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PDF数据手册

ML610Q415-XXXWA

描述：
RISC Microcontroller, 8-Bit, FLASH, 0.625MHz, CMOS, CHIP-95
分类：
嵌入式处理器和控制器    微控制器和处理器   
文件大小：
2MB，共381页
制造商：
LAPIS Semiconductor Co Ltd
概述
RISC Microcontroller, 8-Bit, FLASH, 0.625MHz, CMOS, CHIP-95
器件参数
参数名称
属性值
厂商名称
LAPIS Semiconductor Co Ltd
零件包装代码
DIE
包装说明
CHIP-95
针数
95
Reach Compliance Code
unknown
具有ADC
YES
其他特性
OPERATES AT 1.1 MINIMUM SUPPLY AT 46.9KHZ
地址总线宽度
位大小
8
最大时钟频率
0.0781 MHz
DAC 通道
NO
DMA 通道
NO
外部数据总线宽度
JESD-30 代码
R-XUUC-N95
长度
2.836 mm
I/O 线路数量
31
端子数量
95
最高工作温度
70 °C
最低工作温度
-20 °C
PWM 通道
YES
封装主体材料
UNSPECIFIED
封装代码
DIE
封装形状
RECTANGULAR
封装形式
UNCASED CHIP
认证状态
Not Qualified
ROM可编程性
FLASH
速度
0.625 MHz
最大供电电压
3.6 V
最小供电电压
1.3 V
标称供电电压
3 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子形式
NO LEAD
端子位置
UPPER
宽度
2.636 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER, RISC
文档预览
FEUL610Q411-03
ML610Q411/Q412/Q415
User’s Manual
Issue Date: Oct. 17, 2011
NOTES
No copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS Semiconductor Co., Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing LAPIS Semiconductor 's products (hereinafter "Products"). If you wish
to use any such Product, please be sure to refer to the specifications, which can be obtained from LAPIS Semiconductor upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and
operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage
arising from any inaccuracy or misprint of such information, LAPIS Semiconductor shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples of application circuits for
the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or
other rights held by LAPIS Semiconductor and other parties. LAPIS Semiconductor shall bear no responsibility whatsoever for any
dispute arising from the use of such technical information.
The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio
visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a Product may fail or
malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury,
fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe
designs. LAPIS Semiconductor shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or
not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high
level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such
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If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange
and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Copyright 2011 LAPIS Semiconductor Co., Ltd.
Preface
This manual describes the operation of the hardware of the 8-bit microcontroller
ML610Q411/ML610Q412/ML610Q415.
The following manuals are also available.
nX-U8/100 Core Instruction Manual
Read them as necessary.
Description on the basic architecture and the each instruction of the
nX-U8/100 Core
.
MACU8 Assembler Package User’s Manual
Description on the method of operating the relocatable assembler, the linker, the
librarian, and the object converter and also on the specifications of the assembler
language.
CCU8 User’s Manual
Description on the method of operating the
compiler
.
CCU8 Programming Guide
Description on the method of programming.
CCU8 Language Reference
Description on the
language specifications
.
DTU8 Debugger User’s Manual
Description on the method of operating the debugger
DTU8
.
IDEU8 User’s Manual
Description on the integrated development environment
IDEU8
.
uEASE User’s Manual
Description on the on-chip debug tool uEASE.
uEASE connection Manual for ML610Q400
Description about the connection between uEASE and
ML610Q400 series
.
FWuEASE Flash Writer Host Program User’s Manual
Description on the Flash Writer host program.
Notation
Classification
♦
Numeric value
♦
Unit
Notation
xxh, xxH
xxb
word, W
byte, B
nibble, N
maga-, M
kilo-, K
kilo-, k
milli-, m
micro-, µ
nano-, n
second, s (lower case)
“H” level, “1” level
“L” level, “0” level
Description
Indicates a hexadecimal number. x: Any value in the range of 0 to F
Indicates a binary number; “b” may be omitted. x: A value 0 or 1
1 word = 16 bits
1 byte = 8 bits
1 nibble = 4 bits
10
6
2
10
= 1024
10
3
= 1000
10
-3
10
-6
10
-9
second
Indicates high voltage signal levels V
IH
and V
OH
as specified by the
electrical characteristics.
