analog Supply Voltage
3.3 V
Data RAM Type
RAM
I/O Voltage
3.3 V
最小工作温度
Minimum Operating Temperature
- 40 C
Moisture Sensitive
Yes
Program Memory Type
Flash and FlexMemory
工厂包装数量
Factory Pack Quantity
160
电源电压-最大
Supply Voltage - Max
3.6 V
电源电压-最小
Supply Voltage - Min
1.71 V
单位重量
Unit Weight
0.012224 oz
文档预览
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: K10P64M50SF0
Rev. 4 5/2012
K10 Sub-Family
K10P64M50SF0
Supports the following:
MK10DN32VLH5, MK10DX32VLH5,
MK10DN64VLH5, MK10DX64VLH5,
MK10DN128VLH5, MK10DX128VLH5,
MK10DN32VMP5, MK10DX32VMP5,
MK10DN64VMP5, MK10DX64VMP5,
MK10DN128VMP5, MK10DX128VMP5
Features
• Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 50 MHz ARM Cortex-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
• Memories and memory interfaces
– Up to 128 KB program flash.
– Up to 32 KB FlexNVM on FlexMemory devices
– 2 KB FlexRAM on FlexMemory devices
– Up to 16 KB RAM
– Serial programming interface (EzPort)
• Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
• System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– 4-channel DMA controller, supporting up to 41
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
• Security and integrity modules
– Hardware CRC module to support fast cyclic
redundancy checks
– 128-bit unique identification (ID) number per chip
• Analog modules
– 16-bit SAR ADC
– Two analog comparators (CMP) containing a 6-bit
DAC and programmable reference input
– Voltage reference
• Timers
– Programmable delay block
– Eight-channel motor control/general purpose/PWM
timer
– Two-channel quadrature decoder/general purpose
timer
– Periodic interrupt timers
– 16-bit low-power timer
– Carrier modulator transmitter
– Real-time clock
• Communication interfaces
– SPI module
– I2C module
– Three UART modules
– I2S module
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2011–2012 Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................3
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3 Terminology and guidelines......................................................4
3.1 Definition: Operating requirement......................................4
3.2 Definition: Operating behavior...........................................5
3.3 Definition: Attribute............................................................5
3.4 Definition: Rating...............................................................6
3.5 Result of exceeding a rating..............................................6
3.6 Relationship between ratings and operating
requirements......................................................................6
3.7 Guidelines for ratings and operating requirements............7
3.8 Definition: Typical value.....................................................7
3.9 Typical value conditions....................................................8
4 Ratings......................................................................................9
4.1 Thermal handling ratings...................................................9
4.2 Moisture handling ratings..................................................9
4.3 ESD handling ratings.........................................................9
4.4 Voltage and current operating ratings...............................9
5 General.....................................................................................10
5.1 AC electrical characteristics..............................................10
5.2 Nonswitching electrical specifications...............................10
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.2.7
5.2.8
Voltage and current operating requirements.........10
LVD and POR operating requirements.................11
Voltage and current operating behaviors..............12
Power mode transition operating behaviors..........13
Power consumption operating behaviors..............14
EMC radiated emissions operating behaviors.......18
Designing with radiated emissions in mind...........19
Capacitance attributes..........................................19
6.8.2
6.8.3
6.8.4
6.8.5
5.3.2
General switching specifications...........................20
5.4 Thermal specifications.......................................................21
5.4.1
5.4.2
Thermal operating requirements...........................21
Thermal attributes.................................................21
6 Peripheral operating requirements and behaviors....................22
6.1 Core modules....................................................................22
6.1.1
JTAG electricals....................................................22
6.2 System modules................................................................25
6.3 Clock modules...................................................................25
6.3.1
6.3.2
6.3.3
MCG specifications...............................................25
Oscillator electrical specifications.........................27
32 kHz Oscillator Electrical Characteristics...........29
6.4 Memories and memory interfaces.....................................30
6.4.1
6.4.2
Flash electrical specifications................................30
EzPort Switching Specifications............................34
6.5 Security and integrity modules..........................................35
6.6 Analog...............................................................................35
6.6.1
6.6.2
6.6.3
ADC electrical specifications.................................35
CMP and 6-bit DAC electrical specifications.........40
Voltage reference electrical specifications............43
6.7 Timers................................................................................44
6.8 Communication interfaces.................................................44
6.8.1
DSPI switching specifications (limited voltage
range)....................................................................44
DSPI switching specifications (full voltage range).46
I2C switching specifications..................................48
UART switching specifications..............................48
I2S/SAI Switching Specifications..........................48
6.9 Human-machine interfaces (HMI)......................................52
6.9.1
TSI electrical specifications...................................52
7 Dimensions...............................................................................54
7.1 Obtaining package dimensions.........................................54
8 Pinout........................................................................................54
8.1 K10 Signal Multiplexing and Pin Assignments..................54
8.2 K10 Pinouts.......................................................................57
9 Revision History........................................................................59
5.3 Switching specifications.....................................................19
5.3.1
Device clock specifications...................................19
K10 Sub-Family Data Sheet, Rev. 4 5/2012.
2
Freescale Semiconductor, Inc.
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
http://www.freescale.com
and perform a part number
search for the following device numbers: PK10 and MK10 .
