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MLG0603Q3N2BT000

General Purpose Inductor, 0.0032uH, 3.125%, 1 Element, SMD, 0603, CHIP, 0603, ROHS COMPLIANT

器件类别:无源元件    电感器   

厂商名称:TDK(株式会社)

厂商官网:http://www.tdk.com

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
TDK(株式会社)
包装说明
CHIP, 0603, ROHS COMPLIANT
Reach Compliance Code
compliant
ECCN代码
EAR99
大小写代码
0603
直流电阻
0.3 Ω
标称电感 (L)
0.0032 µH
电感器应用
RF INDUCTOR
电感器类型
GENERAL PURPOSE INDUCTOR
JESD-609代码
e3
功能数量
1
端子数量
2
最高工作温度
125 °C
最低工作温度
-55 °C
最小质量因数(标称电感时)
5
最大额定电流
0.3 A
自谐振频率
6000 MHz
形状/尺寸说明
RECTANGULAR PACKAGE
屏蔽
NO
特殊特征
INDUCTANCE TOLERANCE IS 0.1 NANO HENRY
表面贴装
YES
端子面层
Tin (Sn)
端子位置
DUAL ENDED
端子形状
WRAPAROUND
测试频率
100 MHz
容差
3.125%
文档预览
Page 1 of 2
Product Name
Series
Type
Part Number
Multilayer Inductor for Ultra High
Frequency Range
MLG Series
0603Q Type
MLG0603Q3N2BT000
PROD
Product Lifecycle Stage
Specification
Mounting Method Flag
Processing
Shape
Size Code
Body Length(L)
Body Breadth(W)
Body Height(T)
Rated Inductance
Inductance Tolerance
(Value)
Test Frequency of
Inductance
Q
Test Frequency of Q
Self Resonant Frequency
DC Resistance
DC Resistance
Rated Current
IDC2 ( Temperature Rise)
Temperature Rise
Terminal Material
Polarity Marking
Magnetic Shielding
Soldering Method
Measuring Equipment(L, Q, Rdc)
Category Temperature
Range
Storage Temperature Range
Weight
Min
Max
Min
Max
Nom
Nom
Nom
Nom
Nom
Min
Max
Nom
Min
Nom
Min
Typ
Max
Nom
Max
Max
Max
Yes
No
Reflow,Iron Soldering
HP4291A
-55 Cel
125 Cel
-55 Cel
125 Cel
0.0002 g
Yes
MULTI-LAYER
SMD
0603
0.6 m m
0.3 m m
0.3 m m
3.2 n H
-0.1 n H
0.1 n H
100 M Hz
5
100 M Hz
6 G Hz
7.1 G Hz
0.3 Ohm
0.15 Ohm
300 m A
300 m A
300 m A
20 Cel
Ag(100%)/Sn plating
Summary/Applications/Feature
Summary
Small size High-Q RF coil for high frequency
circuit of mobile application.
For high-frequency applications including
Applications mobile phones, high frequency modules (PA,
VCO, Rx etc.), Bluetooth and W-LAN.
By the most suitable design, Q is higher than
competing in a conventional product
MLG0603S type. In particular, Q in more than
800MHz largely improved.
Advanced monolithic structure is formed using
a multilayering and sintering process with
ceramic and conductive materials for high-
frequency.
Lead free, lead free soldering, and RoHS
compliant
Feature
Packaging
Packing
Minumum Package Qty Nom
Minimum Order Qty
Nom
Punched (Paper)Taping
[180mm Reel]
15000 Pcs
15000 Pcs
IDC1 ( Inductance Change) Max
http://roots.tdk.co.jp/rootsme.asp?ID=TJA024&NO=MLG0603Q3N2BT00022... 3/27/2009
Page 2 of 2
[ Caution ]
Specifications which provide more details for the proper
and safe use of the described product are available upon request.
[ Notice of Revision and Improve ]
All specifications are subject to change without notice.
Copyright(c) 1996-2008 All rights reserved.
http://roots.tdk.co.jp/rootsme.asp?ID=TJA024&NO=MLG0603Q3N2BT00022... 3/27/2009
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