Freescale Semiconductor, Inc.
Data Sheet: Technical Data
Document Number: KL36P121M48SF4
Rev 5 08/2014
Kinetis KL36 Sub-Family
48 MHz Cortex-M0+ Based Microcontroller
Designed with efficiency in mind. Compatible with all other
Kinetis L families as well as Kinetis K3x family. General purpose
MCU with segment LCD, featuring market leading ultra low-
power to provide developers an appropriate entry-level 32-bit
solution.
This product offers:
• Run power consumption down to 50 μA/MHz in very low
power run mode
• Static power consumption down to 2 μA with full state
retention and 4.5 μs wakeup
• Ultra-efficient Cortex-M0+ processor running up to 48 MHz
with industry leading throughput
• Memory option is up to 256 KB Flash and 32 KB RAM
• Energy-saving architecture is optimized for low power with
90 nm TFS technology, clock and power gating techniques,
and zero wait state flash memory controller
MKL36ZxxxVLH4
MKL36Z256VMP4,
MKL36ZxxxVLL4
MKL36ZxxxVMC4
64-pin LQFP (LH)
64-pin MAPBGA (MP)
10 x 10 x 1.4 Pitch 0.5 5 x 5 x 1.23 Pitch 0.5
mm
mm
100-pin LQFP (LL) 121-pin MAPBGA (MP)
14 x 14 x 1.4 Pitch 0.5 8 x 8 x 0.8 Pitch 0.65
mm
mm
Performance
• 48 MHz ARM
®
Cortex
®
-M0+ core
Memories and memory interfaces
• Up to 256 KB program flash memory
• Up to 32 KB SRAM
Human-machine interface
• Segment LCD controller supporting up to 47
frontplanes and 8 backplanes, or 51 frontplanes and
4 backplanes
• Low-power hardware touch sensor interface (TSI)
• Up to 84 general-purpose input/output (GPIO)
System peripherals
Communication interfaces
• Nine low-power modes to provide power optimization
• Two 16-bit SPI modules
based on application requirements
• I2S (SAI) module
• COP Software watchdog
• One low power UART module
• 4-channel DMA controller, supporting up to 63 request
• Two UART modules
sources
• Two I2C module
• Low-leakage wakeup unit
Analog Modules
• SWD debug interface and Micro Trace Buffer
• Bit Manipulation Engine
• 16-bit SAR ADC
• 12-bit DAC
Clocks
• Analog comparator (CMP) containing a 6-bit DAC
• 32 kHz to 40 kHz or 3 MHz to 32 MHz crystal oscillator
and programmable reference input
• Multi-purpose clock source
Operating Characteristics
• Voltage range: 1.71 to 3.6 V
• Flash write voltage range: 1.71 to 3.6 V
• Temperature range (ambient): -40 to 105°C
Timers
• Six channel Timer/PWM (TPM)
• Two 2-channel Timer/PWM modules
• Periodic interrupt timers
Freescale reserves the right to change the detail specifications as may be required to
permit improvements in the design of its products. © 2012–2014 Freescale
Semiconductor, Inc. All rights reserved.
• 16-bit low-power timer (LPTMR)
• Real time clock
Security and integrity modules
• 80-bit unique identification number per chip
Ordering Information
1
Part Number
Flash (KB)
MKL36Z64VLH4
MKL36Z128VLH4
MKL36Z256VLH4
MKL36Z256VMP4
MKL36Z64VLL4
MKL36Z128VLL4
MKL36Z256VLL4
MKL36Z128VMC4
MKL36Z256VMC4
64
128
256
256
64
128
256
128
256
Memory
SRAM (KB)
8
16
32
32
8
16
32
16
32
54
54
54
54
84
84
84
84
84
Maximum number of I\O's
1. To confirm current availability of ordererable part numbers, go to
http://www.freescale.com
and perform a part number
search.
Related Resources
Type
Description
Resource
Solution Advisor
KL36P121M48SF4RM
1
KL36P121M48SF4
1
KINETIS_L_xN40H
2
LQFP 64-pin: 98ASS23234W
1
MAPBGA 64-pin: 98ASA00420D
1
LQFP 100-pin: 98ASS23308W
1
MAPBGA 121-pin: 98ASA00344D
1
1. To find the associated resource, go to
http://www.freescale.com
and perform a search using this term.
2. To find the associated resource, go to
http://www.freescale.com
and perform a search using this term with the “x”
replaced by the revision of the device you are using.
Selector Guide The Freescale Solution Advisor is a web-based tool that features
interactive application wizards and a dynamic product selector.
Reference
Manual
Data Sheet
Chip Errata
Package
drawing
The Reference Manual contains a comprehensive description of
the structure and function (operation) of a device.
The Data Sheet includes electrical characteristics and signal
connections.
The chip mask set Errata provides additional or corrective
information for a particular device mask set.
Package dimensions are provided in package drawings.
2
Freescale Semiconductor, Inc.
Kinetis KL36 Sub-Family, Rev5 08/2014.
