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March 2014
Inductors for High Frequency
Multilayer Ceramic
MLG
series
MLG0603S
MLG1005S
MLG1608
0603 [0201 inch]*
1005 [0402 inch]
1608 [0603 inch]
*
Dimensions Code JIS[EIA]
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REMINDERS FOR USING THESE PRODUCTS
Before using these products, be sure to request the delivery specifications.
SAFETY REMINDERS
Please pay sufficient attention to the warnings for safe designing when using these products.
REMINDERS
The storage period is less than 12 months. Be sure to follow the storage conditions (Temperature: 5 to 40°C, Humidity: 10 to 75% RH
or less).
If the storage period elapses, the soldering of the terminal electrodes may deteriorate.
Do not use or store in locations where there are conditions such as gas corrosion (salt, acid, alkali, etc.).
Before soldering, be sure to preheat components.
The preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature
does not exceed 150°C.
Soldering corrections after mounting should be within the range of the conditions determined in the specifications.
If overheated, a short circuit, performance deterioration, or lifespan shortening may occur.
When embedding a printed circuit board where a chip is mounted to a set, be sure that residual stress is not given to the chip due to
the overall distortion of the printed circuit board and partial distortion such as at screw tightening portions.
Self heating (temperature increase) occurs when the power is turned ON, so the tolerance should be sufficient for the set thermal
design.
Carefully lay out the coil for the circuit board design of the non-magnetic shield type.
A malfunction may occur due to magnetic interference.
Use a wrist band to discharge static electricity in your body through the grounding wire.
Do not expose the products to magnets or magnetic fields.
Do not use for a purpose outside of the contents regulated in the delivery specifications.
The products listed on this catalog are intended for use in general electronic equipment (AV equipment, telecommunications
equipment, home appliances, amusement equipment, computer equipment, personal equipment, office equipment, measurement
equipment, industrial robots) under a normal operation and use condition.
The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or
quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage to
society, person or property.
If you intend to use the products in the applications listed below or if you have special requirements exceeding the range or conditions
set forth in the each catalog, please contact us.
(1) Aerospace/Aviation equipment
(2) Transportation equipment (cars, electric trains, ships, etc.)
(3) Medical equipment
(4) Power-generation control equipment
(5) Atomic energy-related equipment
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose
applications
When designing your equipment even for general-purpose applications, you are kindly requested to take into consideration securing
protection circuit/device or providing backup circuits in your equipment.
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Product compatible with RoHS directive
Halogen-free
Compatible with lead-free solders
Inductors for High Frequency Circuits
Multilayer Ceramic
Overview of the MLG Series
FEATURES
Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for High-
frequency.
APPLICATION
Smart phones, tablet terminals, high frequency modules (PAs, VCOs, FEMs , etc.), Bluetooth, W-LAN, UWB, tuners
and other high frequency circuits for the mobile communication industry
PART NUMBER CONSTRUCTION
MLG
Series name
0603
L×W×H Dimensions
(mm)
0603
0.6×0.3×0.3
1005
1.0×0.5×0.5
1608
1.6×0.8×0.8
S
Product internal
code
B
S
0N3
Inductance
(nH)
1N1
1.1
11N
11
R10
100
1R0
1000
S
Inductance
tolerance
B
±0.1nH
C
±0.2nH
S
±0.3nH
D
±0.5nH
H
±3%
J
±5%
T
T
Packaging style
Taping
000
Internal code
000
OPERATING TEMPERATURE RANGE, PACKAGE QUANTITY, PRODUCT WEIGHT
Temperature range
Package quantity
Operating
Storage
Type
temperature
temperature
(pieces/reel)
（°C）
（°C）
MLG0603S
–55 to +125
–55 to +125
15000
MLG1005S
–55 to +125
–55 to +125
10000
MLG1608
–55 to +125
–55 to +125
4000
The Storage temperature range is for after the circuit board is mounted.
Individual weight
（mg）
0.2
1
4
RoHS Directive Compliant Product: See the following for more details related to RoHS Directive compliant products. http://www.tdk.co.jp/rohs/
Halogen-free: Indicates that Cl content is less than 900ppm, Br content is less than 900ppm, and that the total Cl and Br content is less than 1500ppm.
• All specifications are subject to change without notice.
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Overview of the MLG Series
RECOMMENDED REFLOW PROFILE
Preheating
Soldering
Peak
Natural
cooling
T4
T:
Temperature
T3
T3
T2
T1
t1
t3
t2
t:
Time
Preheating
Temp.
T1
T2
150°C
180°C
Time
t1
60 to 120s
Soldering
Temp.
Time
T3
t2
230°C
30 to 60s
Peak
Temp.
T4
250 to 260°C
Time
t3
10s max.
• All specifications are subject to change without notice.
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MLG
series
MLG0603S Type
SHAPE & DIMENSIONS
0.30±0.03
0.15±0.05
0.6±0.03
0.15±0.05
0.30±0.03
Dimensions in mm
RECOMMENDED LAND PATTERN
0.3
0.25
0.3
0.25
Dimensions in mm
• All specifications are subject to change without notice.
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