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q K## A M FFF R T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
K##
A
M
Qualification status
Kinetis family
Key attribute
Flash memory type
Description
Values
• M = Fully qualified, general market flow
• P = Prequalification
• K10
• D = Cortex-M4 w/ DSP
• F = Cortex-M4 w/ DSP and FPU
• N = Program flash only
• X = Program flash and FlexMemory
Table continues on the next page...
K10 Sub-Family Data Sheet, Rev. 4 5/2012.
Freescale Semiconductor, Inc.
3
Terminology and guidelines
Field
FFF
Description
Program flash memory size
32 = 32 KB
64 = 64 KB
128 = 128 KB
256 = 256 KB
512 = 512 KB
1M0 = 1 MB
Values
R
Silicon revision
• Z = Initial
• (Blank) = Main
• A = Revision after main
• V = –40 to 105
• C = –40 to 85
FM = 32 QFN (5 mm x 5 mm)
FT = 48 QFN (7 mm x 7 mm)
LF = 48 LQFP (7 mm x 7 mm)
LH = 64 LQFP (10 mm x 10 mm)
MP = 64 MAPBGA (5 mm x 5 mm)
LK = 80 LQFP (12 mm x 12 mm)
MB = 81 MAPBGA (8 mm x 8 mm)
LL = 100 LQFP (14 mm x 14 mm)
ML = 104 MAPBGA (8 mm x 8 mm)
MC = 121 MAPBGA (8 mm x 8 mm)
LQ = 144 LQFP (20 mm x 20 mm)
MD = 144 MAPBGA (13 mm x 13 mm)
MJ = 256 MAPBGA (17 mm x 17 mm)
5 = 50 MHz
7 = 72 MHz
10 = 100 MHz
12 = 120 MHz
15 = 150 MHz
T
PP
Temperature range (°C)
Package identifier
CC
Maximum CPU frequency (MHz)
N
Packaging type
• R = Tape and reel
• (Blank) = Trays
2.4 Example
This is an example part number:
MK10DN128VLH5
3 Terminology and guidelines
K10 Sub-Family Data Sheet, Rev. 4 5/2012.
4
Freescale Semiconductor, Inc.
Terminology and guidelines
3.1 Definition: Operating requirement
An
operating requirement
is a specified value or range of values for a technical
characteristic that you must guarantee during operation to avoid incorrect operation and
possibly decreasing the useful life of the chip.
3.1.1 Example
This is an example of an operating requirement, which you must meet for the
accompanying operating behaviors to be guaranteed:
Symbol
V
DD
Description
1.0 V core supply
voltage
0.9
Min.
1.1
Max.
V
Unit
3.2 Definition: Operating behavior
An
operating behavior
is a specified value or range of values for a technical
characteristic that are guaranteed during operation if you meet the operating requirements
and any other specified conditions.
3.2.1 Example
This is an example of an operating behavior, which is guaranteed if you meet the
accompanying operating requirements:
Symbol
I
WP
Description
Digital I/O weak pullup/ 10
pulldown current
Min.
130
Max.
µA
Unit
3.3 Definition: Attribute
An
attribute
is a specified value or range of values for a technical characteristic that are
guaranteed, regardless of whether you meet the operating requirements.
K10 Sub-Family Data Sheet, Rev. 4 5/2012.
Freescale Semiconductor, Inc.
5
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参数对比
与MK10DX64VLH5相近的元器件有:MK10DN128VLH5R、MK10DX32VLH5、MK10DN128VMP5、MK10DX128VLH5。描述及对比如下:
型号 MK10DX64VLH5 MK10DN128VLH5R MK10DX32VLH5 MK10DN128VMP5 MK10DX128VLH5
描述 General Purpose Relays DPST-NO PC MT 12VDC Programmers - Processor Based Universal Multilink In-Cir Debug/Program FLASH, 50MHz, RISC MICROCONTROLLER, PBGA64 Accelerometers
产品种类
Product Category
ARM Microcontrollers - MCU ARM Microcontrollers - MCU ARM Microcontrollers - MCU - -
制造商
Manufacturer
NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) - -
RoHS Details Details Details - -
安装风格
Mounting Style
SMD/SMT SMD/SMT SMD/SMT - -
Core ARM Cortex M4 ARM Cortex M4 ARM Cortex M4 - -
Data Bus Width 32 bit 32 bit 32 bit - -
Maximum Clock Frequency 50 MHz 50 MHz 50 MHz - -
Program Memory Size 64 kB 128 kB 32 kB - -
Data RAM Size 16 kB 16 kB 16 kB - -
工作电源电压
Operating Supply Voltage
3.3 V 1.71 V to 3.6 V 3.3 V - -
最大工作温度
Maximum Operating Temperature
+ 105 C + 105 C + 105 C - -
Analog Supply Voltage 3.3 V 1.71 V to 3.6 V 3.3 V - -
最小工作温度
Minimum Operating Temperature
- 40 C - 40 C - 40 C - -
工厂包装数量
Factory Pack Quantity
160 1500 160 - -
电源电压-最大
Supply Voltage - Max
3.6 V 3.6 V 3.6 V - -
电源电压-最小
Supply Voltage - Min
1.71 V 1.71 V 1.71 V - -
单位重量
Unit Weight
0.012224 oz 0.012224 oz 0.012224 oz - -
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