文档预览

FEUL610Q411-03

ML610Q411/Q412/Q415

User’s Manual

Issue Date: Oct. 17, 2011

NOTES

No copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS Semiconductor Co., Ltd.

The content specified herein is subject to change for improvement without notice.

The content specified herein is for the purpose of introducing LAPIS Semiconductor 's products (hereinafter "Products"). If you wish

to use any such Product, please be sure to refer to the specifications, which can be obtained from LAPIS Semiconductor upon request.

Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and

operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage

arising from any inaccuracy or misprint of such information, LAPIS Semiconductor shall bear no responsibility for such damage.

The technical information specified herein is intended only to show the typical functions of and examples of application circuits for

the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or

other rights held by LAPIS Semiconductor and other parties. LAPIS Semiconductor shall bear no responsibility whatsoever for any

dispute arising from the use of such technical information.

The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio

visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).

The Products specified in this document are not designed to be radiation tolerant.

While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a Product may fail or

malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury,

fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe

designs. LAPIS Semiconductor shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or

not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high

level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such

as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety

device). LAPIS Semiconductor shall bear no responsibility in any way for use of any of the Products for the above special purposes. If

a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange

and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.

Preface

This manual describes the operation of the hardware of the 8-bit microcontroller

ML610Q411/ML610Q412/ML610Q415.

The following manuals are also available.

nX-U8/100 Core Instruction Manual

Read them as necessary.

Description on the basic architecture and the each instruction of the

nX-U8/100 Core

MACU8 Assembler Package User’s Manual

Description on the method of operating the relocatable assembler, the linker, the

librarian, and the object converter and also on the specifications of the assembler

language.

CCU8 User’s Manual

Description on the method of operating the

compiler

CCU8 Programming Guide

Description on the method of programming.

CCU8 Language Reference

Description on the

language specifications

DTU8 Debugger User’s Manual

Description on the method of operating the debugger

DTU8

IDEU8 User’s Manual

Description on the integrated development environment

IDEU8

uEASE User’s Manual

Description on the on-chip debug tool uEASE.

uEASE connection Manual for ML610Q400

Description about the connection between uEASE and

ML610Q400 series

FWuEASE Flash Writer Host Program User’s Manual

Description on the Flash Writer host program.

Notation

Classification

♦

Numeric value

♦

Unit

Notation

xxh, xxH

xxb

word, W

byte, B

nibble, N

maga-, M

kilo-, K

kilo-, k

milli-, m

micro-, µ

nano-, n

second, s (lower case)

“H” level, “1” level

“L” level, “0” level

Description

Indicates a hexadecimal number. x: Any value in the range of 0 to F

Indicates a binary number; “b” may be omitted. x: A value 0 or 1

1 word = 16 bits

1 byte = 8 bits

1 nibble = 4 bits

= 1024

= 1000

-3

-6

-9

second

Indicates high voltage signal levels V

and V

as specified by the

electrical characteristics.

Indicates low voltage signal levels V

and V

as specified by the

electrical characteristics.

♦

Terminology

♦

R/W: Indicates that Read/Write attribute. “R” indicates that data can be read and “W” indicates that data can be written.

“R/W” indicates that data can be read or written.

Invalid bit: This bit reads “0” when read. Write to this bit is ignored.

Bit name

MSB

FCON0

R/W

Initial value

⎯

R/W

⎯

R/W

OUTC1

R/W

OUTC0

R/W

⎯

R/W

OSCM0

R/W

SYSC1

R/W

SYSC0

R/W

LSB

Initial value after reset

ML610Q411/ML610Q412/ML610Q415 User’s Manual

Contents

Table of Contents

Chapter 1

1. Overview ........................................................................................................................................................ 1-1

1.1 Features....................................................................................................................................................... 1-1

1.2 Configuration of Functional Blocks............................................................................................................ 1-4

1.2.1

Block Diagram of ML610Q411/ML610Q415 .................................................................................... 1-4

1.2.2

Block Diagram of ML610Q412.......................................................................................................... 1-5

1.3 Pins ............................................................................................................................................................. 1-6

1.3.1

Pin Layout........................................................................................................................................... 1-6

1.3.1.1 Pin Layout of ML610Q411/ML610Q415 LQFP Package............................................................... 1-6