Indicates low voltage signal levels V
IL
and V
OL
as specified by the
electrical characteristics.
♦
Terminology
♦
Register description
R/W: Indicates that Read/Write attribute. “R” indicates that data can be read and “W” indicates that data can be written.
“R/W” indicates that data can be read or written.
Invalid bit: This bit reads “0” when read. Write to this bit is ignored.
Register name
Bit name
MSB
FCON0
R/W
Initial value
⎯
R/W
0
⎯
R/W
0
OUTC1
R/W
1
OUTC0
R/W
1
⎯
R/W
0
OSCM0
R/W
0
SYSC1
R/W
1
SYSC0
R/W
1
LSB
Initial value after reset
ML610Q411/ML610Q412/ML610Q415 User’s Manual
Contents
Table of Contents
Chapter 1
1. Overview ........................................................................................................................................................ 1-1
1.1 Features....................................................................................................................................................... 1-1
1.2 Configuration of Functional Blocks............................................................................................................ 1-4
1.2.1
Block Diagram of ML610Q411/ML610Q415 .................................................................................... 1-4
1.2.2
Block Diagram of ML610Q412.......................................................................................................... 1-5
1.3 Pins ............................................................................................................................................................. 1-6
1.3.1
Pin Layout........................................................................................................................................... 1-6
1.3.1.1 Pin Layout of ML610Q411/ML610Q415 LQFP Package............................................................... 1-6
1.3.1.2 Pin Layout of ML610Q412 LQFP Package .................................................................................... 1-7
1.3.1.3 Pin Layout of ML610Q411/ML610Q415 Chip............................................................................... 1-8
1.3.1.4 Pin Layout of ML610Q412 Chip..................................................................................................... 1-9
1.3.1.5 Pad Coordinates of ML610Q411/ML610Q415 Chip .................................................................... 1-10
1.3.1.6 Pad Coordinates of ML610Q412 Chip .......................................................................................... 1-11
1.3.2
List of Pins........................................................................................................................................ 1-12
1.3.3
Description of Pins............................................................................................................................ 1-16
1.3.4
Termination of Unused Pins ............................................................................................................. 1-20
Chapter 2
2. CPU ................................................................................................................................................................ 2-1
2.1 Overview..................................................................................................................................................... 2-1
2.2 Program Memory Space ............................................................................................................................. 2-1
2.3 Data Memory Space.................................................................................................................................... 2-2
2.4 Instruction Length....................................................................................................................................... 2-2
2.5 Data Type.................................................................................................................................................... 2-2
2.6 Description of Registers.............................................................................................................................. 2-3
2.6.1
List of Registers .................................................................................................................................. 2-3
2.6.2
Data Segment Register (DSR) ............................................................................................................ 2-4
Chapter 3
3. Reset Function ................................................................................................................................................ 3-1
3.1 Overview..................................................................................................................................................... 3-1
3.1.1
Features............................................................................................................................................... 3-1
3.1.2
Configuration ...................................................................................................................................... 3-1
3.1.3
List of Pin ........................................................................................................................................... 3-1
3.2 Description of Registers.............................................................................................................................. 3-2
3.2.1
List of Registers .................................................................................................................................. 3-2
3.2.2
Reset Status Register (RSTAT) .......................................................................................................... 3-2
3.3 Description of Operation............................................................................................................................. 3-3
3.3.1
Operation of System Reset Mode ....................................................................................................... 3-3
Chapter 4
4. MCU Control Function................................................................................................................................... 4-1
4.1 Overview..................................................................................................................................................... 4-1
4.1.1
Features............................................................................................................................................... 4-1
4.1.2
Configuration ...................................................................................................................................... 4-1
4.2 Description of Registers.............................................................................................................................. 4-2
4.2.1
List of Registers .................................................................................................................................. 4-2
4.2.2
Stop Code Acceptor (STPACP).......................................................................................................... 4-3
4.2.3
Standby Control Register (SBYCON) ................................................................................................ 4-4
4.2.4
Block Control Register 0 (BLKCON0) .............................................................................................. 4-5
4.2.5
Block Control Register 1 (BLKCON1) .............................................................................................. 4-6
Contents – 1
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