Table of Contents
1 Ratings.................................................................................. 4
1.1 Thermal handling ratings............................................... 4
1.2 Moisture handling ratings...............................................4
1.3 ESD handling ratings..................................................... 4
1.4 Voltage and current operating ratings............................4
2 General................................................................................. 5
2.1 AC electrical characteristics...........................................5
2.2 Nonswitching electrical specifications............................5
2.2.1 Voltage and current operating requirements......6
2.2.2 LVD and POR operating requirements.............. 6
2.2.3 Voltage and current operating behaviors........... 7
2.2.4 Power mode transition operating behaviors.......8
2.2.5 Power consumption operating behaviors...........9
2.2.6 EMC radiated emissions operating behaviors... 15
2.2.7 Designing with radiated emissions in mind........ 16
2.2.8 Capacitance attributes....................................... 16
2.3 Switching specifications................................................. 16
2.3.1 Device clock specifications................................ 16
2.3.2 General switching specifications........................17
2.4 Thermal specifications................................................... 17
2.4.1 Thermal operating requirements........................17
2.4.2 Thermal attributes.............................................. 17
3 Peripheral operating requirements and behaviors................ 18
3.1 Core modules................................................................ 18
3.1.1 SWD electricals .................................................18
3.2 System modules............................................................ 20
3.3 Clock modules............................................................... 20
3.3.1 MCG specifications............................................ 20
3.3.2 Oscillator electrical specifications...................... 22
3.4 Memories and memory interfaces................................. 24
3.4.1 Flash electrical specifications............................ 24
3.5 Security and integrity modules.......................................26
3.6 Analog............................................................................26
3.6.1
3.6.2
ADC electrical specifications..............................26
CMP and 6-bit DAC electrical specifications......31
3.6.3 12-bit DAC electrical characteristics.................. 33
3.7 Timers............................................................................ 36
3.8 Communication interfaces............................................. 36
3.8.1
3.8.2
3.8.3
SPI switching specifications...............................36
Inter-Integrated Circuit Interface (I2C) timing.....41
UART................................................................. 42
4
5
6
7
8
3.8.4 I2S/SAI switching specifications........................ 42
3.9 Human-machine interfaces (HMI).................................. 46
3.9.1 TSI electrical specifications................................46
3.9.2 LCD electrical characteristics.............................47
Dimensions........................................................................... 48
4.1 Obtaining package dimensions......................................48
Pinout.................................................................................... 49
5.1 KL36 Signal Multiplexing and Pin Assignments.............49
5.2 KL36 pinouts.................................................................. 53
Ordering parts....................................................................... 57
6.1 Determining valid orderable parts.................................. 57
Part identification...................................................................58
7.1 Description..................................................................... 58
7.2 Format........................................................................... 58
7.3 Fields............................................................................. 58
7.4 Example......................................................................... 59
Terminology and guidelines.................................................. 59
8.1 Definition: Operating requirement.................................. 59
8.2 Definition: Operating behavior....................................... 59
8.3 Definition: Attribute........................................................ 59
8.4 Definition: Rating........................................................... 60
8.5 Result of exceeding a rating.......................................... 60
8.6 Relationship between ratings and operating
requirements.................................................................. 61
8.7 Guidelines for ratings and operating requirements........ 61
8.8 Definition: Typical value................................................. 61
8.9 Typical value conditions.................................................62
9 Revision history.....................................................................63
Kinetis KL36 Sub-Family, Rev5 08/2014.
3
Freescale Semiconductor, Inc.
Ratings
1 Ratings
1.1 Thermal handling ratings
Table 1. Thermal handling ratings
Symbol
T
STG
T
SDR
Description
Storage temperature
Solder temperature, lead-free
Min.
–55
—
Max.
150
260
Unit
°C
°C
Notes
1
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.2 Moisture handling ratings
Table 2. Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
1.3 ESD handling ratings
Table 3. ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device
model
Latch-up current at ambient temperature of 105 °C
Min.
–2000
–500
–100
Max.
+2000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human
Body Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78,
IC Latch-Up Test.
4
Freescale Semiconductor, Inc.
Kinetis KL36 Sub-Family, Rev5 08/2014.
General
1.4 Voltage and current operating ratings
Table 4. Voltage and current operating ratings
Symbol
V
DD
I
DD
V
IO
I
D
V
DDA
Description
Digital supply voltage
Digital supply current
IO pin input voltage
Instantaneous maximum current single pin limit (applies to
all port pins)
Analog supply voltage
Min.
–0.3
—
–0.3
–25
V
DD
– 0.3
Max.
3.8
120
V
DD
+ 0.3
25
V
DD
+ 0.3
Unit
V
mA
V
mA
V
2 General
2.1 AC electrical characteristics
Unless otherwise specified, propagation delays are measured from the 50% to the 50%
point, and rise and fall times are measured at the 20% and 80% points, as shown in the
following figure.
Low
High
80%
50%
20%
Rise Time
V
IH
Input Signal
Midpoint1
Fall Time
V
IL
The midpoint is V
IL
+ (V
IH
- V
IL
) / 2
Figure 2. Input signal measurement reference
All digital I/O switching characteristics, unless otherwise specified, assume the output
pins have the following characteristics.
• C
L
=30 pF loads
• Slew rate disabled
• Normal drive strength
2.2 Nonswitching electrical specifications
Kinetis KL36 Sub-Family, Rev5 08/2014.
5
Freescale Semiconductor, Inc.
