(13) Other applications that are not considered general-purpose
applications
When designing your equipment even for general-purpose applications, you are kindly requested to take into consideration securing
protection circuit/device or providing backup circuits in your equipment.
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Product compatible with RoHS directive
Halogen-free
Compatible with lead-free solders
Inductors for Standard Circuits
Multilayer Ferrite
Overview of the MLF Series
FEATURES
The lineup includes a wide inductance range.
Highly reliable monolithic structure with multilayer integration.
APPLICATION
Smart phones, tablet terminals, tuners, LCD-TVs, PDP-TVs, audio equipment, computers, signal processing for modules etc.
PART NUMBER CONSTRUCTION
MLF
Series name
1005
L×W×H Dimensions
(mm)
1005
1.0×0.5×0.5
1608
1.6×0.8×0.8
2.0×1.25×0.85
2012
2.0×1.25×1.25
A
characteristics
A
C
D
E
G
K
V
R10
Inductance
(µH)
0.010
10N
(10nH)
R10
0.1
1R0
1
100
10
△
Inductance
tolerance
J
±5%
K
±10%
M
±20%
T
T
Packaging style
Taping
000
Internal code
000
A00
D00
OPERATING TEMPERATURE RANGE, PACKAGE QUANTITY, PRODUCT WEIGHT
Type
Temperature range
Operating
Storage
temperature
temperature
（°C）
（°C）
–55 to +125
–55 to +125
–55 to +125
–55 to +125
Package quantity
Individual weight
(pieces/reel)
（mg）
MLF1005
10,000
1.2
MLF1608
4,000
4
t=0.85
4,000
10
MLF2012
–55 to +125
–55 to +125
t=1.25
2,000
14
In case the product's inductance is 15µH or higher, both Operating and Storage temperature ranges are –40 to +85°C.
The Storage temperature range is for after the circuit board is mounted.
RoHS Directive Compliant Product: See the following for more details related to RoHS Directive compliant products. http://product.tdk.com/en/environment/rohs/
Halogen-free: Indicates that Cl content is less than 900ppm, Br content is less than 900ppm, and that the total Cl and Br content is less than 1500ppm.
• All specifications are subject to change without notice.
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Overview of the MLF Series
RECOMMENDED REFLOW PROFILE
Preheating
Soldering
Peak
Natural
cooling
T4
T:
Temperature
T3
T3
T2
T1
t1
t3
t2
t:
Time
Preheating
Temp.
T1
T2
150°C
180°C
Time
t1
60 to 120s
Soldering
Temp.
Time
T3
t2
230°C
30 to 60s
Peak
Temp.
Time
T4
t3
250 to 260°C 10s max.
• All specifications are subject to change without notice.
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MLF
series
MLF1005 Type
SHAPE & DIMENSIONS
0.50±0.05
0.10min.
1.00±0.05
0.10min.
0.50±0.05
Dimensions in mm
RECOMMENDED LAND PATTERN
0.5
0.5
0.4
0.5
Dimensions in mm
• All specifications are subject to change without notice.
