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MLX90316EDC-SPI

POSITION, ROTARY SENSOR-HALL EFFECT, -8-8mA, RECTANGULAR, SURFACE MOUNT
位置, 霍尔效应旋转传感器, -8-8mA, 矩形的, 表面贴装

器件类别:传感器   

厂商名称:ETC

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器件参数
参数名称
属性值
最大供电电压
5.5 V
最小供电电压
4.5 V
最大工作温度
125 Cel
最小工作温度
-40 Cel
加工封装描述
ROHS COMPLIANT, 塑料, SOIC-8
状态
ACTIVE
外罩
塑料
高度
1.47 mm
宽度
3.81 mm
安装特点
表面贴装
端子类型
焊接
工作电流
16 mA
包装类型
矩形的
长度或直径
4.8 mm
线性
1
输出接口类型
3-线 接口
输出范围
-8-8mA
输出类型
ANALOG 电流
响应时间
400 ms
传感器类型
HALL EFFECT
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MLX90316
Rotary Position Sensor IC
Features and Benefits
Absolute Rotary Position Sensor IC
Simple & Robust Magnetic Design
Tria⊗is™ Hall Technology
Programmable Angular Range up to 360 Degrees
Programmable Linear Transfer Characteristic
Selectable Analog (Ratiometric), PWM, Serial Protocol
12 bit Angular Resolution - 10 bit Angular Thermal Accuracy
40 bit ID Number
Single Die – SO8 Package RoHS Compliant
Dual Die (Full Redundant) – TSSOP16 Package RoHS Compliant
Applications
Absolute Rotary Position Sensor
Pedal Position Sensor
Throttle Position Sensor
Ride Height Position Sensor
Steering Wheel Position Sensor
Motor-shaft Position Sensor
Float-Level Sensor
Non-Contacting Potentiometer
Ordering Information
1
Part No.
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
MLX90316
1
2
Temperature Suffix
S (− 20°C to
+
85°C)
E (− 40°C to
+
85°C)
K (− 40°C to
+
125°C)
L (− 40°C to
+
150°C)
S (− 20°C to
+
85°C)
E (− 40°C to
+
85°C)
K (− 40°C to
+
125°C)
L (− 40°C to
+
150°C)
E (− 40°C to
+
85°C)
K (− 40°C to
+
125°C)
L (− 40°C to
+
150°C)
E (− 40°C to
+
85°C)
K (− 40°C to
+
125°C)
L (− 40°C to
+
150°C)
K (− 40°C to
+
125°C)
K (− 40°C to
+
125°C)
K (− 40°C to
+
125°C)
K (− 40°C to
+
125°C)
Package Code
DC [SOIC-8]
DC [SOIC-8]
DC [SOIC-8]
DC [SOIC-8]
GO [TSSOP-16]
GO [TSSOP-16]
GO [TSSOP-16]
GO [TSSOP-16]
DC [SOIC-8]
DC [SOIC-8]
DC [SOIC-8]
GO [TSSOP-16]
GO [TSSOP-16]
GO [TSSOP-16]
DC [SOIC-8]
GO [TSSOP-16]
DC [SOIC-8]
GO [TSSOP-16]
Option code
-
2
-
2
-
2
-
2
-
2
-
2
-
2
-
2
SPI
3
SPI
3
SPI
3
SPI
3
SPI
3
SPI
3
PPA
4
PPA
4
PPD
5
PPD
5
Example: MLX90316KDC-PPA
Fully end-user programmable version through the Melexis Programming Unit PTC-04
3
SPI Version pre-programmed and locked for 360deg rotary position application in SPI mode (High Speed). The standard version
can also be programmed in SPI but the application diagram described in section 17.4.3 is recommended.
4
Pre-Programmed Analog – 360deg angular span for an analog output between 0.5V and 4.5V, Low Speed Mode (Locked)
5
Pre-Programmed PWM – 360deg angular span, 10-90% at 1 kHz, High Speed Mode (Locked)
3901090316
Rev. 003
Page 1 of 41
Data Sheet
April 07
MLX90316
Rotary Position Sensor IC
1. Functional Diagram
DSP
Tria is
3V3
Reg
Rev.Pol.
&
OverVolt.
V
DD
Vx
Vy
D
12
14
G
-1
5
A
μC
D
A
MUX
x1
O
UT
(Analog/PWM)
RAM
EEP
ROM
S
WITCH
O
UT
V
SS
Figure 1 - Block Diagram (Analog & PWM)
ROM - F/W
DSP
Tria is
3V3
Reg
Rev.Pol.
V
DD
Vx
Vy
14
G
-1
5
A
MUX
D
μC
S
ERIAL
P
ROTOCOL
/SS
S
CLK
MOSI/MISO
RAM
EEP
ROM
V
SS
Figure 2 - Block Diagram (Serial Protocol)
ROM - F/W
3901090316
Rev. 003
Page 2 of 41
Data Sheet
April 07
MLX90316
Rotary Position Sensor IC
2. Description
The MLX90316 is a monolithic sensor IC featuring the Tria⊗is™ Hall technology. Conventional planar Hall
technology is only sensitive to the flux density applied orthogonally to the IC surface. The Tria⊗is™ Hall
sensor is also sensitive to the flux density applied parallel to the IC surface. This is obtained through an
Integrated Magneto-Concentrator (IMC®) which is deposited on the CMOS die (as an additional back-end
step).