1.3.1.2 Pin Layout of ML610Q412 LQFP Package .................................................................................... 1-7

1.3.1.3 Pin Layout of ML610Q411/ML610Q415 Chip............................................................................... 1-8

1.3.1.4 Pin Layout of ML610Q412 Chip..................................................................................................... 1-9

1.3.1.5 Pad Coordinates of ML610Q411/ML610Q415 Chip .................................................................... 1-10

1.3.1.6 Pad Coordinates of ML610Q412 Chip .......................................................................................... 1-11

1.3.2

List of Pins........................................................................................................................................ 1-12

1.3.3

Description of Pins............................................................................................................................ 1-16

1.3.4

Termination of Unused Pins ............................................................................................................. 1-20

Chapter 2

2. CPU ................................................................................................................................................................ 2-1

2.1 Overview..................................................................................................................................................... 2-1

2.2 Program Memory Space ............................................................................................................................. 2-1

2.3 Data Memory Space.................................................................................................................................... 2-2

2.4 Instruction Length....................................................................................................................................... 2-2

2.5 Data Type.................................................................................................................................................... 2-2

2.6 Description of Registers.............................................................................................................................. 2-3

2.6.1

List of Registers .................................................................................................................................. 2-3

2.6.2

Data Segment Register (DSR) ............................................................................................................ 2-4

Chapter 3

3. Reset Function ................................................................................................................................................ 3-1

3.1 Overview..................................................................................................................................................... 3-1

3.1.1

Features............................................................................................................................................... 3-1

3.1.2

Configuration ...................................................................................................................................... 3-1

3.1.3

List of Pin ........................................................................................................................................... 3-1

3.2 Description of Registers.............................................................................................................................. 3-2

3.2.1

List of Registers .................................................................................................................................. 3-2

3.2.2

Reset Status Register (RSTAT) .......................................................................................................... 3-2

3.3 Description of Operation............................................................................................................................. 3-3

3.3.1

Operation of System Reset Mode ....................................................................................................... 3-3

Chapter 4

4. MCU Control Function................................................................................................................................... 4-1

4.1 Overview..................................................................................................................................................... 4-1

4.1.1

Features............................................................................................................................................... 4-1

4.1.2

Configuration ...................................................................................................................................... 4-1

4.2 Description of Registers.............................................................................................................................. 4-2

4.2.1

List of Registers .................................................................................................................................. 4-2

4.2.2

Stop Code Acceptor (STPACP).......................................................................................................... 4-3

4.2.3

Standby Control Register (SBYCON) ................................................................................................ 4-4

4.2.4

Block Control Register 0 (BLKCON0) .............................................................................................. 4-5

4.2.5

Block Control Register 1 (BLKCON1) .............................................................................................. 4-6

Contents – 1

漏电保护装置安装和运行: 漏电保护装置安装和运行漏电保护装置安装和运行 ...; fighting 嵌入式系统

第五届全国大学生电子设计竞赛获奖作品选: 本帖最后由 paulhyde 于 2014-9-15 08:54 编辑第五届全国大学生电子设计...; fighting 电子竞赛

PIC 8位单片机的分类和特点: PIC 8 位单片机的分类和特点 PIC 8位单片机的分类和特点 ...; rain Microchip MCU

用DSP进行mp3解压缩的算法原程序: 用DSP进行mp3解压缩的算法原程序用DSP进行mp3解压缩的算法原程序 ...; lorant DSP 与 ARM 处理器

找AMS1117-3.3V 低功耗替代料: 找可以取代SOT -223、AMS1117-3.3V、Pin to Pin 的低功耗LDO，尽量是常...; bluefox0919 电源技术

《人工智能实践教程》3、神经网络: 一、神经网络介绍神经网络与感知机有很多共同点，同时也有一些差异。神经网络如下图，最i左边的...; xinmeng_wit 嵌入式系统

远程自动报警系统的设计与实现

随着国家智能化小区建设的推广，防盗系统已成为智能小区的必备设备，特别是近几年，安全防范的迫切需要给家庭防盗报警系统提供了越来越广泛的市场。从国内来看，比较高档的防盗报警装置一般为进口产品，价格昂贵，且大多为有线连接方式。国内产品尽管不少，但大多为模拟电路形式，且结构和功能简单，可靠性差，难以联网。在已普及的公共电话网基础上研制一种新型家用自动报警系统，这对于保障居民的生命财产安全，提高公安、...[详细]
台积电是否参股ASML 45天揭晓

半导体微影设备大厂艾司摩尔（ASML）向台积电发出投资邀约，业界评估，台积电是否答应参股，最快45天内，也就是8月底前就会揭晓。英特尔藉由投资ASML，企图取得20纳米以下微影设备技术领先地位，攸关台积电、三星未来先进制程的竞争态势，台积电参股态度如何，预料将成为19日法说会焦点。英特尔宣布投资ASML 15%股权，震撼半导体业界。 ASML也对台积电、三星发出投资邀约，是ASML第...[详细]
解析LED点阵屏设计中蓝牙技术的应用案例

本文设计一种内容更新便捷、可扩展、低价格的点阵LED 文字显示屏。降低成本的途径是 ①用几乎人人都有的手机的蓝牙数据传输功能进行LED 显示内容的更新，免去专业上位机软件和控制卡的成本，操作也更简单; ②单次显示内容在5 ~ 30 个汉字或英文字母，因为显示内容较少，就可实现扩展电路的简单化。 1 系统设计方案 1. 1 系统组成系统由带蓝牙功能的智能手机和LED 显示屏组成。其中，...[详细]
泛华恒兴参加华南自动化展货架、系统产品齐亮相

作为致力于为各行业用户提供专业测试测量解决方案和成套检测设备的高新技术企业，北京泛华恒兴科技有限公司（简称：泛华恒兴）参加了2012年深圳华南自动化展，并参加了中国电源学会电源技术分会活动，这也是泛华首次有规模地参加华南市场的大型展会。泛华恒兴展台会上，由泛华恒兴推出的全新的系统级产品——电源自动化测试台高调亮相。电源自动化测试台倡导可靠、精准、自动、高效的电源测试，已...[详细]
燃料电池发动机智能测试平台的设计

　　本文建立了基于NI集成软硬件环境燃料电池发动机测试平台。该平台可以实现燃料电池发动机及其辅助系统的测试与控制、燃料电池发动机系统参数测量、为燃料电池发动机提供多种工况环境，甚至系统控制策略的评价。利用NI开发套件建立了一个内嵌专家系统的智能软件平台，不仅确保了测试平台的工作安全性，同时也可以对系统的潜在故障进行诊断。此外，由于该测试平台的高速采样，使得燃料电池发动机动态特性参数的准确性得...[详细]
芳香气体透过性检测方法

　　芳香气体广泛存在于食品、药品、化妆品和各种日化产品中，例如风味小吃、白酒、香料、中药材、膏药、香水、香皂、洗发水等等。与无机气体和水蒸气不同的是，多数芳香气体是由产品自身散发出来的，而且更是这些产品的重要品质和主要功能（有些也是唯一功能）。而对于这些产品来讲，芳香气体的存在起着极其重要的作用，散失或增加都会直接影响到产品的品质和销售，因而芳香气体种类以及浓度的保持成为衡量这些产品品质的重要指...[详细]
FF现场总线在唐钢焦化厂粗苯和精苯控制系统的应用

一、背景简介：唐钢煤气焦化厂化产车间仪表系统参数检测和控制采用的全部是模拟仪表，有些甚至为老式的II性仪表，存在着精度低、干扰影响大的缺点，整个系统的控制品质非常差。随着生产的发展，原系统已不能更好地满足生产需要，厂方越来越迫切地需要对控制系统实现计算机控制，对整个生产系统进行一个统一的科学管理。随着过程控制技术、自动化仪表技术和计算机网络技术的成熟和发展，控制领...[详细]
美国国会或禁止企业滥用行业标准专利

7月11日消息，据国外媒体报道，美国国会正在考虑，是否应禁止公司以侵犯其与行业标准密切相关的专利为由，要求有关机构针对侵权产品颁发美国市场的销售禁令。持有与行业标准密切相关专利的公司，被期待以公平、合理和非歧视性的原则将专利授权给任何一家公司，甚至是其竞争对手。这些公司还被期待在每次进行专利授权时，收取较低的费用，因这些专利被广泛授权，因此即使收费较低授权回报也会相当可观。但在智能手机...[详细]
PPTV日均流量持续居首欧洲杯直播巩固领先