The MLX90316 is only sensitive to the flux density coplanar with the IC surface. This allows the
MLX90316 with the correct magnetic circuit to decode the absolute rotary (angular) position from 0 to 360
Degrees. It enables the design of novel generation of non-contacting rotary position sensors that are
frequently required for both automotive and industrial applications.
In combination with the appropriate signal processing, the magnetic flux density of a small magnet
(diametral magnetization) rotating above the IC can be measured in a non-contacting way (Figure 3). The
angular information is computed from both vectorial components of the flux density (i.e. B
X
and B
Y
).
MLX90316 produces an output signal proportional to the decoded angle. The output is selectable between
Analog, PWM and Serial Protocol.
α
Figure 3 - Typical application of MLX90316
3901090316
Rev. 003
Page 3 of 41
Data Sheet
April 07
MLX90316
Rotary Position Sensor IC
TABLE of CONTENTS
FEATURES AND BENEFITS ....................................................................................................................... 1
APPLICATIONS............................................................................................................................................ 1
ORDERING INFORMATION......................................................................................................................... 1
1.
2.
3.
4.
5.
6.
7.
8.
9.
FUNCTIONAL DIAGRAM...................................................................................................................... 2
DESCRIPTION....................................................................................................................................... 3
GLOSSARY OF TERMS
ABBREVIATIONS
ACRONYMS ............................................................ 6
PINOUT.................................................................................................................................................. 6
ABSOLUTE MAXIMUM RATINGS ....................................................................................................... 7
DETAILED DESCRIPTION.................................................................................................................... 7
MLX90316 ELECTRICAL SPECIFICATION....................................................................................... 10
MLX90316 ISOLATION SPECIFICATION .......................................................................................... 12
MLX90316 TIMING SPECIFICATION ................................................................................................. 12
10. MLX90316 ACCURACY SPECIFICATION ......................................................................................... 13
11. MLX90316 MAGNETIC SPECIFICATION .......................................................................................... 14
12. MLX90316 CPU & MEMORY SPECIFICATION ................................................................................. 14
13. MLX90316 END-USER PROGRAMMABLE ITEMS ........................................................................... 15
14. DESCRIPTION OF END-USER PROGRAMMABLE ITEMS.............................................................. 16
14.1.
O
UTPUT
M
ODE
..........................................................................................................................................16
14.1.1. Analog Output Mode ............................................................................................................................16
14.1.2. PWM Output Mode...............................................................................................................................16
14.1.3. Serial Protocol Output Mode ...............................................................................................................16
14.1.4. Switch Out ............................................................................................................................................17
14.2.
O
UTPUT
T
RANSFER
C
HARACTERISTIC
.......................................................................................................18
14.2.1. CLOCKWISE Parameter......................................................................................................................18
14.2.2. Discontinuity Point (or Zero Degree Point).........................................................................................18
14.2.3. LNR Parameters ...................................................................................................................................19
14.2.4. CLAMPING Parameters ......................................................................................................................19
14.2.5. DEADZONE Parameter .......................................................................................................................19
14.3.
I
DENTIFICATION
........................................................................................................................................19
14.4.
S
ENSOR
F
RONT
-E
ND
.................................................................................................................................20
14.4.1. HIGHSPEED Parameter......................................................................................................................20
14.4.2. ARGC, AUTO_RG, RoughGain Parameters ........................................................................................20
14.4.3. RGThresL, RGThresH Parameters ......................................................................................................21
14.5.
FILTER ....................................................................................................................................................21
14.5.1. Hysteresis Filter ...................................................................................................................................21
14.5.2. FIR Filters ............................................................................................................................................21
14.5.3. IIR Filters .............................................................................................................................................23
3901090316
Rev. 003
Page 4 of 41
Data Sheet
April 07
MLX90316
Rotary Position Sensor IC
14.6.
P
ROGRAMMABLE
D
IAGNOSTIC
S
ETTINGS
.................................................................................................24
14.6.1. RESONFAULT Parameter ...................................................................................................................24
14.6.2. EEHAMHOLE Parameter ....................................................................................................................24
14.7.
L
OCK
.........................................................................................................................................................24
14.7.1. MLXLOCK Parameter .........................................................................................................................24
14.7.2. LOCK Parameter .................................................................................................................................24
15. MLX90316 SELF DIAGNOSTIC.......................................................................................................... 25
16. SERIAL PROTOCOL........................................................................................................................... 27
16.1.
I
NTRODUCTION
.........................................................................................................................................27
16.2.
SERIAL PROTOCOL M
ODE
...................................................................................................................27
16.3.
MOSI (M
ASTER
O
UT
S
LAVE
I
N
) ...............................................................................................................27
16.4.
MISO (M
ASTER
I
N
S
LAVE
O
UT
) ...............................................................................................................27
16.5.
/SS (S
LAVE
S
ELECT
) .................................................................................................................................27
16.6.
M
ASTER
S
TART
-U
P
...................................................................................................................................27
16.7.
S
LAVE
S
TART
-U
P
......................................................................................................................................27
16.8.
T
IMING
......................................................................................................................................................28
16.9.
S
LAVE
R
ESET
............................................................................................................................................29
16.10. F
RAME
L
AYER
..........................................................................................................................................29
16.10.1.
Command Device Mechanism ..........................................................................................................29
16.10.2.
Data Frame Structure ......................................................................................................................29
16.10.3.
Timing ..............................................................................................................................................29
16.10.4.
Data Structure ..................................................................................................................................30
16.10.5.
Angle Calculation.............................................................................................................................30
16.10.6.
Error Handling.................................................................................................................................30
17. RECOMMENDED APPLICATION DIAGRAMS .................................................................................. 31
17.1.
A
NALOG
O
UTPUT
W
IRING WITH THE
MLX90316
IN
SOIC P
ACKAGE
.......................................................31
17.2.
A
NALOG
O
UTPUT
W
IRING WITH THE
MLX90316
IN
TSSOP P
ACKAGE
....................................................31
17.3.
PWM L
OW
S
IDE
O
UTPUT
W
IRING
............................................................................................................32
17.4.
S
ERIAL
P
ROTOCOL
....................................................................................................................................32
17.4.1. SPI Version – Single Die ......................................................................................................................32
17.4.2. SPI Version – Dual Die ........................................................................................................................33
17.4.3. Non SPI Version (Standard Version)....................................................................................................34
18. STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS
WITH DIFFERENT SOLDERING PROCESSES ........................................................................................ 35
19. ESD PRECAUTIONS........................................................................................................................... 35
20. PACKAGE INFORMATION................................................................................................................. 36
20.1.
20.2.
20.3.
20.4.
20.5.
20.6.
SOIC8 - P
ACKAGE
D
IMENSIONS
...............................................................................................................36
SOIC8 - P
INOUT AND
M
ARKING
...............................................................................................................36
SOIC8 - IMC P
OSITIONNING
.....................................................................................................................37
TSSOP16 - P
ACKAGE
D
IMENSIONS
...........................................................................................................38
TSSOP16 - P
INOUT AND
M
ARKING
..........................................................................................................39
TSSOP16 - IMC P
OSITIONNING
................................................................................................................39
21. DISCLAIMER ....................................................................................................................................... 41
3901090316
Rev. 003
Page 5 of 41
Data Sheet
April 07
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参数对比
与MLX90316EDC-SPI相近的元器件有:MLX90316、MLX90316KDC-PPA、MLX90316KDC-SPI。描述及对比如下:
型号 MLX90316EDC-SPI MLX90316 MLX90316KDC-PPA MLX90316KDC-SPI
描述 POSITION, ROTARY SENSOR-HALL EFFECT, -8-8mA, RECTANGULAR, SURFACE MOUNT POSITION, ROTARY SENSOR-HALL EFFECT, -8-8mA, RECTANGULAR, SURFACE MOUNT POSITION, ROTARY SENSOR-HALL EFFECT, -8-8mA, RECTANGULAR, SURFACE MOUNT POSITION, ROTARY SENSOR-HALL EFFECT, -8-8mA, RECTANGULAR, SURFACE MOUNT
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 4.5 V 4.5 V 4.5 V 4.5 V
最大工作温度 125 Cel 125 Cel 125 Cel 125 Cel
最小工作温度 -40 Cel -40 Cel -40 Cel -40 Cel
加工封装描述 ROHS COMPLIANT, 塑料, SOIC-8 ROHS COMPLIANT, 塑料, SOIC-8 ROHS COMPLIANT, 塑料, SOIC-8 ROHS COMPLIANT, 塑料, SOIC-8
状态 ACTIVE ACTIVE ACTIVE ACTIVE
外罩 塑料 塑料 塑料 塑料
高度 1.47 mm 1.47 mm 1.47 mm 1.47 mm
宽度 3.81 mm 3.81 mm 3.81 mm 3.81 mm
安装特点 表面贴装 表面贴装 表面贴装 表面贴装
端子类型 焊接 焊接 焊接 焊接
工作电流 16 mA 16 mA 16 mA 16 mA
包装类型 矩形的 矩形的 矩形的 矩形的
长度或直径 4.8 mm 4.8 mm 4.8 mm 4.8 mm
线性 1 1 1 1
输出接口类型 3-线 接口 3-线 接口 3-线 接口 3-线 接口
输出范围 -8-8mA -8-8mA -8-8mA -8-8mA
输出类型 ANALOG 电流 ANALOG 电流 ANALOG 电流 ANALOG 电流
响应时间 400 ms 400 ms 400 ms 400 ms
传感器类型 HALL EFFECT HALL EFFECT HALL EFFECT HALL EFFECT
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