根据艾瑞咨询最新提供的数据分析显示，通过凭借欧洲杯赛事的优异表现，PPTV网络电视日均流量超过3403万人次，连续数周保持行业第一。伴随战火持续一个月的欧洲杯赛事落下帷幕，国内视频网站围绕欧洲杯展开的直播与营销比拼也至此告一段落。众所周知的是，本届欧洲杯给本已异常激烈的视频行业争夺持续添薪助燃，各家企业无不宣称自己在业内处于领先位置，然而行业排位究竟如何仍需凭借真实的流量数据进行去伪存...[详细]
SMA推出电弧故障断路光伏逆变器已获UL认证

光伏逆变器生产商SMA近日推出了第一款直流电弧故障断路(AFCI)光伏逆变器，并且已收到UL认证。新的SunnyBoyAFCI逆变器型号包括3000-US,3800-US,4000-US,5000-US,6000-US,7000-US和8000-US，可以检测和熄灭电弧故障，已经通过UL1699B测试，并且遵从美国国家电工标准(NEC)2011年690.11章节的光伏要求。该逆变器的综合设计并...[详细]
变频器控制回路的抗干扰措施

我们知道：变频器由主回路和控制回路两大部分组成，由于主回路的非线性（进行开关动作），变频器本身就是谐波干扰源，所以对电源侧和输出侧的设备会产生影响。与主回路相比，变频器的控制回路却是小能量、弱信号回路，极易遭受其它装置产生的干扰，造成变频器无法工作。因此，变频器在安装使用时，必须对控制回路采取抗干扰措施。变频器的基本控制回路同外部进行信号交流的基本回路有模拟与数字两种：（1）4 ~ 2...[详细]
基于DSP的16通道声发射同步数据采集电路设计

摘要：针对煤岩声发射信号监测系统的需求，采用16位定点DSP芯片TMS320VC5509A和高精度A／D转换器ADS1278设计了一种具有24位分辨率、16通道同步数据采集功能的数据采集电路。控制接口采用I2C接口扩展I／O的方式实现，数据接口采用McBSP接口以帧同步方式实现，2片ADS1278采用菊花链的方式级联。给出了硬件电路、底层软件和测试结果，该数据采集电路具有接口简单、高性能、低...[详细]
空分复用MIMO通信系统简介及FPGA实现

空分复用 (SDM) MIMO 处理可显著提高频谱效率，进而大幅增加无线通信系统的容量。空分复用 MIMO 通信系统作为一种能够大幅提升无线系统容量和连接可靠性的手段，近来吸引了人们的广泛关注。　　MIMO 无线系统最佳硬判决检测方式是最大似然 (ML) 检测器。ML 检测因为比特误码率 (BER)性能出众，非常受欢迎。不过，直接实施的复杂性会随着天线和调制方案的增加呈指数级增强，使...[详细]
高亮度LED技术简介

　　 LED光源具备多项环保优势，但早期产品在散热处理与高亮度设计方面，仍存在某些技术瓶颈无法突破，但在LED芯片制程持续改善下，现有照明用LED的亮度输出流明更趋近于日常照明需求，加上IC固态形式的元件设计，让LED的光源设计增加更多应用弹性与优势。　　尤其是LED光源不易损坏、寿命长的优点，若不计单组成本问题，相较于传统高耗能的钨丝灯(白炽灯)/卤素灯/高压钠灯、有汞污染疑虑的CCF...[详细]
串行实时时钟芯片DS1302程序设计中的问题与对策

美国Dallas公司推出的串行接口实时时钟芯片DSl302可对时钟芯片备份电池进行涓流充电。由于该芯片具有体积小、功耗低、接口容易、占用CPUI／O口线少等主要特点，故该芯片可作为实时时钟广泛应用于智能化仪器仪表中。笔者在调试中发现在对DSl302编程中有几个问题易被疏忽而导致错误，现提供给读者参考。 1读操作出现的错误按照参考文献的读操作程序框图和参考文献、所叙述的...[详细]

ML610Q412-NNNTBZ03A